Press Release Summary:
Low Profile Connectors suit applications requiring compact-footprint interconnects between PCBs or components. Offered in custom, flexible footprint configurations with contact spacing as close as 1.0 mm, they support signal speeds in excess of 20 GHz with contact resistance of less than 25 milliohm. Products utilize CIN::APSEÂ® contact technology with solderless wound-wire contact, and are offered in contact counts from under 10 to over 2,000.
Original Press Release:
Low Profile Board-to-Board Connectors
Lombard, IL - December 1, 2004 - Cinch Connectors today announced the introduction of its Low Profile Board-to-Board Connectors.
Designed for applications requiring low profile, compact footprint interconnects between printed circuit boards or components, the Connectors offer a low mated height of 0.81mm in custom, flexible footprint configurations with contact spacing as close as 1.0mm. In addition, the connectors provide excellent high speed performance, easily supporting signal speeds in excess of 20 Ghz with contact resistance less than 25 milliohms.
The Low Profile Connectors utilize proven CIN::APSE® contact technology, a unique solderless wound-wire contact with field-proven reliability in demanding applications ranging from high end computer servers to military jet aircraft.
Available in contact counts ranging from less than 10 contacts to over 2,000, the Connectors can be custom configured in patterns of arrays or individual contacts depending on the unique demands of an application.
The unique combination of mechanical and electrical features makes the Low Profile Connectors an ideal choice for RF Board-to-Board assemblies, Low-Profile Mezzanine Boards, and High-Performance Component-to-Board assemblies in Computer, Communications and Medical Electronics market applications.
Cinch Connectors is a supplier of reliable, high quality connectors to the Computer, Datacom, Telecom, Military Aerospace and Transportations markets worldwide. Cinch Connectors employs approximately 2000 people, with manufacturing operations located in the United States, Mexico, and England. Cinch product engineering and development activities are based in the United States and the UK. Cinch is a unit of the Snecma Group, headquartered in Paris, France. Additional information is available at www.cinch.com.