Novellus Systems, Inc.
San Jose, CA 95134
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PECVD System supports sub-28 nm dielectric films.
Incorporating interface engineering to minimize RC delay constant without changing materials, VECTORÃ-® Excel(TM) addresses needs of advanced technology nodes that require pre- and/or post-processing of dielectric films, such as diffusion barriers. System's PECVD module employs multi-station sequential deposition architecture that results in optimal wafer-to-wafer, within-wafer, and...
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Copper Barrier-Seed PVD System is intended for TSV packaging.
For copper barrier-seed applications, INOVA-® NExT PVD system features Hollow Cathode Magnetron (HCM) IONX source technology. Copper barrier-seed physical vapor deposition (PVD) process, intended for through-silicon-via (TSV) packaging market, delivers optimal sidewall and bottom coverage and enables void-free copper fill during subsequent TSV electroplating step. TSVs enable 3D packaging, where...
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Novellus' Suppression-Enhanced Fill(TM) Technology Provides Defect-Free 32nm Copper Interconnects
Unique Hardware and Process Chemistry Extend Cu Manufacturing Capability SAN JOSE, Calif., April 9 / -- Since the advent of copper damascene processing, achieving void-free fill of high aspect ratio interconnect features has been a key challenge for device manufacturers. Shrinking dimensions at each successive technology node have increased the complexity of the copper seed and electroplating...
Read More »Novellus, ATMI and Enthone Introduce Enhanced Electrochemical Deposition Process for Copper
Three-way Collaboration Advances Copper Interconnect Technology for 32 Nanometers and Beyond DANBURY, Conn., March 17 /PRNewswire-FirstCall/ -- Novellus Systems (NASDAQ:NVLS), ATMI, Inc. (NASDAQ:ATMI), and Enthone Inc. today introduced ViaForm(R) Extreme Pura(TM), a new copper deposition process and chemistry for manufacturing advanced copper interconnects at 32 nanometers (nm) and beyond. This...
Read More »Novellus Systems Sets New Industry Benchmark for PECVD Throughput with VECTOR Extreme
Novellus Systems Sets New Industry Benchmark for PECVD Throughput With VECTOR Extreme SAN JOSE, Calif., July 16 / / -- Novellus Systems, Inc. (NASDAQ:NVLS) today launched VECTOR Extreme(TM) plasma enhanced chemical vapor deposition (PECVD) system -- the industry's fastest PECVD tool with a throughput of up to 250 wafers per hour. VECTOR Extreme helps chipmakers reduce average process cycle times...
Read More »Metallization System provides copper seed re-sputter.
Featuring advanced physical vapor deposition technology and ion-induced atomic layer deposition, 300 mm INOVA NExT with HCM IONX(TM) enables thin film barrier and copper seed deposition scalability for 32 nm node. System provides optimized metallic film overhang, step coverage, and film quality for tantalum barrier and copper seed processes. Differentiated source technology can be applied to...
Read More »Novellus Systems Introduces Ashable Hard Mask Process Technology on VECTOR Express Platform
New Film To Address Advanced 193nm High Aspect Ratio Patterning Etch Requirements SAN JOSE, Calif., June 25 / / -- Novellus Systems, Inc. (NASDAQ:NVLS) announced today that it has started production shipments of its new patent-pending ashable hard mask (AHM(TM)) process technology on the VECTOR Express(TM) plasma-enhanced chemical vapor deposition (PECVD) platform. Designed to address the...
Read More »Copper Electrofill System handles 45 and 32 nm nodes.
Copper electroplating system, SABRE Extreme(TM), utilizes Viaform Extreme electrofill chemistry to provide filling capability on narrow, high-aspect ratio features. Along with sealed contact design with 1 mm physical edge exclusion, product features edge bevel removal process with recipe-driven edge exclusion and Extreme-generation plating cell that enables recipe-driven edge profile control. It...
Read More »Photoresist Dry Strip System suits 65 and 45 nm nodes.
Designed for 300 mm wafer processing, GAMMA Express(TM) provides single product platform for front-end-of-line and back-end-of-line applications. Low silicon loss implant strip and non-oxidizing strip chemistries offer compatibility with Silicide and ultra low-k films as well as bulk strip, high dose implant strip (HDIS), and C4 packaging applications. With direct drive wafer handling, product...
Read More »Novellus Introduces Industry's First Production-Ready UVTP System for Sub-90 Nanometer Dielectrics
SOLA Addresses Multiple Film Applications on 300mm Wafers; Multi-Station Sequential Treatment Architecture Helps Semiconductor Manufacturers Improve Yields and Lower Manufacturing Costs SAN JOSE, Calif., Dec. 6 / -- Novellus Systems, Inc. (NASDAQ:NVLS), the productivity and technology leader in advanced deposition, surface preparation and chemical mechanical planarization processes for the global...
Read More »PECVD System supports sub-28 nm dielectric films.
