CAE Software offers 3-D simulation, modeling, and meshing.

Press Release Summary:



Moldflow Plastics Insight(TM) v4.0 provides in-depth simulations required to optimize part and mold design for injection molded parts. It can predict warped shape of molded part and analyze 2-shot sequential and insert overmolding processes. Application Programming Interface allows user to automate common tasks, customize user interface, and interface with 3rd party software applications. Material Intelligence Tools allow user to identify material most suitable for design.



Original Press Release:



Moldflow Extends the Problem Solving Capabilities of Moldflow Plastics Insight With Release of Version 4.0



Advances in 3-D simulation, extensibility, connectivity, modeling, materials and meshing confirms Moldflow as the world leader for plastics CAE

WAYLAND, Mass.--Dec. 4, 2002--Moldflow Corporation (NASDAQ: MFLO), the world's leading provider of software products and services for optimizing the design and manufacture of injection-molded plastic products, today announced the release Moldflow Plastics Insight(TM) (MPI(TM)) 4.0. Used by thousands of plastics engineers around the world, Moldflow Plastics Insight is the industry-leading product for the in-depth simulations required to optimize part and mold design for injection molded plastics.

Ken Welch, Moldflow's executive vice president of marketing and field services, says, "MPI 4.0 contains significant product improvements to help our customers identify and solve problems faster and streamline their design-to-manufacturing process. This release confirms MPI as the world's leading predictive analysis tool that addresses the broadest range of manufacturing issues and design geometry types associated with plastics molding processes."

Due to begin shipping to customers on December 16, MPI 4.0 features hundreds of user driven enhancements designed to help make plastics engineers more productive and their companies more competitive in the markets they serve. Some of these new product improvements include:

o Significant Advancements in MPI/3D Technology. Extending
Moldflow's lead in 3D simulation technology, the new capabilities in MPI 4.0 include the ability to predict the warped shaped of a molded part, the ability to analyze the 2-shot sequential and insert overmolding processes, and the extension of MPI/3D to include the Microchip and Underfill Encapsulation processes. These enhancements extend the scope of MPI's problem-solving capabilities to a much wider range of part designs, including applications as diverse as toothbrushes and shaving systems to the intricate designs of semiconductors.

o Newly Developed Product Customization and Connectivity Features. In direct response to user requests, a new Application Programming Interface (API) has been integrated into MPI 4.0. This important feature allows users to automate a variety of common tasks, customize their user interface, implement standardized corporate protocols and best practices, and seamlessly interface with a variety of third-party software applications. These features will considerably reduce the amount of time engineers spend doing repetitive tasks and will allow them to focus on performing in-depth analysis.

o A Focus on User Productivity. MPI 4.0 offers enhanced modeling and meshing tools that make it easier than ever to optimize analysis models, as well as new Material Intelligence Tools allowing users to quickly identify the material that is most suitable for their design. These features greatly decrease model preparation and mesh preparation time and assist the user in quickly identifying the material that is most suitable for their part design.

o Collaboration Tools for the User Community. When users invest
in MPI, they not only get state-of-the-art technology, they also join the Moldflow user community, the largest, strongest, and most long established in the industry. The release of MPI 4.0 gives users access to the Moldflow Community Center (MCC). The MCC features a set of Web-centric tools that foster interaction and collaboration among users and with Moldflow Corporation.

Our Users Say
"The new API tools in MPI 4.0 represent a major user driven enhancement. Using macros in the past, I've been able to reduce the number of mouse clicks needed to perform model preparation by a factor of twenty, compared to doing the same manually. I am pleased to have this efficiency with the API tools."

Paul Van Huffel
Senior Engineer
Cascade Engineering, Inc.

"With the launch of MPI 4.0, we recognize that Moldflow responds to customer input and requests for additional features and capabilities that allow users to be more productive. We are impressed with the 'fix aspect ratio' and macro functions. They are quite helpful in our particular field."

Ir. Fokke J. van der Veen
Plastics Engineer
Philips DAP, Netherlands

"The new 3D overmolding analysis is one of the most critical features for us and this will help tremendously in improving the predictive capabilities for our applications in the connector industry."

Raj Manickam
CAE Application Engineer
Molex Automotive

"The improvements in MPI 4.0 enable us to quickly check, and if necessary, correct the mesh. This will give us more valuable time to spend interpreting the results and thinking of new ways to improve our models. New features like mesh match and match node enable me to get a better model, resulting in more accurate results in even less time."

Jimmy Wouters
Project-engineer
Cel Kunststoffen-KHLim, Belgium

Training Options
Moldflow offers a variety of training options for MPI 4.0 including traditional instructor led classes, live web-based online training, and self-paced, web-based classes. Students can select the type of training that best suits individual schedules and work loads. To evaluate training options and obtain a complete training schedule for various educational venues, visit plasticszone.com and click on the Education Zone.

Supported Platforms
MPI 4.0 is supported on AMD Athlon Windows-based PC workstations, Intel Pentium-based Windows PC's, and UNIX-based systems from Hewlett Packard, Sun, Silicon Graphics and IBM. Visit www.moldflow.com for updated hardware support.

For additional information about MPI 4.0, visit www.moldflow.com. For a product demonstration, contact your local Moldflow representative.

About Moldflow Corporation
Moldflow (NASDAQ: MFLO) is the world's leading provider of software products and services that help increase the speed, efficiency, quality and drive down the cost of the design and manufacture of injection molded plastic products. Companies use Moldflow's complete suite of products to address plastic part design issues at the earliest possible stage as well as to maximize productivity and profitability on the manufacturing floor. Our collaboration with academia, industry and customers around the world has led to a reputation for constant innovation in the complete design-to-manufacture process. Headquartered in Wayland, Massachusetts, Moldflow has offices and research and development centers in the United States, Europe, Australia and the Asia Pacific region. For more information about Moldflow visit www.moldflow.com or call 508-358-5848; fax 508-358-5868.

CONTACT: Moldflow corporate contact:
Dawn Soucier, 508/358-5848
dawn_soucier@moldflow.com

or

Public relations contact:
Laura Carrabine, 440/247-8653
lcarrabine@earthlink.net

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