IPC and TCMA Announce Keynote Speaker for Technical Conference.
Share:
Press Release Summary:
Announced jointly by IPC and SMTA, High-Reliability Cleaning and Conformal Coating Conference (November 18–20, 2014) focuses on best practices and new innovative technologies for meeting manufacturing challenges and producing reliable hardware. Technical Conference keynote speaker Mark McMeen, VP of Technology at STI Electronics, will present on funded research with U.S. Military & Defense that quantifies effects of flux residues and other contaminants remaining under component terminations.
Original Press Release:
Industry Expert to Keynote IPC and SMTA to Host High-Reliability Cleaning and Conformal Coating Conference
ROSEMONT, IL — Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois. The conference intensely focuses on best practices and new innovative technologies for meeting today’s manufacturing challenges and producing reliable hardware.
The keynote speaker for the Technical Conference is Mark McMeen, VP of Technology at STI Electronics. Mark will present on funded research with the U.S. Military & Defense that quantifies the effects of flux residues and other contaminants remaining under component terminations.
With component miniaturization, the distance between conductive paths narrows. A test vehicle and methodology that can be used to quantitate the effects of residues under component terminations is needed technology.
The link http://www.ipc.org/calendar/2014/cleaning-coating-Nov2014/agenda.htm provides a detail agenda of the topics and speakers.
