Curing Oven provides precise thermal control.
Press Release Summary:
Available in versions that accommodate 8 cassettes of 150 mm wafers and 6 cassettes of 200 mm wafers, Polyimide Curing Tool features chamber-in-a-chamber design that reduces particulate contamination and oxygen concentration. It maintains temperature uniformity of ±2.5°C at 400°C and has inert atmosphere design that promotes material adhesion. With ramp rates of 5°C per minute heating and 2.5°C cooling, unit has controller that can store multiple recipes.
Original Press Release:
New Despatch Polyimide Curing Tool Improves Wafer Yields and Increases Production Throughput
MINNEAPOLIS (Aug. 1, 2003) - For increased productivity and throughput in electronic device- and wafer-level packaging applications, the double chamber design of the new Despatch Polyimide Curing Tool ensures tight control of process parameters. Available in versions to accommodate 150mm and 200mm wafers, the oven features a unique "chamber in a chamber" design that reduces particulate contamination and oxygen concentration, while maintaining tight temperature uniformity (plus/minus 2.5C° at 400°C).
The oven injects filtered nitrogen into the curing chamber, which flows down and completely surrounds the wafers to provide uniform distribution of heat and superior gas efficiency and atmosphere purity. The ultra low particulate count and precise thermal control of the oven provides consistent process results and improved yields.
"As each wafer's value continues to rise dramatically, the challenge to increase process yields becomes greater," said Hans Melgaard, Vice President, Despatch Industries. "The proven inert atmosphere design of the Despatch Polyimide Curing Tool ensures excellent material adhesion and uniformity over large substrate areas, which helps improve wafer quality, consistency and throughput."
The oven's fast ramp rates (5 C° per minute heating and 2.5 C° cooling) help speed processing times and reduce per wafer processing costs. The tool offers 8-cassette capacity of 150mm wafers, and 6-cassette capacity of 200mm wafers. The oven's controller allows users to store multiple recipes.
About Despatch Industries
Despatch Industries, which is closely held, was founded in 1902. Through its two brands, Despatch and Ransco, the company specializes in the design and manufacture of thermal heating and cooling applications for a number of industries, including semiconductors, electronic components, pharmaceuticals, aerospace, automotive and industrial materials. Together, Despatch and Ransco serve more than 350 of the Fortune 500 manufacturing companies worldwide. Learn more about Despatch and Ransco thermal processing products at www.despatch.com and www.ransco.com.
For more information, contact:
Despatch Industries
8860 207th Street West
Lakeville MN 55044
Phone: 1-800-828-9903
info@despatch.com
