Press Release Summary:
Available in 200 and 300 mm versions, RapidStrip(TM) 320 resist and polymer removal system uses downstream, microwave plasma generation and chuck-based, wafer heating to provide dry strip process. Small process vacuum chambers enable high ash rates. Suited for front-end-of-line applications, RapidStrip platform offers single and dual process-chamber configurations.
Original Press Release:
Axcelis Launches Rapidstrip(TM) Dry Strip Product
New 300mm platform delivers speed, efficiency for high-volume resist strip applications
BEVERLY, Mass. - December 2, 2003 - In a move that makes one of the most efficient and cost-effective photoresist strip systems available to chipmakers worldwide, Axcelis Technologies, Inc. (NASDAQ: ACLS) has introduced the new RapidStrip(TM) 320 resist and polymer removal system. The latest addition to Axcelis' complete family of dry strip products, RapidStrip has been specifically designed to reduce cost-of-ownership and improve productivity for high-volume, 300mm front-end-of-line (FEOL) process applications.
"With the RapidStrip 320, customers can achieve high throughput and reliability with a very simple and efficient tool," said Dr. Jan-Paul van Maaren, vice president and general manager of Axcelis Curing and Cleaning Systems. "The RapidStrip platform provides high productivity and process flexibility in a very small package that doesn't waste valuable cleanroom space. This product offering enables us to gain additional market share, moving us one step closer to our goal of being the number two dry strip supplier by 2005."
The RapidStrip product rounds out the company's full line of dry strip products for front-end-of line (FEOL) and back-end-of-line (BEOL) process applications. Available in 200mm and 300mm versions, the RapidStrip products are based on a simple, compact design that provides exceptionally low cost of ownership with levels of productivity and reliability that are essential for low-cost semiconductor manufacturing.
The RapidStrip systems use downstream microwave plasma generation and chuck-based wafer heating to provide an effective dry strip process. Small process vacuum chambers enable high ash rates and excellent process repeatability. The smart design also boasts the industry's smallest footprint coupled with easy service access. The RapidStrip platform is available in single and dual process-chamber configurations, giving customers the flexibility to add incremental capacity.
RapidStrip is the first new product to result from Axcelis' acquisition of Matrix Integrated Systems earlier this year. As with Axcelis' entire dry strip family of tools, RapidStrip is backed by the company's award-winning customer service and support, as well as the technical expertise of Axcelis' team of scientists and engineers, who continue to explore innovative technologies for stripping and cleaning advanced semiconductor materials and device structures.
About Axcelis Technologies, Inc.
Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing, and cleaning and curing systems. Axcelis Technologies has key technology centers in Beverly, Massachusetts, and Rockville, Maryland as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.