AMI Doduco, A Technitrol Co.
Export, PA 15632
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Surface Finishing reduces gold plating thickness.
Offered as surface finishing process for bonding gold and aluminum wire to PCBs, DODUBOND can reduce thickness of gold plating to less than 0.1 Ã-µm. One gold layer as thin as 50 nm can be enough to obtain firm bond. Based on DODUCHEM chemical nickel/gold surface finishing, process inserts very thin palladium diffusion barrier between nickel and gold to effectively prevent nickel from...
Read More »Surface Finishing reduces gold plating thickness.
Offered as surface finishing process for bonding gold and aluminum wire to PCBs, DODUBOND can reduce thickness of gold plating to less than 0.1 Ã-µm. One gold layer as thin as 50 nm can be enough to obtain firm bond. Based on DODUCHEM chemical nickel/gold surface finishing, process inserts very thin palladium diffusion barrier between nickel and gold to effectively prevent nickel from...
Read More »AMI DODUCO Paper Stresses the Need for Close Engineering Collaboration with Customers at the 5th China International Silver Conference
24-Oct-2006 TIANJIN, Peoples Republic of China - AMI DODUCO, a Technitrol (NYSE:TNL) Company presented a paper reviewing 50 years of advancements in industrial applications of silver at the 5th China International Silver Conference, held in Panyu, Guangdong Province, China, on September 28 - 30, 2006. The paper, Achievements in the Research and Development of Silver-based Alloys for Electrical...
Read More »AMI DODUCO Electronica Exhibit Will Stress Technical Solutions for Cutting Precious Metal Costs of Contact Systems
13-Nov-2006 Pforzheim, Germany - AMI DODUCO, a Technitrol(NYSE:TNL) company, will demonstrate its comprehensive range of products an services in contact and surface technology at the international Electronica trade fair for components, systems and applications in electronics, to be held November 14-17, 2006 in Munich. In addition to exhibiting tried-and-tested products and procedures,...
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