DDR3 Memory Controller Interface targets consumer electronics.

Press Release Summary:



Housed in wire bond package, DDR3 Memory Controller Interface Solution operates at data rate of 1,866 MT/s and is supplied as PHY development package, which allows designers to customize DDR3 implementation. Unit features output driver calibration, FlexPhase(TM) circuits to optimize memory system timing, and on-die termination calibration for optimized signaling environment.



Original Press Release:



Rambus Introduces High-Performance DDR3 Memory Controller Interface Solution for Consumer Electronics



Demonstrates operation at 1866MT/s in low-cost wire bond package

LOS ALTOS, CALIFORNIA, UNITED STATES -Rambus Inc. (NASDAQ: RMBS), one of the world's premier technology licensing companies, today announced a high-performance, low-cost DDR3 memory controller interface solution tailored for consumer electronics. Rambus' DDR3 solution is the first to demonstrate operation in working silicon at a data rate of 1866 megatransfers per second (MT/s) in a low-cost wire bond package. Rambus will demonstrate this technology during the Denali MemCon 2010 conference, at the Hyatt Regency Santa Clara, in Santa Clara, CA. https://www.denali.com/en/memcon/2010

Rambus offers its DDR3 memory controller interface solution to its licensees as a PHY development package (PDP) which allows memory interface designers to customize their DDR3 implementation for their specific application. Rambus' DDR3 interface solution PDP includes all the necessary building blocks, PHY architecture, schematics, models, generic layout, floor plan, verification IP, implementation documentation, testing documentation, design scripts and simulation files, to ensure design success.

"Our licensees benefit from Rambus' patented innovations and leading design expertise in a silicon-proven DDR3 interface solution they can customize to their needs," said Sharon Holt, senior vice president of Licensing and Marketing at Rambus. "This high-performance DDR3 solution tailored for wire bond packaging is ideally suited for a broad range of consumer electronics including next-generation HDTVs, digital set-top boxes and Blu-ray players and recorders."

The DDR3 interface solution builds on Rambus innovations such as:

o FlexPhase(TM) circuits for optimum memory system timing

o Output driver calibration which supports high data rates and improved system voltage margin

o On-die termination calibration for improved signaling environment

o LabStation(TM) software for rapid bring-up, characterization and validation

Rambus also offers its licensees engineering services such as package design, system board layout, statistically based signal and power integrity analysis, reference guidelines, and bring-up assistance. These services improve time-to-market, support robust operation and high yield in mass production. With over two decades of experience in high-speed design, Rambus is the leader in providing total system solutions for performance memory systems.

About Rambus Inc.

Rambus is one of the world's premier technology licensing companies. Founded in 1990, the Company specializes in the invention and design of architectures focused on enhancing the end-user experience of electronic systems. Rambus' patented innovations and breakthrough technologies help industry-leading companies bring superior products to market. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, Ohio, India, Germany, Japan, and Taiwan. Additional information is available at www.rambus.com.

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