Press Release Summary:
Exhibiting less than 30 pH ESL and tested to MIL-PRF-123, LICAÂ® Series offers advanced decoupling solutions for military and aerospace applications, including high-pin-count FPGAs, ASICs, CPUs, and other high-power ICs with low operating voltages. Utilizing up to 4 separate capacitor sections in single ceramic case, arrays feature low resistance platinum electrodes, double electrode pickup, and perpendicular current paths. Components are rated for 25 V and temperatures from -55 to 125Â°C.
Original Press Release:
LICA® Series Low Inductance Decoupling Capacitor Arrays from AVX are Ideal for Hi-Rel Mil/Aero Applications
Exhibiting less than 30pH ESL & tested to MIL-PRF-123, AVX’s high-reliability LICA Series capacitors provide the lowest inductance decoupling solutions in the mil/aero marketplace
GREENVILLE, S.C. -- AVX Corporation, a leading manufacturer of advanced passive components and interconnect solutions, has expanded the applications for its LICA® Series low inductance decoupling capacitor arrays. Widely utilized in commercial and industrial five nines (99.999%) uptime applications, such as mainframe class CPUs and ultimate performance multichip modules and communications systems, LICA Series low inductance decoupling capacitor arrays tested to MIL-PRF-123 also provide high-reliability and extremely low inductance advanced decoupling solutions for a variety of military and aerospace applications, including high-pin-count FPGAs, ASICs, CPUs, and other high power, high performance ICs with low operating voltages.
Exhibiting less than 30pH ESL, which is currently the lowest ESL rating in the mil/aero market, AVX's LICA Series includes several low inductance design features. Utilizing up to four separate capacitor sections in a single ceramic case, LICA Series arrays feature low resistance platinum electrodes in a low aspect ratio pattern, double electrode pickup, and perpendicular current paths. The series is also the only product in the mil/aero market to feature C4 solder ball terminations, which enable minimal interconnect inductance and are the perfect complement to flip-chip packaging technology.
"LICA Series low inductance capacitor arrays have several design features and performance benefits that are unique to the mil/aero market. In addition to their being the only mil-qualified capacitors to utilize low-inductance C4 solder ball terminations, LICA arrays exhibit the lowest ESL of any comparable product in the market, earning them a reputation as the most advanced, highest-reliability decoupling solution currently available in the mil/aero market, according to early adopters of the technology who are currently utilizing the series in space," said Mark Obuszewski, business manager at AVX.
LICA Series components qualified to MIL-PRF-123 are rated for 25V and -55°C to 125°C, reach peak capacitance at 55°C, and measure 1.85mm x 1.6mm x one of four height options: 0.65mm, 0.875mm, 1.10mm, and 1.60mm.
For more information about LICA® Series low inductance decoupling capacitor arrays, including standard and COTS plus components, please visit http://avx.com/docs/Catalogs/licarray.pdf to access the catalog descriptions and datasheet.
Typical lead time for the LICA® Series is approximately 12-14 weeks.
For additional information, please visit www.avx.com, call 864-967-2150, or write to One AVX Boulevard, Fountain Inn, S.C. 29644.
AVX Corporation is a leading international supplier of electronic passive components and interconnect solutions with 26 manufacturing and customer support facilities in 15 countries around the world. AVX offers a broad range of devices including capacitors, resistors, filters, timing and circuit protection devices and connectors. The company is publicly traded on the New York Stock Exchange (NYSE:AVX).