BSET Plasmas
Antioch, CA 94509
Plasma Decapsulation System uses CO2 to remove fillers.
Able to process wafers as large as 200 mm, FA-2000 Fillerblast(TM) system is suited for decapsulation and depassivation of packaged devices with metallization in ICs and organic substrates in packaging. Reactive ion etcher eliminates use of wet acids. Manifold forms dry ice, which acts as fine abrasive effective in removing filler buildup, while plasma maintains constant etch rate for efficient...
Read More »Plasma Decapsulation System uses CO2 to remove fillers.
Able to process wafers as large as 200 mm, FA-2000 Fillerblast(TM) system is suited for decapsulation and depassivation of packaged devices with metallization in ICs and organic substrates in packaging. Reactive ion etcher eliminates use of wet acids. Manifold forms dry ice, which acts as fine abrasive effective in removing filler buildup, while plasma maintains constant etch rate for efficient...
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