Endicott Interconnect Technologies Recognized by Northrop Grumman as Technological Innovator


Endicott, NY, September 17, 2008 - Endicott Interconnect Technologies, Inc. received the prestigious Innovation supplier award from Northrop Grumman Electronic Systems (NGES), a world leader in the design, development and manufacture of advanced electronics for military, civil and commercial use. The supplier awards were part of Northrop Grumman Electronic Systems' 2008 supplier conference held July 23, 2008, with the theme, "Raising the Bar in Performance."

EI's Kim Blackwell, Product Manager, Semiconductor Packaging, and Eric Hills, Director of Military and Defense Programs, accepted the award.

Endicott Interconnect Technologies, Inc. (EI), headquartered in Endicott, NY, is a world-class supplier of high-density electronic interconnect solutions, with over 45 years of experience in providing microelectronics solutions and leading-edge technology and technical know-how to give its customers a technological and time-to-market advantage.

The award categories represented the supplier behaviors, attributes or outcomes that Northrop Grumman Electronic Systems values: Customer Service, Strategic Contributions, Continuous Improvement, Innovation, Extraordinary Effort, and Life Cycle Cost.

The supplier award presented to EI echoed the conference theme that the NGES supply base is an essential component of the success of its programs, and that Northrop Grumman must have a supply base it can depend on for consistent high quality, on-time delivery, cost competitiveness, innovation, and continuous improvement of processes and product.

"Solutions for defense/aerospace applications are a strategic part of our vision at EI," said company President and CEO James J. McNamara, Jr. "We offer printed circuit board fabrication, semiconductor packaging, and complex assembly solutions, with organic substrates that are lighter, smaller and more reliable than the traditional ceramic substrates. These capabilities provide an important competitive advantage for our customers in minimizing the weight of electronic equipment and providing as much functionality as possible in increasingly smaller spaces without sacrificing performance or reliability."

Since its inception in 2002 as a business line purchased from IBM, EI's customer base has shifted from 100% IBM to 45% in the military and defense industry in just five years.

About Endicott Interconnect Technologies

Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a supplier of electronic interconnect solutions consisting of fabrication and assembly of complex printed circuit boards and advanced flip chip and wire bond semiconductor packaging, as well as
precision equipment manufacturing and integration. EI's product lines meet the needs of markets such as defense and aerospace, communications and computing, semiconductor, advanced test equipment and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in
providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provides customers with a time-to-market advantage and competitive differentiation. For more information about EI and its technological capabilities, please visit www.eitny.com.

About Northrop Grumman Electronic Systems

Northrop Grumman Electronic Systems is a world leader in the design, development and manufacture of advanced electronics for military, civil and commercial use. The sector provides a variety of defense electronics and systems, airspace management systems, navigation systems, precision weapons, communications systems, marine systems, space systems, oceanic and naval systems, government systems and logistics services. http://www.es.northropgrumman.com/

Editorial contacts:
Theresa Taro
Director of Marketing and Communications
(607) 755-1847
theresa.taro@eitny.com
www.eitny.com

Charles L. Birkhead
Macrovision, Inc.
(215) 348-1010
charles@macrovis.com

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