NuSil Technology LLC

Adhesives & Sealants

Electronic Packaging Material is thermally conductive.

With nominal thermal conductivity of 1 W/mk, EPM1-2493 silicone thermal interface material offers bond lines as thin as 5 microns and is suited for use in electronic applications. This pourable, conformal liquid, with 1:1 mix ratio, can be used to adhere materials with differing coefficients of thermal expansion (CTE), reducing stress during thermal cycling. Adhesive strength can be improved via...

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Adhesives & Sealants

High-Purity Gels exhibit minimal moisture permeability.

Available with refractive index of 1.54 and viscosities from 3,500-8,000 cP, LS-3354, LS2-3354, and LS3-3354 are designed for potting, encapsulating, backfilling, and dampening applications requiring soft gel with optical clarity. Cure can be achieved at ambient temperatures with humidity or accelerated with heat, and gels can be removed for rework if needed. Available in 1:1 mix ratio, products...

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Silicone Gel offers refractive index of 1.40.
Adhesives & Sealants

Silicone Gel offers refractive index of 1.40.

Providing protection from mechanical shock, optically clear LS-3140 is suited for use as encapsulating, embedding, or potting compound for environmental protection of electronic assemblies. Low outgassing gel handles stress during thermal cycling without cracking or delamination. To meet multitude of processing requirements, LS-3140 cures at room temperature, or cure can be accelerated with heat....

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Materials

Aerospace Material suits solvent-resistant applications.

Fluorosilicone high consistency rubber (HCR), FS-3780, is designed to endure harsh environments where finished parts are exposed to fuels and extreme temperature conditions. Delivered as uncatalyzed HCR, it requires addition of platinum- or peroxide-base catalyst to cure with heat. It can be used for transfer or compression molded parts - gaskets, stoppers, seals - and can also be extruded or...

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Materials

Dielectric Gels suit electronic packaging applications.

Low-outgassing EPM-2480, EPM-2481, and EPM-2482 are designed for encapsulation of chip packages in devices where outgassing-related contamination would be problematic. Able to cure into soft, compliant silicone, products help reduce stress on electronic assemblies during temperature cycling while protecting against environmental factors and shock. Types EPM-2480 and EPM-2481 are based on dimethyl...

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Silicone Material suits electronic packaging applications.
Adhesives & Sealants

Silicone Material suits electronic packaging applications.

Low outgassing, one-part material EPM-2411-2 glop-top is designed for encapsulation of chip packages in devices where outgassing-related contamination poses problem. Product exhibits low stress and wide operating temperature ranges characteristically associated with silicone-based materials. It is stored and shipped frozen in 3 and 30 cc syringes as well as 3 and 6 oz tubes.

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Adhesives & Sealants

Thermal Interface Material has low-viscosity formulation.

Developed to address contamination issues in dense electronic systems, EPM-2493 electronic packaging material (EPM) meets requirements of high-temperature and high-stress operating conditions in electronic packaging. This low-outgassing material is designed to work in environments with drastic temperature cycling that would otherwise result in encapsulant embrittling or outgassing.

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Adhesives & Sealants

Two-Part Silicone Compound suits electronic applications.

Able to maintain electrical conductivity from -178 to +445°F, R-2634 electrically conductive, room-temperature vulcanized (RTV) paste achieves full cure at 77°F in 7 days. With heat-accelerated cure time of 30 min, R-2940 thermally conductive, RTV paste performs over -85 to +465°F temperature range. Operating over -178 to +465°F temperature range, CFI-6755 optically clear,...

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Adhesives & Sealants

Electronic Packaging Material is thermally conductive.

With nominal thermal conductivity of 1 W/mk, EPM1-2493 silicone thermal interface material offers bond lines as thin as 5 microns and is suited for use in electronic applications. This pourable, conformal liquid, with 1:1 mix ratio, can be used to adhere materials with differing coefficients of thermal expansion (CTE), reducing stress during thermal cycling. Adhesive strength can be improved via...

