RadiSys to Present at the 2007 Bank of America Technology Conference on February 22, 2007
HILLSBORO, Ore., Feb. 9: RadiSys(R) Corporation (NASDAQ:RSYS), a leading global provider of advanced embedded solutions, announced that it will participate in the 2007 Bank of America Technology Conference to be held on February 21-22 at The New York Palace Hotel in New York, New York. Brian Bronson, Chief Financial Officer, will present an overview of the Company's business and strategy on Thursday, February 22, 2007 at 11:20 am ET.
A live webcast and replay of the event will be available on the Company's investor relations website at investor.radisys.com/ under the investor calendar section.
About RadiSys
RadiSys is a leading provider of advanced embedded solutions for the communications networking and commercial systems markets. Through intimate customer collaboration and combining innovative technologies and industry leading architecture, RadiSys helps OEMs, systems integrators and solution providers bring better products to market faster and more economically. RadiSys products include embedded boards, application enabling platforms and turn-key systems, which are used in today's complex computing, processing and network intensive applications. For more information, visit www.radisys.com/, write to info@radisys.com, or call 800-950-0044 or 503-615-1100. Editors seeking more information may contact Lyn Pangares at RadiSys Corporation at 503-615-1220 or lyn.pangares@radisys.com.
RadiSys(R) is a registered trademark.
Source: RadiSys Corporation
CONTACT: Lyn Pangares of RadiSys Corporation, +1-503-615-1220, or lyn.pangares@radisys.com
Web site: http://www.radisys.com/
