Press Release Summary:
Designed for elevated temperature evaluations and R&D studies, Series 4007B comes in measuring ranges of 0-5 bar and 0-20 bar absolute from -40 to 200Â°C. It is 21 mm long and 6.2 mm in dia with integral cable, and has piezoresistive measuring element that measures static and dynamic events with high dynamic response. Available in a number of forms, including PiezoSmartÂ® compatible with IEEE1451.4 TEDS standard, compact unit offers low sensitivity to acceleration and thermal error.
Original Press Release:
Pressure Sensor Is Compact
Amherst, NY (July 14, 2008) - A new pressure sensor from Kistler Instrument, series 4007B, is designed for elevated temperature evaluations and R & D studies in harsh environments where space is a consideration. Available in measuring ranges of 0 to 5 bar and 0 to 20 bar absolute at from -40 to 200 °C, the sensor is 21 mm long and 6.2 mm in diameter with integral cable. Using direct chip exposure (DCE) design, no diaphragm is used. A piezoresistive measuring element measures static and dynamic events with excellent dynamic response. The sensing element relies on an implanted resistive bridge on micro-machined silicon which minimizes hysteresis and repeatability errors. Other performance enhancements include a wide bandwidth improved by digital characterization techniques. The 4007B sensor has low sensitivity to acceleration and thermal error.
The series is available in a number of forms, including PiezoSmart® compatible with IEEE1451.4 TEDS standard. When used with Kistler amplifier series 4665, 0 to10 V or 4 to 20 mA outputs are available. An M5X0.5 mounting is required. Toughly constructed for intensive testing, the body is of 17-4 PH stainless steel. While especially suited for automotive intake/exhaust manifold pressure measurements, engine oil/fuel pressure studies and hydraulic test applications are no challenge for this tiny instrument.
Kistler is a worldwide supplier of precision instrumentation for the measurement of pressure, force and acceleration serving the R&D, Industrial and OEM Communities.