CommAgility AMC Incorporates Texas Instruments' Eight-core DSP for High-performance Applications
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TI's new TMS320C6678 DSP combined with flexible, powerful I/O and fast Xilinx FPGA
Loughborough, UK - CommAgility announced today the AMC-2C6678, its latest AdvancedMC module, which includes two high-performance TMS320C6678 digital signal processors (DSPs) from Texas Instruments Incorporated (TI). The module also includes a Xilinx LX240T Virtex-6TM FPGA for additional I/O and co-processing flexibility.
The Advanced Mezzanine Card module takes the industry-leading power of TI's eight-core DSP and adds high-speed, flexible I/O to deliver solutions for high-performance DSP applications including satellite communications, video processing and wireless infrastructure.
The TMS320C6678 is based on TI's KeyStone multicore architecture. It integrates eight TMS320C66x advanced processing cores with fixed and floating point capability running at 1.0 to 1.25GHz. The TMS320C66x delivers exceptional performance of up to 320 GMACS and 160 GFLOPs on a single device.
A range of high speed I/O options is provided. Serial RapidIO (SRIO) V2.1 at speeds of up to 20Gbps per port is supported by an IDT CPS-1848 SRIO Gen2 switch and the module includes a Gigabit Ethernet interface.
As standard, three front panel SFP+ optical interfaces to the FPGA are fitted. The optical interfaces offer flexible high-speed links, and are configurable as CPRI, OBSAI, Gigabit Ethernet, SRIO or other standards. Alternatively, dual mini-SAS connectors to the SRIO switch and the FPGA's GTX ports offer up to 40Gbps of front panel I/O.
Edward Young, managing director at CommAgility, said, "With the AMC-2C6678, CommAgility is harnessing the power of TI's latest C66x multi-core DSP to create a high performance signal processing product for a wide range of demanding applications."
The AMC-2C6678 provides up to 1Gbyte of 64-bit wide DDR3-1600 SDRAM for each DSP. The FPGA has two banks of DDR3 SDRAM: 256Mbytes of 32-bit wide and 128Mbytes of 16-bit wide memory. 128Mbytes of Flash memory is also provided for non-volatile storage of multiple FPGA configurations and DSP and FPGA software. CommAgility glue logic provides board control and FPGA configuration via local SPI interfaces or over SRIO, leaving the main FPGA completely free for customer application code. Full Board Support Libraries are also provided to speed customer application development.
The new module is a single-width full-size PICMG AMC.0 R2.0 Advanced Mezzanine Cards (AMC), and is tested to work with industry standard MicroTCA chassis. It can also operate standalone, with suitable power and cooling. Further customisation is possible in volume, to enable the best technical and commercial fit to a customer application to be achieved. For more information, see www.commagility.com.
The AMC-2C6678 will be sampling in June 2011. For pricing information, please contact CommAgility.
About the Texas Instruments Developer Network:
CommAgility is a member of the TI Developer Network, a community of respected, well-established companies offering products and services based on TI analog and digital technology. The Network provides a broad range of end-equipment solutions, embedded software, engineering services and development tools that help customers accelerate innovation to make the world smarter, healthier, safer, greener and more fun. http://www.ti.com/dspdevnetwork
About CommAgility:
CommAgility is a leading manufacturer of signal processing AMC modules for wireless baseband applications, combining flexible CPRI/OBSAI antenna interfaces, the latest TI DSPs and Xilinx FPGAs, and high bandwidth on and off-card communications using Serial RapidIO and Ethernet. Customers around the world use CommAgility products to develop high performance applications in both wireless and non-wireless spaces, and recent designs include test equipment, trial systems and base stations for a wide range of wireless standards especially WiMAX, LTE and LTE Advanced.
Website: www.commagility.com
Contact: sales@commagility.com
Tel: +44 1509 228866
Press contact:
Nick Daines
Email: nick@lumenpr.com
Tel: +44 (0)115 8412109
Mobile: +44 (0)7958 534731
