austriamicrosystems AG    Schloss Premstaetten A 8141  Austria
May 11, 2012 With 0.35 µm High-Voltage CMOS fabrication service, austriamicrosystems offers latch up-free ESD protection up to 8 kV at 50 V and up to 4 kV at 120 V operating voltage in integrated circuits fabricated on H35 process. ESD protection cells guarantee 1 kV, 2 kV, 4 kV, and 8 kV HBM ESD protection compliant with MIL-883H, Method 3015.8, JEDEC JESD22-A114F ESD, and AEC-Q100 standards, as well as protection up to 500 V according to Charged Device Model.

IMR Test Labs    Lansing, NY 14882
May 09, 2012 Applicable to parts with simple geometries, such as shafts, fasteners, and springs, IMR Test Labs offers one week turnaround service for basic failure analysis. This enables material or production problems to be corrected on accelerated basis. Materials testing laboratory features approvals by Nadcap (NY, OR); A2LA (NY, KY, OR); SAC (SPR); Pratt and Whitney MCL (NY, OR, SPR); and GE S-400 (NY, KY, OR, SPR). Independent analytical services cover metals, polymers, composites, and ceramics.

Abrisa Industrial Glass, Inc.    Santa Paula, CA 93060
Dec 14, 2011 Heat and vacuum shrunk glass and quartz tubing up to 6 in. dia can be delivered to ID tolerances up to ±0.0002 in. on precision stainless steel and molybdenum mandrels. Vertical and horizontal shrinking lend to precise product control over tubes in lengths to 144 in. Fabricators can process assortment of raw materials in various combinations, and concentric and centerless grinding can be performed to same precision tolerances as ID work. Various finishing and other options are available.

Konecranes Americas, Inc.    Springfield, OH 45502
Nov 15, 2011 Performed by team of trained specialists, Crane Reliability Survey provides engineering assessment to generate information about current condition and future maintenance needs of cranes. Team uses advanced diagnostic tools to uncover problems that are undetectable by standard equipment inspections to prevent accidents from occurring. Results of survey are presented in comprehensive report that outlines condition of crane and provides estimate of remaining life.

JVD Inc    San Jose, CA 95131
Oct 13, 2011 Capable of supplying small to medium quantities, JurASIC Parts Program focuses on bringing obsolete and NLA (no longer available) Analog ICs back into production to meet needs of older commercial and military applications. Process information and masks sets can be obtained from original manufacture, or parts can be re-engineered from scratch. To ensure compatibility, engineers analyze behavior of original designs and incorporate even small abnormalities they may contain into reproduction.

Glocon, Inc. (Swifter Fans)    Parsippany, NJ 07054
Jul 25, 2011 With Custom Industrial Fan Manufacturing Services, large fan blades up to 40 ft diameter can be molded out of solid or hollow fiberglass/composite materials. Smaller fans and blowers can be made out of aluminum or other metal alloys, and existing metal fans can be converted to fiberglass/composite. In addition, Glocon can manufacture ancillary fan assembly components such as fan shrouds, fan covers, fan hubs, and fan stacks.

IMR Test Labs    Lansing, NY 14882
Mar 10, 2011 Featuring Nadcap and A2LA accreditation, Fracture Mechanics Testing calculates relationship between applied loading, environmental factors, presence of cracks and crack-like defects, and inherent properties of material used in components to prevent failure in-service. Testing is utilized in aerospace, construction, and power generation industries. Using MTS Fatigue Frames and Data Analysis software, experts can handle test plans ranging from common requirements to custom specifications.

Advantech    Fremont, CA 94539
Feb 28, 2011 ATCA Platform Integration Services create customized ATCA platforms to meet application-specific needs of Telecom Equipment Manufacturers and Network Solution Providers. In addition to Advantech blade and platform technology, service leverages third-party hardware and software: chipset, board, chassis, operation system, and middleware. Designs are based upon and optimized for project, technology, logistic, and geographic requirements.

austriamicrosystems AG    Schloss Premstaetten A 8141  Austria
Nov 29, 2010 Multi-Project Wafer (MPW) services include 6 prototyping runs in 0.18 µm CMOS (C18) process and 4 MPW runs in 0.18 µm high-voltage CMOS (H18) technology. H18 process technology is based on IBM 0.18 µm CMOS CMOS7RF process and is suited for smart power management ICs, while 0.35 µm specialty processes from TSMC is suited for power management products and display drivers. Other options include 20 and 50 V CMOS, 120 V module, and high-voltage CMOS process with Embedded Flash functionality.

