Soitec, Inc.
Peabody, MA 01960
Soitec Announces Industrial Readiness of Complete Fully Depleted (FD) Platform - Key to Higher Performance for Mobile Consumer Devices
New Platform Enables Planar FD Technology, the Only Planar Solution to Sustain Moore's Law SEMICON WEST TRADE SHOW, SAN FRANCISCO, -- The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company is ready with the Ultra-Thin Buried Oxide (UTBOX) extension to its Ultra-Thin (UT) silicon-on-insulator...
Read More »High-Resistivity SOI Substrates meet cell phone, WiFi needs.
Serving cellular phone and WiFi markets, high-resistivity (HR) silicon-on-insulator (SOI) substrates exhibit stabilized base wafer resistivity to meet all cellular electrical specifications. Smart Cut technology is used to integrate high-resistivity base wafer, enabling low signal absorption below oxide. Manufactured in 200 mm, HR SOI substrates offer greater than 1 kOhm/cm resistivity. Another...
Read More »Substrates supports sub-45 nm applications and architectures.
Fabricated using Smart Cut(TM) process, ultra-thin top silicon and ultra-thin Buried Oxide meet advanced requirements in terms of defectivity, flatness, and silicon-on insulator thickness control of up to -
Read More »SOI Enables New Generations of Lower-Power Consumption Devices
SOI Poised for Further Adoption as Semiconductor Industry Tackles Energy Conservation and Consumption Challenges SAN FRANCISCO, July 17 - SEMICON WEST - Soitec (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) wafers and other engineered substrates, today announced it is intensifying its focus to ensure that the low-power advantages of SOI are accessible to...
Read More »