Read More »
Adhesives & Sealants

High-Purity Gels exhibit minimal moisture permeability.

Available with refractive index of 1.54 and viscosities from 3,500-8,000 cP, LS-3354, LS2-3354, and LS3-3354 are designed for potting, encapsulating, backfilling, and dampening applications requiring soft gel with optical clarity. Cure can be achieved at ambient temperatures with humidity or accelerated with heat, and gels can be removed for rework if needed. Available in 1:1 mix ratio, products...

Read More »
Silicone Gel offers refractive index of 1.40.
Adhesives & Sealants

Silicone Gel offers refractive index of 1.40.

Providing protection from mechanical shock, optically clear LS-3140 is suited for use as encapsulating, embedding, or potting compound for environmental protection of electronic assemblies. Low outgassing gel handles stress during thermal cycling without cracking or delamination. To meet multitude of processing requirements, LS-3140 cures at room temperature, or cure can be accelerated with heat....

Read More »
Materials

Aerospace Material suits solvent-resistant applications.

Fluorosilicone high consistency rubber (HCR), FS-3780, is designed to endure harsh environments where finished parts are exposed to fuels and extreme temperature conditions. Delivered as uncatalyzed HCR, it requires addition of platinum- or peroxide-base catalyst to cure with heat. It can be used for transfer or compression molded parts - gaskets, stoppers, seals - and can also be extruded or...

Read More »
Company News

NuSil Technology Appoints Huntsman as Exclusive Distributor in Brazil

Carpinteria, California - April 20, 2007 - NuSil Technology (www.nusil.com), a cutting-edge manufacturer of silicone-based materials for healthcare, aerospace, electronics and photonics, has appointed Huntsman Quimica Brasil Ltda., a subsidiary of Huntsman Corp. (NYSE:HUN), as its exclusive distributor of products for the electronics industry in Brazil. Huntsman Advanced Materials, a supplier of...

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Materials

Dielectric Gels suit electronic packaging applications.

Low-outgassing EPM-2480, EPM-2481, and EPM-2482 are designed for encapsulation of chip packages in devices where outgassing-related contamination would be problematic. Able to cure into soft, compliant silicone, products help reduce stress on electronic assemblies during temperature cycling while protecting against environmental factors and shock. Types EPM-2480 and EPM-2481 are based on dimethyl...

Read More »
Silicone Material suits electronic packaging applications.
Adhesives & Sealants

Silicone Material suits electronic packaging applications.

Low outgassing, one-part material EPM-2411-2 glop-top is designed for encapsulation of chip packages in devices where outgassing-related contamination poses problem. Product exhibits low stress and wide operating temperature ranges characteristically associated with silicone-based materials. It is stored and shipped frozen in 3 and 30 cc syringes as well as 3 and 6 oz tubes.

Read More »
Adhesives & Sealants

Thermal Interface Material has low-viscosity formulation.

Developed to address contamination issues in dense electronic systems, EPM-2493 electronic packaging material (EPM) meets requirements of high-temperature and high-stress operating conditions in electronic packaging. This low-outgassing material is designed to work in environments with drastic temperature cycling that would otherwise result in encapsulant embrittling or outgassing.

Read More »
Company News

NuSil Technology Positions for Growth by Expanding Distribution Network in Europe

Carpinteria, California - June 30, 2006 - NuSil Technology (www.nusil.com), a cutting-edge manufacturer of silicone-based materials for healthcare, aerospace, electronics and photonics, announces the expansion of its European distribution network with the signing of Velox GmbH. Velox, a Germany-based, industrial raw materials distributor, will represent NuSil ' s healthcare and engineering...

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Company News

NuSil Technology Expands Global Capabilities with Asian Office

Carpinteria, California - June 20, 2006 - NuSil Technology (www.nusil.com), a cutting-edge manufacturer of silicone-based materials for healthcare, aerospace, electronics and photonics, announces that it has opened its first technical support office in Asia. This office will specialize in the areas of optoelectronics and electronic packaging, served by the company's Lightspan products and its...

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