Glue Conveyor simplifies production-line packaging.
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Press Release Summary:
Automated, stand-alone system conveys consistent flow of thermoplastic adhesive pellets or chiclet-sized chips over distances of over 100 ft from bulk source to melter unit. Filters screen particle size of material flowing through line, minimizing foreign particle entry into melter unit. Able to feed single or multiple glue stations, it automatically responds to need for hot-melt glue using electronic instrumentation that senses, monitors, and controls process.Original Press Release:
All-Con World Systems Introduces Hot-Melt Glue Conveying System
An automated, stand-alone materials handling system that effectively conveys a consistent flow of thermoplastic adhesives to hot-melt glue melters has been designed by ALL-CON World Systems, Inc. to simplify production-line packaging applications.
The ALL-CON Hot-Melt Glue Conveying System -- a patented, proprietary, stand-alone, custom-engineered process for transporting either pellets (B-Bs) or chiclet sized adhesive chips -- now provides users with a new method to effectively transport solid hot-melt glue a distance of more than 100 feet from a bulk source to a melter unit.
It is designed to feed either a single or multiple glue stations -- all receiving material from the same container of chips. The system is totally stand-alone, which means there are no direct mechanical tie-ins or any direct electric circuitry connections to user's existing equipment.
How It Works
The ALL-CON system is designed to batch convey hot-melt adhesive, while preventing the chips from being left in the conveying line after each cycle. This eliminates the possible buildup of product in the conveying line.
The company recommends users of this system to utilize adhesive pellets with a melt temperature above 280° F, so bridging is reduced in the gaylord container and the pellets will not melt in the conveying line during the conveying process.
The system automatically responds to the melter's need for hot-melt glue using electronic instrumentation that senses, monitors and controls the process. In operation the system has two basic cycles -- convey and store the adhesive material, and discharge and route the material to the melter converging hopper.
Responding to a sensor's signal that the quantity of glue in the melter is at a low level, stored adhesive from a gaylord is automatically conveyed to the melter unit. At the end of each cycle the system is automatically purged clean -- to assure that no buildup of material remains in the system's conveying line. A filter screens unwanted particles before being discharged into the receiving hopper, which then directs the clean material to the melter.
The system is equipped with a control panel that integrates the electronic controls and displays readings from the various sensors in the system. It is compatible with most operating systems used on production lines for packaging applications.
Meeting An Industry Need
"This system was developed to meet an industry need for a reliable, self-cleaning process that automatically transports thermoplastic adhesives a much greater distance from a bulk source to a melter unit than was possible by other systems," explains Barry Slater, President of ALL-CON World Systems, Inc.
When compared to other hot-melt glue conveying systems, he says the ALL-CON system can substantially improve materials handling efficiency, and lower maintenance and downtime. It has unique design features not found in any other type system handling hot-melt adhesive chips.
System Features
The ALL-CON system has filters at various points in the conveying process to effectively screen the particle size of material flowing through the line and to minimize foreign particles, such as fines and powder, from entering the melter unit. This minimizes the risk of clogging melter nozzles -- a common problem experienced by most adhesive melting systems being used for packaging applications.
Undersized chips and fines are separated by a stainless steel filter and isolated from the material being processed. It is recommended that this filter be manually cleaned on a weekly basis.
The chips and fines are directed to an inline secondary filter, which is located on the vacuum power unit at floor level for easy servicing. The company recommends this inline filter be manually cleaned every 24 hours -- depending upon the amount of powder in the glue being conveyed.
ALL-CON World Systems, with headquarters in Seaford, DE, is a premier system integrator and manufacturer of automated, integrated bulk materials handling systems -- including major, minor and micro ingredient feeding, weighing and conveying of dry powdered and liquid ingredients -- especially for the chemical, plastic, food and packaging industries.
