Press Release Summary:
Addressing needs of flash, DRAM, and logic IC manufacturers, SPEEDÂ® Max(TM) high-density plasma (HDP) CVD platform delivers flexibility to process multiple layers and applications on one platform. Plasma source technology extends its gapfill capabilities to 32 nm node, and other features address process uniformity as well as defectivity. Available in 200 and 300 mm configurations, platform integrates ceramic dome, large volume chamber, and high vacuum pumps.
Original Press Release:
Novellus Sets New Productivity Standard for HDP CVD With Introduction of SPEED Max
Advanced Technology Features Extend Gapfill to 32nm Memory and Logic Devices
SAN JOSE, Calif., July 14 -- Novellus Systems, Inc. (NASDAQ:NVLS) today announced the introduction of SPEED(R) Max(TM), the latest enhancement to its production-proven high-density plasma (HDP) CVD platform. Designed to address the needs of customers manufacturing flash, DRAM and logic integrated circuits, SPEED Max reduces total capital expenditures due to its flexibility to process multiple layers and applications on a single platform. The system employs innovative new features and capabilities that provide productivity increases of up to 50 percent and process extendibility to the 32nm node. Hynix Semiconductor's M10 fab was able to use SPEED Max to process a number of different products without changing configuration, enabling Hynix to qualify multiple devices and applications in a very short period of time. The platform's ease of use helps improve cycle time and process transparency at Hynix M10.
"Novellus developed SPEED Max to meet the needs of chipmakers for a flexible and cost-effective gapfill solution that will extend HDP technology to future device nodes," said Kaihan Ashtiani, vice president and general manager of Novellus' Gapfill business unit. "SPEED Max enables a greater than 50 percent improvement in productivity, providing the lowest cost of ownership. In addition, SPEED Max employs an innovative plasma source technology that extends its gapfill capabilities to the 32nm node, reducing capital cost expenditures for customers as they transition to next-generation devices. The value demonstrated by SPEED Max has resulted in rapid acceptance among customers. More than 50 SPEED Max modules are in production today at fabs across the world -- a number expected to grow to more than 100 by the end of 2008."
SPEED Max combines a number of new features to achieve superior performance in process uniformity, gapfill and defectivity, resulting in demonstrated improvements in product yield. The flexibility of the SPEED Max platform also helps reduce customers' total capital costs through a 30 percent reduction in the number of tools required for a given manufacturing output, with a commensurate reduction in fab labor and floor space.
SPEED Max will be on display during SEMICON West at the Novellus exhibit in the Yerba Buena Center for the Arts, July 15-17.
The SPEED high-density plasma (HDP) system is a production-proven platform for the deposition of various high-quality silicon oxide films used in the production of integrated circuits for memory and logic devices. SPEED's unique ceramic dome, large volume chamber and high vacuum pumps have made the system the platform of choice for HDP CVD deposition in many IC manufacturing environments. SPEED is available in both 200mm and 300mm configurations.
Novellus Systems, Inc. (NASDAQ:NVLS) is a leading provider of advanced process equipment for the global semiconductor industry. The company's products deliver value to customers by providing innovative technology backed by trusted productivity. An S&P 500 company, Novellus is headquartered in San Jose, Calif. with subsidiary offices across the globe. For more information, please visit http://www.novellus.com/.
SPEED is a registered symbol and SPEED Max is a registered trademark of Novellus Systems, Inc.