Endicott Interconnect Technologies Receives Department of Defense Trusted Foundry Accreditation
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Endicott, NY, October 29, 2008 - Endicott Interconnect Technologies, Inc. (EI) has received Trusted Accreditation by the Defense Microelectronics Activity (DMEA) as a trusted source to the Department of Defense and all other U.S. government agencies. EI, a world class supplier of engineered electronic interconnect solutions for mission critical and high performance applications, has been awarded Category 1A trusted foundry accreditation for integrated circuits for packaging/assembly services at its Endicott, N.Y. facility.
DMEA was established and continuously evolved by the Office of the Secretary of Defense (OSD) to jointly act as the DOD Center for microelectronics technology, acquisition, transformation, and support. DMEA is composed of highly specialized engineering facilities and microelectronics engineers working in close partnership with the semiconductor industry and major defense contractors such as EI to provide support for fielded systems across all U.S. military organizations.
Trusted supplier status is awarded to those U.S. companies designing, generating, manufacturing and distributing components that are highly critical to national security.
"Trusted supplier status is a key element of our strategy moving forward," said Jay McNamara, EI's President and CEO. "It guarantees our customers access to a trusted supplier for mission critical applications and offers us the ability to fabricate classified designs along with providing access to leading edge technology and support through our industry partnership."
The change in industry demographics that has shifted microelectronic packaging expertise and manufacturing offshore has led to a reduction in worldwide research and development in advanced packaging and to a lack of new product and process capability within the U.S. As a result, the U.S. Department of Defense and the intelligence community is in need of American companies, positioned ahead of potential adversaries, to provide leading edge technologies and manufacturing capabilities to support the development of high technology products and provide access to emerging technologies.
About Endicott Interconnect Technologies
Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a supplier of electronic interconnect solutions consisting of fabrication and assembly of complex printed circuit boards, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including defense and aerospace, communications and computing, semiconductor, advanced test equipment, and medical, where highly reliable products built in robust manufacturing operations are critical for success. With more than 45 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation.
For more information about EI and its products, please visit www.endicottinterconnect.com.
Editorial contacts:
Theresa Taro
Director of Marketing and Communications
(607) 755-1847
theresa.taro@eitny.com
www.eitny.com
Charles L. Birkhead
Macrovision, Inc.
(215) 348-1010
charles@macrovis.com
