Goepel Electronics LLC

Test & Measurement

GOEPEL Electronic Establishes Boundary Scan Technology in Asia

GOEPEL electronic announces another strategic partnership in the Asian region, by the inclusion of the Chinese technology company Pansino Solutions, into the GATE Alliance Program (GOEPEL Associated Technical Experts). The main focus of the cooperation is special application development and practical implementation of new JTAG/Boundary Scan solutions as well as their integration into existing...

Read More »
Test & Measurement

New Distribution Cooperation for French Market between GOEPEL Electronics and Orion Industry

GOEPEL electronics introduces a new distribution partner for sales of Automatic Optical (AOI) and Automatic X-ray Inspection (AXI) systems on the French market. The company named Orion Industry, located in the region Ã-Žle-de-France, is now responsible for the distribution of inspection systems from GOEPEL electronics. GOEPEL electronics have a strong presence in the French market with its...

Read More »
Electronic Components & Devices

Emulation Technology supports TI TMS570LSxx processor compatibility.

VarioTAP® technology, used for universal processor emulation, is available for Texas Instruments TMS570LSxxÂ- models of Hercules™ series. Processor is configured to provide design-integrated test and programming instruments via native debug port. As part of IP library, VarioTAP® model contains all relevant access information for respective target processor. Users can,...

Read More »
Electronic Components & Devices

Universal Processor Emulation is available for TI AM355x series.

VarioTAP® technology is available for universal processor emulation for Texas Instruments AM355x products of Sitara™ series. Configuration provides design-integrated test and programming instruments via native debug port. Respective VarioTAP® model, as part of IP library, contains all relevant access information for respective target processor. Users can select processor...

Read More »
3D Inspection System is capable of sintering paste evaluation.
Software

3D Inspection System is capable of sintering paste evaluation.

WithÂ- hardware and software adaptions, SPI-LINE 3D electronic solder paste inspection system handles inspection of printed sintering paste in electronic assemblies manufacturing. High-speed 3D camera head can capture thin sintering paste layers with precision, while integrated algorithms enable evaluation of sintered paste printing in addition to accurate and rapid measurement of height,...

Read More »
Software

ISP Flash Program Generator conserves time and effort.

Supporting all ISP (In-System Programming) options, Automated Flash Program Generator (AFPG) automatically generates scripts for universal ISP of non-volatile memory, such as flash devices, and MCUs with integrated flash via boundary scan. Mounted devices are programmed in native environment instead of as individual components before assembly. Tool providesÂ- graphical definition of command...

Read More »
Boundary Scan Module facilitates DDR3-DIMM socket testing.
Test & Measurement

Boundary Scan Module facilitates DDR3-DIMM socket testing.

Once plugged into test socket, CION Module SO-DIMM204-3/ECCÂ- allows structural test coverage of DDR3 memory interfaces. All signal pins, as well as almost all Ground-Pins, can be tested via Boundary Scan. Equipped with CION™ Boundary Scan ASIC, module can be connected to any Test Access Point (TAP) and lets user detect link failures. Tests take fractions of seconds, and even...

Read More »
AOI Series with Shadow-Free 3D Measurement Technology
Test & Measurement

AOI Series with Shadow-Free 3D Measurement Technology

The AOI systems of the OptiCon family made by GOEPEL electronic extend their dimension with a revolutionary measurement technology and have evolved to become the 3D Series". The first OptiCon Advanced Line 3D will be presented at the SMT/Hybrid/Packaging show.Â-  The telecentric measuring procedure for three-dimensional detection of components and solder joints represents a significant...

Read More »
Software

Embedded Instruments automate differential clock signal test.

Used for universal frequency measurement based on FPGA soft macros, ChipVORX® models consist of modular IP capable of controlling chip embedded instruments. Products allow FPGA-assisted testing of differential clock signals as well as measurement of frequencies directly inside system application. This lets user verify dynamics of signals and increase test coverage, where workflow is fully...

Read More »
FPGA Embedded Instruments support multi-channel BERT.
Test & Measurement

FPGA Embedded Instruments support multi-channel BERT.

Offering IP-based technology for implementation, access, and control of chip embedded instruments via IEEE Std. 1149.x/JTAG, ChipVORX® also supports FPGA embedded instruments in form of softcores. System takes over complete process flow, including Target FPGA programming, IP to pin configuration, instrument control, data processing, and final IP unloading. Users can evaluate transmission...

Read More »

All Topics