Press Release Summary:
All-polyimide composite, PyraluxÂ® APR copper clad resistor laminate, features double-sided construction of polyimide film bonded to copper foil. It features Ticer Technologies' TCRÂ® thin film copper resistor foil as one or both of clad foils. Suited for advanced multi-layer flex, rigid flex, and rigid PCBs, product comes in range of dielectric thicknesses and resistance levels, with thermal resistance up to 356Â°F MOT. Material is IPC 4204/11 certified.
Original Press Release:
DuPont High Performance Laminates Introduces Pyralux® APR Copper Clad Resistor Laminate
RESEARCH TRIANGLE PARK, N.C., Feb. 4, 2009 - DuPont High Performance Laminates today announced it is expanding its portfolio of embedded materials and all polyimide laminates with the introduction of DuPont(TM) Pyralux® APR copper clad resistor laminate for advanced multi-layer flex, rigid flex and rigid printed circuit boards. This patented all polyimide composite is a double sided construction of polyimide film bonded to copper foil, and features Ticer Technologies' TCR® thin film copper resistor foil as one or both of the clad foils.
DuPont(TM) Pyralux® APR copper clad resistor laminate is ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance and robust processing is required.
"DuPont has been making breakthroughs in embedded passive materials in recent years, and our ability to combine some of our new, patented technologies with our experience in developing leading laminate constructions such as Pyralux® AP is a huge advantage," said Scott R. Simpson, global development manager - DuPont Embedded Passives. "When we add to that the established strength of Ticer Technologies' thin film copper resistor foil, Pyralux® APR truly becomes a winning combination for customers seeking smaller, lighter, more rugged and more reliable devices."
DuPont(TM) Pyralux® APR copper clad resistor laminate is available in a broad range of dielectric thicknesses and resistance levels, to provide designers, fabricators and assemblers a wide variety of circuit constructions. Key attributes include:
o Excellent resistive layer tolerance and electrical performance
o Excellent dielectric thickness tolerance
o Embedded capacitance and resistance in a single laminate
o Thin, rugged copper clad laminate with superior handling and processing
o High copper polyimide resistor foil adhesion strength
o Low coefficient of thermal expansion for flex and rigid multi-layer PCBs
o Excellent thermal resistance, up to 180C (356F) M.O.T.
o UL 94V-0, UL Registered, File E124294
o Compatible with printed wiring board industry processes, IPC 4204/11 certified
DuPont recently was granted a new collection of patents in embedded resistor laminate technology, as it continues to expand its portfolio of embedded passive materials.
High Performance Laminates is part of DuPont Electronic Technologies, a leading supplier of electronic materials, including materials for the fabrication and packaging of semiconductors, materials for rigid and flexible circuits, and materials for advanced displays. For further information, please visit pyralux.dupont.com.
DuPont is a science-based products and services company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation.
The DuPont Oval Logo, DuPont(TM), The miracles of science(TM) and Pyralux® are registered trademarks or trademarks of DuPont or its affiliates.
Ticer Technologies' trademark is owned by Ticer Technologies, L.L.C., Chandler, AZ. TCR is a registered trademark owned by Nippon Mining & Metals Co., Ltd., Tokyo, Japan. Ticer Technologies is a licensee of the technology and trademark of TCR®. TCR® is manufactured under license from Nippon Mining & Metals Co., Ltd. using one or more of the following United States patents: 6,771,160; 6,824,880; 6,841,084; 6,489,034; 6,489,035; and 6,622,374.