Foveon, Inc.
San Jose, CA 95131
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Foveon Announces New Image Sensor Manufacturing Partner: Dongbu Electronics of Seoul, South Korea
Foveon and Dongbu Electronics team up to deliver world's most advanced CMOS image sensors Santa Clara, CA, September 26, 2006 - Foveon, a leading U.S. fabless image sensor company, announced today that it has released the first product manufactured by its new strategic manufacturing partner, Dongbu Electronics of Seoul, South Korea. The new 14.1 megapixel X3 DSLR image sensor is the highest...
Read More »High-Resolution Sensor is suited for digital cameras.
For optimal information density of recorded image, 14.1 megapixel X3 DSLR image sensor stacks red, green, and blue (RGB) pixels vertically. It features 14.1 million pixels, each 7.8 Ã-µm in size, in 3D array of 2,652 x 1,768 x 3 pixels with active image area of 20.69 x 13.79 mm. Sensor can be read out at speeds up to 5 fps.
Read More »
Image Sensor employs X3 stacked pixel design.
Model FO18-50-F19 is a 1/1.8 in., 4.5 megapixel, CMOS direct image sensor that incorporates X3 technology to directly capture color in 3 layers. Each stack of pixels containes a red, green, and blue pixel, eliminating need for color interpolaton and blur filters. Variable Pixel Size technology groups neighboring pixels together to form larger pixels that are optimal for high frame rate and dual...
Read More »Foveon Announces New Image Sensor Manufacturing Partner: Dongbu Electronics of Seoul, South Korea
Foveon and Dongbu Electronics team up to deliver world's most advanced CMOS image sensors Santa Clara, CA, September 26, 2006 - Foveon, a leading U.S. fabless image sensor company, announced today that it has released the first product manufactured by its new strategic manufacturing partner, Dongbu Electronics of Seoul, South Korea. The new 14.1 megapixel X3 DSLR image sensor is the highest...
Read More »High-Resolution Sensor is suited for digital cameras.
For optimal information density of recorded image, 14.1 megapixel X3 DSLR image sensor stacks red, green, and blue (RGB) pixels vertically. It features 14.1 million pixels, each 7.8 Ã-µm in size, in 3D array of 2,652 x 1,768 x 3 pixels with active image area of 20.69 x 13.79 mm. Sensor can be read out at speeds up to 5 fps.
Read More »
Image Sensor employs X3 stacked pixel design.
Model FO18-50-F19 is a 1/1.8 in., 4.5 megapixel, CMOS direct image sensor that incorporates X3 technology to directly capture color in 3 layers. Each stack of pixels containes a red, green, and blue pixel, eliminating need for color interpolaton and blur filters. Variable Pixel Size technology groups neighboring pixels together to form larger pixels that are optimal for high frame rate and dual...
Read More »