Press Release Summary:
Accepting .062 and .093 in. thick cards, BEC5 Series High Density Edge Card Socket has 2 levels of contacts that are staggered on .0394 in. centerline, which creates .0197 in. pitch. Durable contacts provide optimal impedance control and minimized broadside coupling. Welds tabs, alignment pins, and lead-free solder charge terminations are also included. Product is available with 60, 80, 100, 120, 140, 160, 180, and 200 positions and with pick-n-place and tape-n-reel packaging.
Original Press Release:
Samtec Product Update - HD Edge Card - BEC5
Samtec has expanded its line of high speed edge card solutions to include a new high density socket featuring a bi-level mating design. Two levels of contacts are staggered on 1mm (.0394") centerline which creates a card effective 0.5mm (.0197") pitch. The BEC5 Series High Density Edge Card Socket is ideal for high speed applications benefiting from its rugged Edge Rate(TM) contacts. Samtec's Edge Rate Contacts are designed for superior impedance control and reduced broadside coupling with increased durability and cycle life.
Other features of the BECS Series include:
o.5mm (.0197") pitch
oRugged Edge Rate(TM) contacts for improved signal integrity performance
oAccepts standard 1.60mm (.062") and 2.40mm (.093") thick cards
oAvailable with 60, 80, 100, 120, 140, 160, 180 and 200 positions
oWelds tabs, alignment pins and lead-free solder charge terminations for easy board processing
oSelective gold plating
oPick-n-place pad and tape-n-reel packaging as standard
oTin-lead solder charges, alternative plating and pin counts also available
Two levels of contacts, staggered on 1mm centerline, create a card effective .5mm pitch.
Copyright © Samtec, Inc.