YINCAE Advanced Materials, LLC

Adhesives & Sealants

BP 256 Ball Attach Adhesive

(Albany, NY) January 13, 2017 - BP 256 is YINCAE’s new ball attach adhesive product. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning processes for LEAD-FREE ball bumping procedures on CSP, BGA, Flip chip, and PoP devices. It is compatible with current ball bumping processes. BP 256 is generally applied via printing or pin transfer methods and can replace...

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Materials

Challenges of Miniaturization: Thermal Management

The semiconductor industry works continuously on making devices following Moore's Law, which states that the density of components will double every two years. This miniaturization has caused devices to become less effective at dealing with heat. Traditional methods are no longer viable as they are incapable of providing the necessary heat transfer. YINCAE has developed thermal management...

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Adhesives & Sealants

SEMICON WEST 2016 is 2 Weeks Away, Visit YINCAE Booth 6448

Albany, NYÂ- – The SEMICON West 2016, North America’s premier Microelectronics event is less than two weeks away! SEMICON West 2016 will be held at the Moscone Center in San Francisco, CA from July 12th to 14th. We sincerely invite you to stop by our Booth 6448 to learn more about YINCAE Advanced Materials.  YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and...

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Adhesives & Sealants

YINCAE at ECTC in Las Vegas in 2 weeks!!

ECTC is 2 weeks away! VISIT YINCAE BOOTH 506 June 1st to June 2nd Albany, NY – ECTC is 2 weeks away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV, June 1st and 2nd. YINCAE hopes you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer.Â-  YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and...

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Adhesives & Sealants

ECTC is 1 Month Away! Visit Yincae Booth # 506 May 31st to June 3rd

ECTC is 1 MONTH AWAY! VISIT YINCAE BOOTH # 506 May 31st to June 3rd Albany, NY – ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer. YINCAE offers a variety of exclusive Adhesives, Thermal Interface,...

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Adhesives & Sealants

YINCAE Advanced Materials Wins Global Technology Award at Productronica for World's First Solder Joint Encapsulant

Albany, NY – YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2015 Global Technology Award in the adhesives, coatings, and encapsulants category! This ceremony took place on Tuesday, November 10th at the Productronica Global Exhibition in Munich, Germany. YINCAE Solder Joint Encapsulant was recognized as one of the products that made the greatest impact on...

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Adhesives & Sealants

YINCAE President, Dr. Wusheng Yin, Presents: "The Future of Solder Joint Encapsulation" IPC Tech Summit 2014 in Raleigh, NC

Albany, NYÂ- – Dr. Wusheng Yin, President of YINCAE Advanced Materials LLC, will be presenting in the Technical Session on The Future of Solder Joint Encapsulation" at the upcoming IPC Tech Summit, with the event being held from Oct 28th to 30th in Raleigh, NC. Following is the Abstract taken from the paper on "The Future of Solder Joint Encapsulation" "Solder joint encapsulant adhesives...

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Adhesives & Sealants

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Albany, NYÂ- – YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant. YINCAE's BP 256 is for BGA, CSP, Flip Chip, POP, and other ball bumping applications. The BP 256 can enhance solder joint reliability and eliminate solder joint cracking in microchip applications,...

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