ON Semiconductor, LLC    Phoenix, AZ 85008
Jul 09, 2010 Building upon HighQ(TM) copper on silicon integrated passive device (IPD) technology, HighQ IPD2 process utilizes 8 in. wafer technology and features second 5 µm copper layer that promotes inductor performance and flexibility. It supports design of precise IPDs for RF system in package applications in portable electronics equipment. Typical designs include baluns, low pass filters, band pass filters, and diplexers used in portable and wireless applications.

Adept, Inc.    Glen Cove, NY 11542
May 19, 2010 Responsible for creating foil seal found beneath cap of many pharmaceuticals, Induction Cap Sealer requires no active cooling. System utilizes controlled heat management and incorporates heat pipes to counteract large amounts of heat that is inherently produced by induction heat equipment.

Interphase Corp.    Dallas, TX 75234
May 19, 2010 Enabled by highly skilled engineers, Engineering Design Services (EDS) accommodate those looking for expert advice on tightening their own embedded design or seeking turnkey concept-to-production service. Full-service Electronics Contract Manufacturing (ECM), also available, continually meets/exceeds contract manufacturing requirements for boards, sub-assemblies, and systems using quality processes in ISO-9001, TL-9000, and ISO-14000 certified facilities.

Creaform Inc.    Levis G6V 6K9  Canada
Feb 18, 2010 With VxScan v4, data acquired by both Handyscan 3D laser scanner and HandyPROBE armless and portable CMM can be integrated in same referential and in real-time. Program can create geometrical entities such as planes, lines, points, spheres, cylinders, or circles directly from scanning or probing data. Entities may then be saved in format that allows direct exporting into most reverse engineering and CAD software.

Central Maintenance & Welding, Inc.    Lithia, FL 33547
Sep 11, 2009 Serving multiple industries, Central Engineering assists with major capital projects and routine plant maintenance engineering jobs. It can also work with owner's technology provider to integrate new and existing equipment/processes. Expertise envelops mechanical, electrical/controls, process/chemical, and structural/civil engineering disciplines. Ranging from studies/estimate to startup/commissioning, services include engineering, analysis, procurement, and project management.

Weiss-Aug Co., Inc.    East Hanover, NJ 07936
Sep 02, 2009 Service aims to design engineering programs that produce defect-free product. Able to address multiple disciplines to support every facet of project, design and engineering teams are structured to provide custom support for specific programs. Service brings together team comprised of engineers, program managers, tool makers, and mold makers that assist in developing design. Program managers monitor every step of program, while service also aids component consolidation/simplification.

SYCODE    Alto Porvorim 403521  India
Mar 04, 2009 Designed to work with Professional and Classic versions of Bricscad V8 and V9, Point Cloud for Bricscad enables users to reverse engineer 3D digital models from physical parts and scan data. Program can be used to drape surface along particular direction or wrap mesh around point cloud to create watertight model. While wrapping mesh around point cloud, plug-in treats concave and convex meshes differently, thereby giving user control over final surface mesh.

congatec AG    Deggendorf   Germany
Feb 25, 2009 Comprised of hardware and software, conga-ARkit lets manufacturers integrate PLC functionality in their applications. Hardware consists of conga-QA 7 x 7 cm Qseven CoM with Intel® Atom(TM) Processor Z530, which provides capable, future-oriented interfaces and can simultaneously run 2 separate OSs due to hyper-threading and virtualization support. Kit also includes evaluation carrier board, providing access to all Qseven interfaces through standard connectors.

Dayton T. Brown, Inc., Engineering & Test Div.    Bohemia, NY 11716
Feb 18, 2009 Environmental testing and simulation services are offered through 30+ combined temperature/humidity chambers with electro-dynamic vibration facilities. Largest (25 x 15 x 15 ft drive-in) environmental test chamber is coupled with 240+ hp refrigeration, 240,000 KVA heat, and 42 KVA Steam Generator. RH can range from 2-100% in any test chamber, and metallurgical product testing services are also available. Vibration facilities handle 18,000 lbf loads, with frequencies up to 2,000 Hz.

Alltec Corporation    Canton, NC 28716
Dec 10, 2008 Part of Protection Pyramid® program for facility protection, TerraEval® Advanced Solution Assessment engineering service performs on-site testing to determine soil resistivity and grounding conditions specific to area. Engineering department uses information to generate performance evaluation models utilizing Win IGS® and CDEGS® Grounding Analysis software. Design is fully documented using AutoCAD®, creating grounding system uniquely suited to each client's specifications.

QNX Software Systems, Ltd.    Kanata, ON K2M1W8
Oct 27, 2008 Targeting automotive Tier One suppliers and OEMs, QNX Automotive Solutions program offers team of QNX engineers who work closely with customer development teams during planning and design phases to ensure that projects start and finish on time and on budget. Services include architecture reviews and recommendations, technology prototyping, developing and optimizing device drivers, improving boot times, reducing memory use, and optimizing CPU usage.