New Samtec Signal Integrity Design Guide
Samtec's ability to provide "Signal Integrity at Any Distance(TM)" is detailed in this new Interconnect Design and Signal Integrity Services Guide. It includes end-to-end solutions for Panel-to-Panel, Panel-to-Board, Cable-to-Board, and Board-to-Board applications as well as signal integrity design resources including our unique Final Inch® PCB design tools.
Samtec Signal Integrity interfaces include a wide variety of high speed/high density interconnect systems. Single-ended and differential pair connectors, elevated board stackers, edge mount, right angle and card-edge systems for perpendicular and co-planar board mating, controlled impedance flex circuits, and high DataRate(TM) coax and twinax cable systems are available.
Signal Integrity services include a user-friendly web site for high speed connector SPICE, IBIS and 3D models, test reports, drawings, footprints and PADs layouts, application notes, white papers, and webinars. Final Inch® PCB design tools save design, development, and validation time and resources. Samtec's Signal Integrity Group is available for services ranging from simple questions to fee-based consulting.
For more information on Samtec's Signal Integrity interfaces and services, or for your copy of Samtec's Signal Integrity Guide, contact: www.samtec.com/signal_integirty/final_inch/fi-index.asp or contact: Samtec, Inc. o P.O. Box 1147 o New Albany, IN 47151-1147 o Phone: 1-800-SAMTEC-9. or 812-944-6733 o Fax: 812-948-5047 o Internet: www.samtec.com o E-mail: info@samtec.com
