ESD Protection Devices offer integrated Vcc protection.
Press Release Summary:
Models USBLC6-2P6 and USBLC6-2SC6 low capacitance ESD protection devices are available in SOT-666 and SOT-23 packages, respectively. Devices have 2.5 pF line capacitance and ensure no distortion of 480-Mbit/s USB 2.0 signal. Chips protect against ESD up to IEC61000-4-2 level 4, 15 kV standard. Units feature monolithic integration, and optimized pin-out for EMI-free board layouts. With 1 µA max leakage current they protect 10/100Mb/s Ethernet ports, mobile phone SIM cards, and video lines.
Original Press Release:
STMicroelectronics Introduces Dedicated ESD Protection
Geneva, February 28, 2006 - STMicroelectronics (NYSE: STM), a world leader in protection ICs, has introduced a low capacitance ESD protection device - available in a tiny SOT-666 package as well as in the SOT-23 - which protects the two data lines and the power rail of a USB 2.0 high-speed interface. The very low 2.5pF (typical) line capacitance of the new USBLC6-2P6 (SOT-666) and USBLC6-2SC6 (SOT-23) ensures no distortion of the 480-Mbit/s USB 2.0 signal; the chips also protect against electrostatic discharge up to the stringent IEC61000-4-2 level 4, 15kV standard.
The USBLC6 achieves the optimum trade-off between low line-to-ground capacitance, compliance with IEC61000-4-2 level 4 (air discharge up to 15kV, contact discharge up to 8kV), integrated Vcc protection, and availability in a choice of two small packages to save space in portable applications. Monolithic integration provides high device reliability, and an optimized pin-out allows EMI-free board layouts.
Leakage current is just 1µA maximum, and the USBLC6 is the first USB 2.0 protective device to be available in the SOT-666 package, which requires only 2.9mm2 of board area, making it an excellent choice for compact, portable, battery powered products. It provides full D+/D- signal balance, with the best I/O to ground matching tolerance of 0.04pF, well within the USB 2.0 maximum tolerance of 1pF.
The ESD protection of Vcc (Vbus) allows the current to flow to ground when an ESD event occurs on a data line; the data lines are protected by a rail to rail topology for highest efficiency, while Vcc protection is by clamping, for higher power capability.
The introduction of the USBLC6 reflects the increasing use of higher data rates for interfaces in computer and consumer electronics. As well as USB 2.0 and USB OTG (USB On-The-Go, the mobile device specification), it is backwards compatible with USB 1.0 and 1.1 (low and full speed), and is also ideal for protecting 10/100Mb/s Ethernet ports, mobile phone SIM cards and video lines.
The USBLC6-2P6 (SOT-666 package) and USBLC6-2SC6 (SOT-23 package) are available now in sample quantities. Pricing is US$0.20 and US$0.16, respectively, in volume quantities of a million units.
Further information is available at www.st.com/protection
About ST's Microcontroller, Linear & Discrete Group
STMicroelectronics is a world leader in offering complete system solutions that leverage its rich portfolio of Microcontroller, Linear, and Discrete products, advanced process and design technologies, and applications expertise. This emphasis on solutions allows the Company to minimize time-to-market for all customers worldwide in existing and emerging applications.
About STMicroelectronics
STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2005, the Company's net revenues were $8.88 billion and net earnings were $266 million. Further information on ST can be found at www.st.com.
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