Press Release Summary:
Featuring 1.98 x 2.08 mm flip-chip package, model EMIF10-LCD03F3 achieves better than -40 dB attenuation in mobile frequency range of 900 MHz to 3 GHz. It can withstand 15 kV contact discharge at inputs and outputs exceeding IEC61000-4-2 Level 4 standard. With bandwidth of 200 MHz at -3 dB, 30 pF maximum line capacitance, and 6 nsec max rise and fall times, device provides transparent EMI filtering and ESD protection for high-speed signals.
Original Press Release:
STMicroelectronics Increases Integration of Filtering and Protection, with New Flip-Chip IC Supporting 10 High-Speed Data Lines
New chip delivers significant space and cost savings in consumer application design
Geneva, October 9, 2008 - By combining EMI filtering and ESD protection for 10 high-speed signal lines in a 1.98 x 2.08 mm flip-chip package, the EMIF10-LCD03F3 from STMicroelectronics (NYSE: STM), the world's leading supplier of integrated passive and active devices (IPAD(TM)), saves up to 80% of board space and 49 components over an equivalent discrete network, and achieves higher attenuation in the stop band.
By achieving better than -40dB attenuation in the mobile frequency range 900MHz to 3GHz, the EMIF10-LCD03F3 outperforms discrete filters, delivers size and cost reductions, and enhances reliability in equipment such as cameras, cellphones, portable media players, GPS receivers, home entertainment products and digital displays. With bandwidth of 200MHz at
-3dB, 30pF maximum line capacitance, and 6ns max rise and fall times, the device provides transparent EMI filtering for high-speed signals.
The EMIF10-LCD03F3 withstands +15kV contact discharge at inputs and outputs exceeding IEC61000-4-2 Level 4, the highest safety standard for ESD protection. The device's low clamping voltage also exceeds the performance of typical discrete networks, delivering a further improvement in protection and reliability while maintaining signal integrity.
The second-order, RLC low-pass filters are fabricated using LC (inductance/capacitance) cells in ST's technology, achieving high filter performance within a smaller silicon area than existing alternatives. By implementing 10 individual second-order filters with ESD protection in a 24-bump, 0.4mm-pitch flip-chip package of 0.6mm profile, the EMIF10-LCD03F3 saves both footprint and height to enable miniaturization of ESD-sensitive equipment requiring high EMI filtering.
The EMIF10-LCD03F3 is in volume production now, and available at $0.45 for orders of 10,000 pieces.
STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2007, the Company's net revenues were $10 billion. Further information on ST can be found at www.st.com.
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