SEMPAC a Provider of Open-Pak(TM) Semiconductor Packages Announces New Expansion into Europe
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SEMPAC, Inc. a Silcon Valley based design and manufacturer of the "air-cavity" plastic package for the Semiconductor Packaging Industries is pleased to announce it has opened a new distribution center in the United Kingdom that will service all of the European communities. Accelonix Limited, located in Alton, Hampshire England who is also SEMPAC's sales agency in the territory, will now handle all "stock" transactions up to 250 parts per order including "test & prototype" samples for customer evaluations.
This distribution center will stock Sempac's "Open-Tooled" package architectures and their corresponding ceramic lids making it more readily available to design engineers helping them accelerate products to market faster.
"We provide our packaging solutions to the Rf Microwave, Sensor, MEMS & Telecom Industries to name but a few, and these solutions will now be more readily available to the European design engineers in meeting their time tables for die qualifications." explains Guy Gaudenzi VP Sales and Marketing of Sempac. "SEMPAC is very excited with this joint venture as it will provide more expedient service to our customers in Europe as well as reduce the costs associated with shipping from the United States to these territories.
SEMPAC's European distribution program will be in effect starting late May /June 2008.
About Accelonix
Accelonix is a specialized equipment and materials distributor, introducing and supporting innovative technologies for the electronics manufacturing industry since 1984. We keep our customers ahead of the challenges they face on a daily basis by providing tailored solutions which precisely match their needs. Accelonix operates from four offices spread across major territories within the west of Europe and covering the UK, Ireland, France, Benelux and Iberia.
For more information please visit www.accelonix.co.uk or contact Paul Phillips Director of Accelonix                Â
About Sempac
Founded in 2000 Sempac offers an innovated manufacturing technology solution for small outline integrated circuit packaging. Our products aid in the manufacturing and development of Telecommunication, Optoelectronic, RF, MEMS and Sensor devices. Our packaging technology has been used to bring new devices for Cell phones, PDA's and Digital cameras to market quicker, by reducing development costs and allowing our customers to get new products into the market faster.
For more information please visit www.sempac.com or contact Guy Gaudenzi VP Sales guy.
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