Press Release Summary:
Suitable for smartphones, wearable accessories, and voice recorders, Model LC823450 is powered by ARMÂ® CortexÂ®-M3 core and 32-bit/192 kHz audio-processing engine with hardware-based MP3 encoding/decoding and wireless-audio support. SoC is equipped with 1656 KB SRAM, enabling audio processing and application tasks without requiring companion memory chip. Supplied in 5.52 x 5.33 mm WLP-154 package,Â processorÂ alsoÂ integrates analog/digital converter, phase-locked loop, and class-D amplifier.
Original Press Release:
Advanced Audio-Processing SoC from ON Semiconductor Delivers Superior Experiences on Mobile Devices
Dual-core processing architecture with hardware acceleration and available software modules reduces development time, saves board space and boosts battery life
PHOENIX, Ariz. – ON Semiconductor (Nasdaq: ON), driving energy efficiency innovations, has released its latest high-resolution audio processing System-on-Chip with 1656KB SRAM and power-efficient hardware acceleration, bringing extra space savings and longer battery life to devices such as smartphones, wearable accessories and voice recorders.
Powering the LC823450 are a highly efficient ARM® Cortex®-M3 core and ON Semiconductor’s 32-bit/192kHz audio-processing engine with hardware-based MP3 encoding/decoding and wireless-audio support, which boosts performance and power efficiency. In addition, a large selection of royalty- and license-free DSP code samples are available, which help accelerate software design and minimize development costs. These include advanced functions such as noise canceller, and S-Live (Low-frequency Intelligence Virtual Excitation) for enhanced playback of low frequencies.
With its generous on-chip SRAM, the new LC823450 has plentiful memory for audio processing and application tasks without needing a companion memory chip. Designers can also take advantage of rich integrated audio peripherals, such as an analog/digital converter, phase-locked loop and class-D amplifier. In addition, industry-standard interfaces such as SPI, I2C, SDCard and UART enable product designers to build in versatile connectivity.
“High-resolution audio takes listening pleasure to a new level, and our new LC823450 delivers superior experiences on mobile devices through class-leading integration and power efficiency,” said Atsushi Bando, General Manager of the ON Semiconductor, System Solutions Group. “Rich integrated features, hardware acceleration and easy software terms also make life easier for product developers by helping manage development costs and minimize time to market.”
Packaging and Pricing
The Pb-free LC823450 is packaged in a compact 5.52 mm x 5.33 mm WLP-154 that reduces footprint by up to 85% over competing solutions, and is priced at $8.34 per unit in 1,000 unit quantities. The device is also available in a TQFP-128L, priced at $8.00 per unit in 450 unit quantities.
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About ON Semiconductor
ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power and signal management, logic, standard and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit http://www.onsemi.com.
ON Semiconductor and the ON Semiconductor logo are registered trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the company references its Web site in this news release, such information on the Web site is not to be incorporated herein.