Northampton, MA – Smiths Microwave Subsystems is pleased to announce that Millitech, the leader in millimeter-wave technology, will be reviewing a number of their latest and most advanced millimeter-wave assemblies (MMWAs) at the International Microwave Symposium (IMS) May 23-26th in San Francisco, California, in booth #930. Responding to growing demands for E-, W-, and V-band products, the company has engineered assemblies with new levels of performance and integration.
E-Band Linear-Circular Polarizer
Their E-Band Linear-circular polarizer boasts a low axial ratio of < 0.6 dB, low insertion loss of < 0.5 dB, and can be optimized for any frequency you require from 18 to 110+ GHz. With over two times the bandwidth of similar products and an industry leading axial ratio performance, this polarizer is a first of its kind.
Millimeter-Wave GaN Power Amplifiers
Millitech’s Gallium Nitride (GaN) based power amplifiers represent a leap in output power at Ka, E-Band and W-Band with up to 20% power-added efficiency. Single device models are available with 5~10 watts at Ka-Band. Coming soon are 1W at E W-Band. Millitech’s leading efficiency in power combining is scalable to 4, 8 or 16-way and even higher depending on your requirements. Standard 2 4-Way models are pre-configured and up to 64-Way have been supplied.
Series BUC, BDC: Active Upconverters and Downconverters
Millitech’s active, high power Upconverters and Downconverters integrate amplifiers, mixers, and filters into small and lightweight packages. Each BUC/BDC integrates amplifiers, a mixer, and a filter to generate a high power upconverter or a low noise figure downconverter. An SMA pulse/mute control input is available on all units for powering down stage 1 amplifiers.
Power Amplifiers and Driver Amplifiers
Millitech series AMP power amplifiers leverage advanced PHEMT MMICs and transistors to yield a higher power output from the 18 to 110 GHz frequency band. Strand amplifier interfaces include 2.92 mm coaxial connectors (0-40 GHz), 2.4 mm (0-50 GHz), 1.85 mm (0-65 GHz), and waveguide interfaces from WR-42 to WR-10. Multiple MMIC amplifier chips can be combined or cascaded in applications that require higher gain. The broadband features of these amplifiers makes them ideal for a myriad of applications including transceivers, upconverters, EW, instrumentation, and radar systems.
Spartan Test Modules™
The V- and E-Band Spartan Test Modules™ (STM) extend network analyzer coverage to 54-69 GHz or 68-90 GHz. Built in detectors also allow compatibility with scalar network analyzers. The RX module can function as a down-converter for spectrum analyzers as well. Excellent for V and E band testing for insertion loss, gain, or phase, these STM are a practical tool in any test lab and an excellent alternative to purchasing expensive additional test equipment for your test lab applications.
Stop by the Millitech booth, #930, during the show to discuss how these products, and their full lineup of millimeter-wave products and services, can help you meet your high frequency challenges.
Learn more at www.millitech.com
About Millitech, Inc.
Millitech, Inc. specializes in the design, engineering and manufacturing of millimeter-wave components, assemblies, subsystems and fully integrated systems for applications in satellite communications, radiometry, radar and remote sensing. For over 25 years our engineering, manufacturing and sales staffs have been dedicated to providing the most technically advanced millimeter-wave products and services available, enabling our customers to translate their ideas and needs into cost-effective solutions. For more information visit: www.millitech.com
About Smiths Microwave Subsystems
Smiths Microwave Subsystems is a business unit of Smiths Interconnect and includes TRAK, Millitech, and TECOM. The collective brands offer a strong heritage in customized and standard RF through millimeter-wave subsystems, frequency and timing systems, and antennas to defense and commercial customers. The Subsystems team specializes in the design, development and manufacture of customer-driven solutions including board-level components, RF assemblies, highly integrated subsystems, antennas and build-to-print manufacturing and testing.