Automotive Interconnects suit high current applications.
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Press Release Summary:
Eye-of-the-needle AutoPliant(TM) compliant interconnect technology includes series of 0.025 and 0.0315 in. thick interconnects that meet SAE/USCAR2 Revision 4 and IEC 60352-5 standards for automotive applications. Available in widths from 0.025-0.250 in., as well as in 1.03 mm round size, they maintain consistent gas-tight fit under adverse conditions. Products form gas-tight inter-connection with PCB without subsequent wave or reflow solder processing.
Original Press Release:
New AutoPliant(TM) Compliant Interconnects are Designed for High-Current Capabilities and Tested to Meet SAE/USCAR Requirements
San Diego, CA - - Autosplice has completed an extensive series of tests for qualification of their eye-of-the-needle AutoPliant(TM) compliant interconnect technology in automotive applications. Autosplice has also introduced a complimentary series of 0.64 and 0.81 mm thick compliant interconnects developed specifically for high amperage requirements.
The rugged environment in automotive designs place stringent demands on solder-less type inter-connections to consistently maintain optimal retention force, and high current-carrying capacity. Key test parameters include thermal shock, mechanical shock and vibration, and temperature & humidity cycling. In order to qualify for high-reliability automotive applications, AutoPliant components were tested to criteria based on the following two standards; SAE/USCAR2 Revision 4, and IEC 60352-5.
In addition, a variety of Printed Circuit Board (PCB) plated thru-hole conditions, inclusive of OSP, HASL and ENIG, were tested to ensure consistent performance within variable PCB production processes.
Autosplice AutoPliant interconnects were shown to significantly exceed retention force requirements, and were proven to maintain a consistent gas-tight fit under adverse conditions, which is critical in avoiding degradation of electrical continuity while assuring long-term mechanical integrity of the assembly.
AutoPliant products are inserted directly into the PCB to form a completed inter-connection without the need for any subsequent wave or reflow solder processing steps. This reduces cost and production complexity, especially critical on designs with high-amperage, heavy copper layers that have always presented difficult soldering challenges.
AutoPliant technology offerings are manufactured for high current carrying capacity, with available configurations including:
0.64 mm thick x 1.0 mm wide (0.025" x 0.039")
0.64 mm thick x .64 mm wide (.025" x .025")
0.81 mm thick x 1.5 mm wide (0.0315" x 0.059")
0.81 mm thick x 1.8 mm wide (0.315" x 0.0708")
0.81 mm thick x 2.8 mm wide (0.0315" x 0.110")
0.81 mm thick x 6.0 mm wide (0.0315" x 0.236")
0.81 mm thick x 6.35 mm wide (.0315" x .250")
1.03 mm round
AutoPliant interconnects are created using Autosplice time-tested and proven continuous manufacturing processes, delivered in automation-friendly reeled formats that can be machine inserted without any additional preparation steps
In summary, the key benefits of using compliant interconnects include:
Automation-friendly solder-less assembly
Elimination of inefficient secondary processing
Gas-tight inter-connections
High level of in-board retention force
Excellent current-carrying capabilities
Meets RoHS "lead-free" requirements
Autosplice is a leading manufacturer of terminals, component assemblies and applicator systems, providing automated solutions for high-volume electrical interconnections. Autosplice systems enable substantial cost savings and provide superior reliability over conventional connector products and assembly methods.
For More Information:
Autosplice, Fred Grabau, Phone 858-535-0077, Email fgrabau@autosplice.com
For more information on Autosplice's products or to discuss unique applications, contact Autosplice at (800) 535-5538 or visit our Web Site at www.autosplice.com
