Engineered Material Systems

Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America
Adhesives & Sealants

Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America

DELAWARE, OH - July 2016 - Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline...

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Dry Film Negative Photoresist suits MEMS/CMOS applications.
Paints & Coatings

Dry Film Negative Photoresist suits MEMS/CMOS applications.

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3010 Dry Film Negative PhotoresistÂ- is available in thickness formats from 5–50 µm, ±5%. Film offers glass transition temperature of 158°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa at 25°C. Hydrophobic in nature, product can withstand harsh environments including extreme...

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Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference
Optics & Photonics

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

DELAWARE, OH - Engineered Materials Systems, Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series...

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Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC
Adhesives & Sealants

Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC

DELAWARE, OHÂ- – Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus...

Read More »
Negative Photoresist offers chemical and moisture resistance.
Paints & Coatings

Negative Photoresist offers chemical and moisture resistance.

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3050 Dry-film Negative Photoresist is available in thickness formats from 5–50 Â-µm, ±5%. Cured chemistry can withstand harsh environments including extreme moisture conditions and corrosive chemicals. With glass transition temperature of 158°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa...

Read More »
Conductive Adhesive is used for stringing solar modules.
Adhesives & Sealants

Conductive Adhesive is used for stringing solar modules.

Intended for stringing applications in crystalline silicon and thin-film solar modules, EMS 561-403 Snap Cure Conductive Adhesive is designed to electrically interconnect solar cells using ribbons. Stress-absorbing adhesive withstands thermal cycling effects and exhibits conductive stability to cell and ribbon metallization during damp heat exposure. Ability to cure within seconds at 180°C or...

Read More »
Conductive Adhesive suits solar modules applications.
Adhesives & Sealants

Conductive Adhesive suits solar modules applications.

Intended for stringing or shingling crystalline silicon and thin-film solar modules, EMS 561-147-2 electrically interconnects solar cells using ribbons or direct cell to cell contact. Stress absorbing capabilities withstand effects of thermal cycling, and other features include conductive stability to cell and ribbon metallization during damp heat exposure. Curing within seconds at 180°C or...

Read More »
Conductive Adhesive features low-temperature cure.
Adhesives & Sealants

Conductive Adhesive features low-temperature cure.

Designed for die attach and general circuit assembly applications, CA-180 cures in 30 min at 80°C,Â- 3 min at 100°C or 10 sec at 150°C with electrical conductivity of 4 x 10-5 ohm-cm. This low-temperature cure conductive adhesive has 48 hr work life and 12,000 cP viscosity at 5 rpm for facilitated needle dispensing or application by pin...

Read More »
Engineered Materials Systems, Inc. to Exhibit DF-3000 Series Negative Film Photoresists at ECTC 2015
Optics & Photonics

Engineered Materials Systems, Inc. to Exhibit DF-3000 Series Negative Film Photoresists at ECTC 2015

DELAWARE, OHÂ- – Engineered Materials Systems (EMS), Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit in Booth #202 at ECTC 2015, scheduled to take place May 26-29, 2015 at the Sheraton Hotel and Marina in San Diego, CA. Company representatives will showcase its DF-3000 Series Negative Film Photoresists. The DF-3000 series is available in various...

Read More »
Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America
Adhesives & Sealants

Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America

DELAWARE, OH - July 2016 - Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline...

Read More »
Dry Film Negative Photoresist suits MEMS/CMOS applications.
Paints & Coatings

Dry Film Negative Photoresist suits MEMS/CMOS applications.

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3010 Dry Film Negative PhotoresistÂ- is available in thickness formats from 5–50 µm, ±5%. Film offers glass transition temperature of 158°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa at 25°C. Hydrophobic in nature, product can withstand harsh environments including extreme...

Read More »
Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference
Optics & Photonics

Engineered Materials Systems to Exhibit DF-1000 Series Negative Film Photoresists at 3D ASIP Conference

DELAWARE, OH - Engineered Materials Systems, Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit at the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition, scheduled to take place December 15-17, 2015 at the Sofitel San Francisco bay Hotel in Redwood City, CA. Company representatives will showcase the DF-1000 Series...

Read More »
Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC
Adhesives & Sealants

Engineered Material Systems to Show Its New Conductive Adhesive for Stringing HIT and Multi Bus Bar Solar Modules at EU PVSEC

DELAWARE, OHÂ- – Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus...

Read More »
Negative Photoresist offers chemical and moisture resistance.
Paints & Coatings

Negative Photoresist offers chemical and moisture resistance.

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3050 Dry-film Negative Photoresist is available in thickness formats from 5–50 Â-µm, ±5%. Cured chemistry can withstand harsh environments including extreme moisture conditions and corrosive chemicals. With glass transition temperature of 158°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa...

Read More »
Conductive Adhesive is used for stringing solar modules.
Adhesives & Sealants

Conductive Adhesive is used for stringing solar modules.

Intended for stringing applications in crystalline silicon and thin-film solar modules, EMS 561-403 Snap Cure Conductive Adhesive is designed to electrically interconnect solar cells using ribbons. Stress-absorbing adhesive withstands thermal cycling effects and exhibits conductive stability to cell and ribbon metallization during damp heat exposure. Ability to cure within seconds at 180°C or...

Read More »
Conductive Adhesive suits solar modules applications.
Adhesives & Sealants

Conductive Adhesive suits solar modules applications.

Intended for stringing or shingling crystalline silicon and thin-film solar modules, EMS 561-147-2 electrically interconnects solar cells using ribbons or direct cell to cell contact. Stress absorbing capabilities withstand effects of thermal cycling, and other features include conductive stability to cell and ribbon metallization during damp heat exposure. Curing within seconds at 180°C or...

Read More »
Conductive Adhesive features low-temperature cure.
Adhesives & Sealants

Conductive Adhesive features low-temperature cure.

Designed for die attach and general circuit assembly applications, CA-180 cures in 30 min at 80°C,Â- 3 min at 100°C or 10 sec at 150°C with electrical conductivity of 4 x 10-5 ohm-cm. This low-temperature cure conductive adhesive has 48 hr work life and 12,000 cP viscosity at 5 rpm for facilitated needle dispensing or application by pin...

Read More »
Engineered Materials Systems, Inc. to Exhibit DF-3000 Series Negative Film Photoresists at ECTC 2015
Optics & Photonics

Engineered Materials Systems, Inc. to Exhibit DF-3000 Series Negative Film Photoresists at ECTC 2015

DELAWARE, OHÂ- – Engineered Materials Systems (EMS), Inc., a leading global supplier of negative photoresists for MEMS applications, will exhibit in Booth #202 at ECTC 2015, scheduled to take place May 26-29, 2015 at the Sheraton Hotel and Marina in San Diego, CA. Company representatives will showcase its DF-3000 Series Negative Film Photoresists. The DF-3000 series is available in various...

Read More »

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