2015 Manufacturing Capabilities at Standard Printed Circuits


DESCRIPTION                                      PRODUCTION             PROTOTYPE            EXPERIMENTAL



Minimum Laminate Thickness                .003"                             .002"                           .0005" (Cuflon)

Maximum Laminate Thickness               .250"                             .250"                           .260"

Maximum Layer Count                            24                                 26                               28



ONE OUNCE COPPER

Minimum Conductor Width                     .005"                             .004"                          .003"

Minimum Spacing                                   .005"                             .005"                          .004"

Minimum Annular Ring (PTH)                 .005"                             .005"                          .004"



HALF OUNCE COPPER

Minimum Conductor Width                     .003"                             .003"                          .002"

Minimum Spacing                                   .003"                             .003"                          .002"

Minimum Annular Ring (PTH)                 .004"                             .003"                          .003"



ETCHING

Line Width Tolerance                              +/- .001"                       +/- .0005"                   +/- .0004"

Front to Back Registration Tolerance     +/- .002"                       +/- .001"                     +/- .0007"

Max Copper Weight (with S/Mask)          3 ounce

Max Copper Weight (w/o S/Mask)           5 ounce                       7 ounce

Etch Factor (per ounce of base copper)  0.0006"

Minimum SMT pitch                                .020"                            .015"                           .012"

Minimum Annular Ring (signal layer)       .008"                            .008"                           .006"

Minimum Clearance Ring (pwr/grd)         .020"                            .015"                           .014"



FABRICATION

Minimum Edge Clearance (routing)        .015"                             .010"                           .008"

Minimum Edge Clearance (scoring)       .030"                             .025"                           .020"

Routed / Scored Panels we typically add: .500" waste area to all edges

Dimensional Accuracy (routing)              +/- .005"                       +/- .003"

Dimensional Accuracy (scoring)             +/- .020"                       +/- .020"

Minimum Score Thickness                      +/- .015"                      +/- .010"

Minimum Size for Routed Slot                .020"                           .020"



DRILLING

Minimum Hole Size (PTH)                      .008"                           .007"                            .006"

Drilled Hole Location Tolerance              +/- .003"                     +/- .002"                       +/-.001"

Max Aspect Ratio (Dt : hole dia)             8:1                             10:1                              12:1

Blind / Buried / Filled Vias yes



SOLDERMASK / SILKSCREEN

Min Soldermask Annular Ring        .003"

Min LPI Feature                             .004"

Min Line Width (silkscreen)            .005"

Min Character Height (silkscreen)  .050"



STANDARD PLATING THICKNESSES

Copper in PTH             .001 - .0015"

Tin Lead (solder)          300 – 500 micro inches

Electrolytic Nickel         150 – 200 micro inches

Electrolytic Gold           30-50 micro inches

Electrolytic Tin             150 – 200 micro inches

Electroless Tin             15-30 micro inches

Immersion Silver          10-15 micro inches

Electroless Nickel         118-236 micro inches (per IPC-4552 ENIG spec)

Immersion Gold            1.97 (min) micro inches (per IPC-4552 ENIG spec)

ENEPIG (for gold wire

bonding)                        125-200 micro inches Nickel; 3-8 micro inches Palladium; 1-3 micro

inches of Gold



BLIND AND BURIED VIAS – VIA FILL TECHNOLOGY (non-conductive and conductive)



HIGH SPEED DIGITAL DESIGNS



ELECTRICAL TESTING

Seica Flying Probe S20 BBT

4 Independent Probes – 2 sided

Continuity Test – 1 ohm to 10k ohm

Isolation Test – 10k ohm to 1g ohm

Voltage measurement - 5 to 250 Volts

Capacitance measurement – 0.1 pF to 100 mF

Min testable pad size - .010"

Min pitch - .010"



FULL MICRO-SECTIONING CAPABILITY



CONTROLLED IMPEDANCE (TDR) VERIFICATION



SOLDERABILITY and THERMAL STRESS TESTING



COORDINATE MEASUREMENT SYSTEM (2 systems)

Accurate to +/- .0001"



MATERIALS / LAMINATES

FR4, Multifunctional FR4, Polyimide, PTFE, Ceramic filled PTFE, TMM, and Thermally Conductive (TC). All Advanced Dielectrics including Arlon, Isola, Nelco, Rogers, PolyFlon, Taconic, and Ventec Laminates.



CERTIFICATIONS / REGISTRATIONS / QUALIFICATIONS

AS9100C / ISO9001 Certified

ITAR Registered

UL94 V-0 Underwriter’s Laboratories Flammability Rating on select materials

UL94 V-1 Underwriter’s Laboratories Flammability Rating on Polyimide

IPC-6012B Class 3 Capability – Qualification and Performance Specification of Rigid Printed Boards

IPC-6018 Class 3 Capability – Microwave End Product Board Inspection and Test

CAGE CODE 52LZ3 - SAM (System for Award Management) for Federal Contracting



INDUSTRIES

Aerospace, Military, Medical, Instrumentation and Sensors, Telecommunications, Industrial Controls, IT, Automotive, LED, Thermal Management.

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