Edgeboard Connector requires no adhesive.

Press Release Summary:




MCX E-Snap(TM) LP has small protrusions inside slot, allowing connector to securely snap into previously solder-pasted hole as it is slid onto board. Subminiature unit occupies only 2.7 mm above, and 1.06 mm below board. It features straight-through contact design, 50 ohm impedance, and repeatable performance to 18 GHz. Connector is suited for dense packaging arrangements and may be specified for use in wireless applications.



Original Press Release:



Bomar Expands E-Snap(TM) Edgeboard RF Connector Series to Include Low Profile MCX Devices



Ledgewood, NJ, October 27, 2002...Bomar Interconnect Products, Inc., announced the addition of a low profile MCX connector to their E-Snap(TM) Series of edgeboard connectors, the MCX E-Snap LP. Engineered for use together with PCMICA cards, and for employment in wireless applications, it, along with the entire E-Snap Series, incorporates a proprietary design to ensure exceptional board retention and RF performance without the use of an adhesive. E-Snaps feature small protrusions inside their slot, allowing connectors to securely "snap" into previously solder-pasted holes as they're slid onto the PCB. This unique ability to lock firmly in place for re-flow soldering drastically reduces strain on the solder joint, and provides the industry's most durable mount to the PC board. In utilizing the Series, EOEMs benefit from the utmost in throughput and cost efficiencies, as the time and expense associated with applying an adhesive is eliminated.

Boasting the lowest available profiie of any MCX connector, the MCX E-Snap LP occupies only 2.7 mm above, and 1.06 mm below the PCB. It is therefore ideally suited for dense packaging arrangements in applications where mechanical strength, high
durability, high reliability, and low VSWR are required. The connector accordingly may be confidently specified for use in an extensive array of such wireless applications as Global Positioning Systems (GPS), cellular telephone, data telemetry, and automotive.

Bomar's new subminiature devices, along with the entire E-Snap Series including connectors with SMB and SMC interfaces, meet or exceed all industry mechanical, electrical and environmental standards. They further feature a straight-through contact
design to ensure reliability, a 50-ohm impedance, and provide repeatable performance to 18 GHz. Their superior quality is moreover evidenced by gold plated contacts. Connectors may be ordered in male or female versions, are available in a variety of
configurations, and offered in a wide range of standard- and custom-plating alternatives to optimize engineers' design flexibility.

Prices for the MCX E-Snap LP start at $1.74 each in quantities of 10,000. Delivery is 10 weeks from customers' approval of specifications.

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