Backplane Connector System supports 20 Gbps data rates.
Press Release Summary:
Designed to meet next generation requirements of telecommunications and data networking equipment, Impact(TM) Connector System provides up to 80 differential pairs per linear inch in less than 29 mm total width. Broad-edge coupled, hybrid shielding design minimizes cross-talk, insertion loss, and performance variation across high-speed channels. Daughtercard mating interface provides inline staggered, bifurcated contacts with 2 points for built-in ground-signal sequencing.
Original Press Release:
Impact(TM) High Speed, High Density Backplane Connector System
Available Now from Molex Incorporated and Second Source Supplier
LISLE, Ill. - February 4, 2008 - High speed backplane connectors designed to support future system upgrades and provide long-term reliability are in constant demand. Molex Incorporated (NASDAQ: MOLX and MOLXA) recently developed the Impact(TM) backplane connector system designed to meet the next generation requirements of telecommunications and data networking equipment. Tyco Electronics is the second source supplier for the Impact product line, and the two companies will leverage their global manufacturing footprints to offer intermateable, interchangeable, interoperable backplane connector solutions.
"We designed Impact to push the speed and density envelope of backplane interconnects in order to meet the growing demands of next generation telecommunication and data networking equipment," said Brian Hauge, new product development manager, Molex Incorporated. "The Impact system properly balances the speed, density, cost and long-term reliability requirements of our customers' current and future systems needs."
Molex's Impact product provides up to 80 differential pairs per linear inch in less than 29mm total width, making it the fastest, densest backplane connector on the market today.
At over 20 Gbps data rates, Impact provides significant channel performance headroom for future system upgradeability in both traditional backplane and midplane architectures. Moreover, the Impact system offers two compliant pin design options so customers can balance their electrical and mechanical application needs.
Hauge added, "Molex's strategic relationship with Tyco provides designers with the confidence that they are utilizing high performance, high quality backplane products backed by the leading interconnect solutions providers in the industry. We've combined the two largest suppliers in the connector industry with the broadest product offerings and the highest commitment to reinvestment in R&D, and are committed to providing our customers with drop-in compatible backplane interconnect solutions."
The Impact backplane connector system's additional features and benefits include:
o A broad-edge coupled, hybrid shielding design, providing low cross-talk, insertion loss and minimal performance variation across all high speed channels;
o A simple 1.90mm x 1.35mm grid on both backplane and daughtercard, reducing PCB routing complexity and supplying adequate spacing for high speed routing;
o A daughtercard mating interface providing inline staggered, bifurcated contacts with two points of contact for long-term reliability and built-in ground-signal sequencing;
o Two compliant pin options which properly balance the mechanical and electrical performance of the system; and
o IEEE 10G BASE-KR and OIF State Eye Channel compliance.
Impact is available now in 3-, 4-, 5- and 6-pair versions, with a complete range of guidance and power-solution options. Prices start at 20 to 32 cents per mated differential channel and require approximately an 8-week lead time. For more information, visit: www.molex.com/link/Impact.html
About Molex Incorporated
Molex Incorporated is a 69-year-old global manufacturer of electronic, electrical and fiber optic interconnection systems. Based in Lisle, Illinois, USA, the company operates 59 manufacturing facilities in 19 countries. The Molex website is www.molex.com.
