EEPROM Device suits automotive applications.

Press Release Summary:



Serial EEPROM devices cover densities from 1-64 K and are offered in 3 interface protocols: I2C, Microwire, and SPI. Devices are fabricated on 0.35 micron process technology at SMIC. Units suit automotive temperature range of -40 to +125°C, reduce standby power by 25%, and increase maximum speed for SPI devices to 10 MHz. Applications include remote control door locks, power seats and mirrors with memory, radios, odometers, and alarm systems.



Original Press Release:



ISSI Announces a Complete Line of Serial EEPROMs for the Automotive Market



RoHS Compliant versions

SANTA CLARA, Calif., Nov. 29 -- Integrated Silicon Solution, Inc. (NASDAQ:ISSI), a leader in advanced memory solutions, today announced a complete line of serial EEPROM devices for the automotive market. This new product offering covers densities from 1K to 64K and is offered in all three popular interface protocols: I2C, Microwire and SPI. These newly designed devices are fabricated on 0.35 micron process technology at SMIC. In addition to the automotive temperature range of -40 to +125 C, this new technology reduces standby power by 25% and increases the maximum speed for the SPI devices to 10Mhz.

These devices are widely used in a broad range of automotive applications where unique or user defined codes need to be stored. Applications include remote control door locks, power seats and mirrors with memory, radios, odometers, and alarm systems.

"These new designs, using advanced EEPROM process technology, allow for long term support for these EEPROM devices and demonstrate ISSI's commitment to the automotive market," said Sanjiv Asthana, vice president of sales and marketing for ISSI.

Operating from 2.5V to 5.5V, ISSI's new EEPROMs are available in 1K, 2K, 4K, 8K and 16K densities. The I2C and SPI devices are also offered in 32K and 64K densities.

Packaging and Availability

These automotive grade EEPROMs are available in 150 mil JEDEC 8-pin SOIC, 8-pin TSSOP, and 8-pin DIP packages. RoHS compliant versions are available. Samples of the 2K, 4K, 8K, and 16K can be requested now. Samples of the 1K, 32K and 64K devices will be available in Q2 of 2005.

About the Company

ISSI is a fabless semiconductor company that designs and markets high performance integrated circuits for the following key markets: (i) digital consumer electronics, (ii) networking, (iii) mobile communications and (iv) automotive electronics. The Company's primary products are high speed and low power SRAM and low and medium density DRAM. The Company also designs and markets EEPROM, SmartCards and is developing selected non-memory products focused on its key markets. ISSI is headquartered in Silicon Valley with worldwide offices in China, Europe, Hong Kong, India, Korea and Taiwan. Visit our web site at www.issi.com.

Source: Integrated Silicon Solution, Inc.

CONTACT: Charles McLaren, +1-408-969-4601 or cmclaren@issi.com, or Tom Doczy, +1-408-969-4620 or tdoczy@issi.com, both of Integrated Silicon Solution, Inc.; or Larry Hayes of Hayes Marketing, +1-408-871-0135 or larry@hayesmktg.com, for Integrated Silicon Solution, Inc.

Web site: www.issi.com/

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