Enclosure supports 21-slot backplanes.

Press Release Summary:

RME21 Pac-2000(TM) CoolSlot(TM) is available with 21-slot CompactPCI® PICMG 2.16, VME64x, or VME backplanes. Air deflecting card guides eliminate cooling dead spots on boards and provide uniform airflow throughout system. Air is provided by fan tray with cooling capacity of 85 W/slot. Power is provided by 1000 or 1600 W embedded power supply, or enclosure can be wired for three 600 W ac or dc hot swap power supplies. It is compatible with IEEE 1101.10/11.

Original Press Release:

New RME21 Pac-2000(TM) CoolSlot(TM) Enclosures Support 21-Slot Backplanes

Ayer, MA., Hybricon Corporation announces the release of a new line of 10U rackmount enclosures which are available with 21-slot CompactPCI® PICMG 2.16, VME64x or VME Backplanes. Hybricon's PICMG 2.16 CompactPCI® Packet Switching backplanes are compliant with the newly released PICMG 2.16 specification and provide 2 PICMG 2.16 fabric slots. The RME21 CoolSlot(TM) enclosures solve overheating problems with Hybricon's patented air deflecting CoolSlot(TM) card guides that eliminate cooling "dead spots" on boards and provide more uniform airflow throughout the system. Extensive testing, which includes thermal modeling and simulation, shows an improvement of 50% in board areas near the front panel and backplane that are blocked by the card cage structure and thus are normally deprived of airflow.

Power for the enclosure is provided by either a 1000 watt or 1600 watt embedded power supply, or the enclosure can be wired for three 600 watt AC or DC hot swap power supplies. Cooling is provided by a hot swap removable fan tray with cooling capacity of over 85 watts per slot; this is critical in order to support high performance PICMG 2.16 systems.

Additional features include:

> Fully compatible with IEEE 1101.10/11 packaging standards
> Provisions for 80mm rear plug-in modules and transition modules
in all 21 slots with no obstructions
> Front and rear ground clips provide proper grounding (per IEC
950 section 2) for all plug-in modules thereby reducing the
chances of circuit damage by electrostatic discharge
> Thermal simulation of enclosure using FLOTHERM(TM)
> Front panel power switch (DC enable)
> Optional peripheral mounting for 3 standard 5.25" peripherals,
or 2 buried hard drives

Hybricon Corporation
12 Willow Rd., Ayer, MA 01432
Fax: (978) 772-2963
E-Mail: info@hybricon.com
Website: www.hybricon.com
Contact: Sales Dept.

®CompactPCI and PICMG are registered trademarks of the PCI Industrial Computers Manufacturers Group.
(TM)CoolSlot is a trademark of Hybricon Corporation
(TM)FLOTHERM is a trademark of Flomerics, Inc.

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