Array Package Rework System offers maximized capacity.
Press Release Summary:
Model APR-5000 XL/XLS Array Package Rework System reduces BGA lid temperatures, minimizing chance of failure by thermal damage. It also enables simultaneous use of inner and outer preheaters at programmable temperatures. System software simplifies rework, allowing safe, repeatable performance and simple profiling, while split vision system allows simultaneous view of opposite corners of component. It supports PCBs up to 24.5 x 24.5 in. to components down to 0.020 x 0.010 in.
Original Press Release:
New Software and Design Enhancements Boost Metcal APR-5000 Array Package Rework Capacity
OK International's APR-5000 XL/XLS Array Package Rework System capabilities have been further enhanced by the recent release of new software that allows the simultaneous use of inner and outer preheaters enabling fast and easy profiling.
The total productivity of the unit has been measurably increased by reducing rework cycle time and protecting the component under rework from thermal damage. The new design permits a lower nozzle temperature to achieve the same required temperature at the solder joints or balls while reducing BGA lid temperatures, a significant source of failure by thermal damage. The APR-5000 XL/XLS improves its ability to manage the narrow lead-free process window without using excessive peak temperatures that may damage components, connectors, adjacent solder joints and the PCB substrate.
During the rework process, the APR enables the simultaneous use of the inner and outer preheaters at programmable temperatures. This provides faster profiling and very precise thermal control across critical assembly regions. In most applications, the preheater nozzle and reflow top nozzle can be used at the same temperature in the final zones to easily achieve target temperatures. New software on the APR-5000 system dramatically simplifies rework for a faster, safer and more repeatable performance, enabling quick, simple profiling.
The APR-5000 XL/XLS Array Package Rework System provides large board capability with small board precision. This system performs precise, cost effective rework of the widest range of PCBs and component types, from large boards up to 24.5" x 24.5" (622mm x 622mm) to components down to 0.020" x 0.010" (0.51mm x 0.25mm).
Further featured on the APR-5000 XL/XLS Array Package Rework System is an innovative Split Vision System, which allows operators to simultaneously view the opposite corners of a component, including splitting on rectangular components, with the high-powered magnification to make placement and registration fast and accurate.
Visit www.okinternational.com to find out more
About OK International
OK International is a leading global supplier of products for production assembly equipment. The product range includes bench top soldering and desoldering tools, array package rework equipment, fluid dispensing systems and accessories, and fume extraction systems.
OK International is committed to understanding the product needs of its customers and supplies professional grade products that are innovative, reliable, price competitive and easy to use. Through a global sales channel, OK International provides expert product support and responsive customer service, with localization to meet regional market needs.