Incorporating interface engineering to minimize RC delay constant without changing materials, VECTORÃ-® Excel(TM) addresses needs of advanced technology nodes that require pre- and/or post-processing of dielectric films, such as diffusion barriers. System's PECVD module employs multi-station sequential deposition architecture that results in optimal wafer-to-wafer, within-wafer, and...
Read More »Novellus Announces Availability of the Webcast of Its Presentation at the 13th Annual Needham Growth Conference
SAN JOSE, Calif., Dec. 22, 2010 - Novellus Systems, Inc. (Nasdaq: NVLS) today announced that the company will present on Thursday, January 13, 2011, at the 13th Annual Needham Growth Conference. The presentation will begin at 10:40 a.m. EST and will be made available over the Internet via a live webcast. The live webcast presentation may be accessed via Novellus' Investor Relations home page at...
Read More »Novellus Systems, Inc. Announces Participation at Investor Conferences
SAN JOSE, Calif., Aug. 25 -- Novellus Systems, Inc. (NASDAQ:NVLS) today announced the schedule of upcoming presentations that will be available to the public via webcast: o September 8, 2010 - 2010 Citi Technology Conference, 3:00 p.m. EDT o September 13, 2010 - Bank of America Merrill Lynch 2010 Investment Conference, 11:00 a.m. PDA A live webcast of the presentations may be accessed via...
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Copper Barrier-Seed PVD System is intended for TSV packaging.
For copper barrier-seed applications, INOVA-® NExT PVD system features Hollow Cathode Magnetron (HCM) IONX source technology. Copper barrier-seed physical vapor deposition (PVD) process, intended for through-silicon-via (TSV) packaging market, delivers optimal sidewall and bottom coverage and enables void-free copper fill during subsequent TSV electroplating step. TSVs enable 3D packaging, where...
Read More »
Novellus' Suppression-Enhanced Fill(TM) Technology Provides Defect-Free 32nm Copper Interconnects
Unique Hardware and Process Chemistry Extend Cu Manufacturing Capability SAN JOSE, Calif., April 9 / -- Since the advent of copper damascene processing, achieving void-free fill of high aspect ratio interconnect features has been a key challenge for device manufacturers. Shrinking dimensions at each successive technology node have increased the complexity of the copper seed and electroplating...
Read More »Novellus, ATMI and Enthone Introduce Enhanced Electrochemical Deposition Process for Copper
Three-way Collaboration Advances Copper Interconnect Technology for 32 Nanometers and Beyond DANBURY, Conn., March 17 /PRNewswire-FirstCall/ -- Novellus Systems (NASDAQ:NVLS), ATMI, Inc. (NASDAQ:ATMI), and Enthone Inc. today introduced ViaForm(R) Extreme Pura(TM), a new copper deposition process and chemistry for manufacturing advanced copper interconnects at 32 nanometers (nm) and beyond. This...
Read More »Novellus Announces Availability of the Webcast of Its Presentation at Morgan Stanley's Technology Conference
SAN JOSE, Calif., Feb. 20 -- Novellus Systems, Inc. (NASDAQ:NVLS), today announced that the company will present on Tuesday, March 4, 2008, at Morgan Stanley's Technology Conference. The presentation will begin at 3:20 p.m. PST and will be made available over the Internet via a live webcast. The live webcast presentation may be accessed via Novellus' Investor Relations home page at...
Read More »Novellus Announces Availability of the Webcast of Its Presentation at Thomas Weisel Partners' 2008 Technology, Telecom & Internet Conference
SAN JOSE, Calif., Jan. 22 -- Novellus Systems, Inc. (NASDAQ:NVLS), today announced that the company will present on Monday, February 4, 2008, at Thomas Weisel Partners' 2008 Technology, Telecom & Internet Conference. The presentation will begin at 9:10 a.m. PST and will be made available over the Internet via a live webcast. The live webcast presentation may be accessed via Novellus' Investor...
Read More »Novellus Systems' Classic and Refurbished Semiconductor Equipment Business Strengthens Global Footprint
SAN JOSE, Calif., Dec. 4 - SEMICON Japan -- Novellus Systems, Inc. (NASDAQ:NVLS), today announced that it has qualified several companies as licensed partners to support customers for manufacturing, service and spare parts of its refurbished and Classic(TM) equipment. The company also announced it has secured approximately 30 new customers since the inception of its Refurbished Systems Business...
Read More »Novellus Announces Availability of the Webcast of Its Presentation at Bank of America's 37th Annual Investment Conference
SAN JOSE, Calif., Sept. 4 /-- Novellus Systems, Inc. (NASDAQ:NVLS), today announced that William H. Kurtz, Novellus' executive vice president and chief financial officer and Jeffrey C. Benzing, Novellus' executive vice president and chief business officer, will present on Tuesday, September 18, 2007, at Bank of America's 37th Annual Investment Conference. The presentation will begin at 10:30 a.m....
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