Press Release Summary:
With 1.22 mm profile, IT11 Series single-mold compression connector provides second source for cStack™ and cLGAÂ® products from Amphenol Intercon Systems. Signal integrity is optimized with 6Â x 25 pin grid configuration, and standard 150- and 210-position versions have respective contact pitches of 1 and 1.27 mm. Custom positions are also available with pin counts up to 3,000+. Design uses C-shaped spring contacts with self-aligning centering feature and pin tips contained in housing.
Original Press Release:
Hirose's High-Speed Compression Connector is a Licensed Second Source for Amphenol's Cstack(TM) and Clga® Product Family
With a stacking height of only 1.22mm, the IT11 Series compression connector offers transmission speeds of more than 28 Gbps
SIMI VALLEY, CA – Hirose, a leader in the development of innovative connector solutions, has launched a high-speed 28+ Gbps single mold compression connector that features a low-profile design with a height of only 1.22mm. The IT11 Series is a licensed second source for the cStack™ and cLGA® (Compression Land Grid Array) product families from Amphenol Intercon Systems. Hirose’s IT11 Series is fully interchangeable with cStack™ assemblies.
Optimizing signal integrity, the IT11 Series compression connector series utilizes a basic 6 X 25 pin grid configuration. The standard 150- and 210-position versions have contact pitches of 1mm and 1.27mm respectively. Custom positions are also available with pin counts up to 3000+ to provide design flexibility and meet high-speed data transmission rate requirements.
The IT11 Series is ideal for use in servers for direct attachment of integrated circuits directly to the motherboard such as processors and microprocessors, and also for direct attachment of PCBs with ASIC chips. This allows connection without soldering. The IT11 Series can also be used in a flexible printed circuit (FPC) connection configuration.
Hirose’s compression connector uses C-shaped spring contacts that provide several design advantages. The C-spring contact structure has a self-aligning centering feature that allows the contact to float while remaining intact in the housing, and the pin tips are contained in the housing, which reduces the chance of snagged or bent pins. In addition, the pins wipe across the mating pad when compressed. The connector also has holes for guide pins that ensure correct mounting placement. Several IT11 Series compression connectors can be configured on the same board.
"Our new IT11 Series compression connector combines high transmission speeds with a low-profile to give engineers the best of both worlds," said Tom Matsuo, General Manager of the High Speed Business Unit for Hirose Electric USA. "The ability to directly connect integrated chips to the motherboard without soldering greatly simplifies the assembly process. Hirose has developed a wide selection of styles and configurations to provide design flexibility and to meet most any application requirements."
The connector is well suited for aerospace, automotive, data com, LGA chip sockets, medical equipment and medical devices, mobile electronic devices, server applications and more.
The IT11 Series connector has a rated current of 0.5A per pin, rated voltage of 50V AC, a contact resistance of 20 m ohms maximum (initial), an insulation resistance of 500V DC; and an operating temperature of -55 degrees C to +85 degrees C.
For additional information about the IT11 Series connectors, please visit: http://hrs.hiroseusa.com/NPI_w_images/IT11_NPI.pdf.
ABOUT HIROSE ELECTRIC
Hirose Electric Co., Ltd. is a leading global supplier of innovative interconnects, with sales of over $1 billion to customers worldwide. Hirose employs advanced engineering services, superior customer support and worldwide manufacturing capabilities to provide value-based connector solutions for various industries including: industrial, telecommunication, consumer electronics, computer and automotive. More information can be found on Hirose Electric’s corporate website at www.hirose.com.
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