Cluster Node delivers 8- and 16-way POWER5+ system planars.
Press Release Summary:
In 2U form factor, IBM System p5(TM) 575 includes 16-core, 1.9 GHz and 8-core, 2.2 GHz POWER5+(TM) planars that use 64-bit, copper-based POWER5+ microprocessors. Each node is supported by 288 MB of Level 3 cache and 64 memory DIMM slots with point-to-point, memory-to-processor connections. With optional system I/O drawer and I/O assembly with PCI-X and RIO-2, up to 24 PCI-X cards and eighteen 15,000 rpm disk drives per node are available.
Original Press Release:
IBM System p5 575 Delivers Faster 16-way and 8-way IBM POWER5+ System Planars
At a glance
IBM System p5 575 includes:
16-core 1.9 GHz and 8-core 2.2 GHz POWER5+ planars
Both 8-way and 16-way POWER5 and POWER5+ planars that may coexist within a p5-575 rack configuration
Door Kits with Rear Door Heat Exchanger for the IBM 9118 and 9119 CEC racks:
Are designed to allow adding computer capacity without the cost of additional HVAC infrastructure
Are an ideal solution for computer room "hot spots"
Connects to customer-supplied water within IBM specifications
For ordering, contact:
Your IBM representative, an IBM Business Partner, or IBM Americas Call Centers at 800-IBM-CALL (Reference: YE001).
Overview
The IBM System p5(TM) 575 (9118-575), available with 16-core 1.9 GHz and 8-core 2.2 GHz POWER5+(TM) system planars, will allow configurations of 16-core 1.9 GHz and 8-core 2.2 GHz POWER5+ p5-575 cluster nodes - ideal for many high-performance computing (HPC) applications.
The POWER5+ planars use innovative, 64-bit, copper-based POWER5+ microprocessors in both 8-core and 16-core configurations. Each 8 or 16-core node is supported by 288 MB of Level 3 cache and 64 memory DIMM slots with point-to-point, memory-to-processor connections. The p5-575 POWER5+ memory sizes are offered from 2 GB up to 256 GB, utilizing DDR2 memory DIMMS. With the optional I/O Assembly with PCI-X and RIO-2, and a system I/O drawer, up to twenty-four PCI-X cards and up to eighteen 15,000 rpm disk drives per node are available. Eight-core and 16-core POWER5+ planars may coexist with POWER5(TM) planars within a p5-575 rack configuration.
The systems are packaged in the standard p5-575 2U form factor, with up to 12 nodes installed in a 42U-tall, 24-inch rack. Multiple racks of p5-575 nodes may be combined to provide a broad range of powerful cluster solutions. Up to 128 p5-575 nodes can be clustered together for a total of 2,048 processors.
Other available p5-575 features include:
An integrated service processor
Two dual 10/100/1000 Ethernet ports per node
Two HMC ports per node
Dual-ported Ultra3 SCSI controller
Optional battery backup for the rack
DLPAR with optional Advanced POWER(TM) Virtualization
The Door Kits with Rear Door Heat Exchangers (#6857 on the 9118-575 and #6859 on the 9119-590 and 9119-595) help increase server density without increasing cooling requirements. Designed to fit easily on to the IBM 9118 and 9119 CEC racks, the new features will help customers whose data centers have reached the limits of cooling capacity, but still have space to add racks of systems.
The heat exchanger is a more cost effective solution than adding another air conditioning unit, and features:
A water-cooled heat exchanger door designed to dissipate heat generated from the back of your computer systems before it enters the room
An easy to mount rear door design that attaches to customer-supplied water, using industry-standard fittings and couplings
Up to 15 kW (or approximately 50,000 BTUs/hr) of heat that can be removed from air exiting the back of a rack full of servers
Key prerequisites
One or more of the following operating systems:
AIX 5L(TM) for POWER V5.2 with the 5200-04 Technology Level, or later
AIX 5L for POWER V5.3, or later
SUSE Linux(TM) Enterprise Server 9 for POWER systems, or later
Red Hat Enterprise Linux AS 4 for POWER, or later
Planned availability date
February 24, 2006
