Soitec, Inc.

Electrical Equipment & Systems

Soitec Announces Industrial Readiness of Complete Fully Depleted (FD) Platform - Key to Higher Performance for Mobile Consumer Devices

New Platform Enables Planar FD Technology, the Only Planar Solution to Sustain Moore's Law SEMICON WEST TRADE SHOW, SAN FRANCISCO, -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company is ready with the Ultra-Thin Buried Oxide (UTBOX) extension to its Ultra-Thin (UT) silicon-on-insulator...

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Electronic Components & Devices

High-Resistivity SOI Substrates meet cell phone, WiFi needs.

Serving cellular phone and WiFi markets, high-resistivity (HR) silicon-on-insulator (SOI) substrates exhibit stabilized base wafer resistivity to meet all cellular electrical specifications. Smart Cut technology is used to integrate high-resistivity base wafer, enabling low signal absorption below oxide. Manufactured in 200 mm, HR SOI substrates offer greater than 1 kOhm/cm resistivity. Another...

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