Press Release Summary:
VacuNest securely fixtures double-sided circuit board assemblies up to 450 x 450 mm for printing, dispensing, and component placement. Shape memory board support system combines advantages of machined dedicated tooling fixtures and programmable pin designs, spreading support forces over board. Anti-static chamber, which contains foam former surrounded by polymer granules, can be profiled to match contours of differently populated board undersides.
Original Press Release:
VacuNest Solves Large Area Challenges with Conformal Substrate Support Technology
Electronics assembly process specialist Novatec has continued its trend of innovation with the latest evolution of the popular VacuNest shape memory board support system. Now, in addition to meeting the challenges of securely fixturing double-sided circuit board assemblies for printing, dispensing and component placement, VacuNest also delivers a next-generation solution for large area products such as backplane applications.
Ideal for large board products up to 450mm x 450mm such as advanced technology backplanes, solar and fuel cell panels and multiple substrate printing, VacuNest is designed to eliminate the problems associated with conventional dedicated or programmable pin tooling systems. Optimising manufacturing productivity and eliminating component damage, the Shape Memory Tooling technology combines the advantages of machined, dedicated tooling fixtures and programmable pin designs in an easy-to-use system. Spreading support forces over the board, VacuNest ensures precise and flexible support in a wide range of environments.
"The latest large board VacuNest configuration is an important development for manufacturers working with large board products - who, like any other manufacturer in today's critical electronics assembly industry, cannot afford to compromise on manufacturing productivity," explains founder and General Manager Clement Kaiser. "Where existing systems can be costly and unreliable, often forcing component damage, VacuNest delivers repeatable, secure support for large board products - without exception. At Novatec, we're constantly looking ahead to future-proof our customers' processes and the latest VacuNest configuration does exactly this."
Each VacuNest module consists of a pliable, anti-static chamber containing a foam former surrounded by polymer granules. The chamber can be rapidly profiled to match the contours of different populated board undersides. Under vacuum, that profile can be locked into place indefinitely without shrinkage. By releasing the vacuum, manufacturers can reset the nest as an elastic material brings the pliable anti-static chamber back to its original position. Available in a range of modular sizes and configurations, VacuNest is proven in use on a variety of printing, dispensing and pick and place technologies.
Novatec EAP is a research company that develops new technologies for the electronic assembly industry. Founded in 1995 Novatec has patented and licensed numerous renowned inventions, including the ProFlow and RheoPump enclosed print heads, Varidot/PumpPrint adhesive imaging and direct sphere transfer process for ball grid array manufacturing.
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