Wafer Transferring Tools

Material Handling & Storage, Chemical Processing & Waste Management, Mounting & Attaching Products

Spin Rinse Dryers eliminate spray nozzle replacement.

July 15, 2014

Utilizing Deluge technology to deliver continuous cascade of rinse water, Trident™ SRD Tools provide full PLC control with color touchscreen displays. Systems feature ultra-pure non-contact N2 heaters, full wrap-around bowl heaters, direct-drive brushless motors, negative-pressure motor seals, and FM4910 compliance. Offered in bench-top, roll-around, single-stack, and double-stack models, tools can process batches of up to 50 substrates, in sizes from 75–300 mm. Read More

Chemical Processing & Waste Management, Mounting & Attaching Products

Wafer Vacuum System employs long-life diaphragm pump.

April 24, 2013

Able to handle range of wafers, solar cells, and other substrates, WAFER-VAC system with 8 in. molded wafer tip (WV-9000-MW8) is Class 100 Cleanroom safe and plugs directly into 110 V, 50/60 Hz. Wafer vacuum handling tool employs long-life diaphragm vacuum pump that generates up to 10 in. of mercury with open air flow of 2.3 Lpm. Provided with push-button wafer tip pen and 6 ft of clear coiled vacuum hose, 7 ¼ x 3 x 2 ½ in. unit connects to ground automatically with 3-wire power cord. Read More

Material Handling & Storage, Laboratory and Research Supplies & Equipment, Mounting & Attaching Products

Wafer Vacuum Handling System accommodates variety of parts.

June 13, 2012

Used for handling wafers and solar cells, WV-9000 WAFER-VAC System does not require any in-house air plumbing and plugs directly into 110 V, 50/60 Hz supply. General-purpose tool has diaphragm vacuum pump that generates up to 10 in. Hg with open air flow of 2.3 lpm. ESD-safe unit is also Class 100 Clean room safe and connects to ground automatically with 3-wire power cord. Illuminated on/off switch, pushbutton wafer tip pen, and 6 ft clear coiled vacuum hose come standard. Read More

Material Handling & Storage, Machinery & Machining Tools, Mounting & Attaching Products

Wafer Handling System boosts high-volume manufacturing performance.

December 8, 2011

Addressing high-volume manufacturing (HVM) requirements, XT Frame accommodates up to 9 process modules and delivers flexibility by accommodating various combinations on single tool platform. Features include equipment front-end module with speed-optimized handling system, enough module spaces for parallel processing of several wafers, as well as up to 4 FOUP (front opening unified pod) load ports. Additionally, local FOUP storage system allows efficient, continuous mode operation. Read More

Test & Measuring Instruments, Mounting & Attaching Products

Wafer Handler improves microelectronics industry yield.

August 17, 2010

In addition to offering 360° rotation for full macro examination of wafer's back surface and edges, AL120(TM) can transfer 100-200 mm dia wafers with thicknesses down to 90 µm to meet demands of thin-wafer manufacturing. Recipe-driven tool can be programmed for different configurations, while pushbutton recipe selection allows operator to load different products instantly. System can also be adapted for smaller-diameter wafers and used with non-Olympus microscope models on custom basis. Read More

Robotics, Mounting & Attaching Products

Non-Contact Solar Wafer End Effector handles thin solar cells.

July 28, 2010

Utilizing Non-Contact Transfer units (NCT), End Effector creates dynamic lifting force using positive airflow to handle solar PV wafers without physical contact with their surface. Edge guides align and constrain wafer during transport, while presence sensor enables constant detection and feedback for integration with SCARA, 6-axis, or Cartesian robots. Unit is available for 156 mm polycrystalline and multi-crystalline solar cells, and handles and transports wafers from 50-300 µm thick. Read More

Test & Measuring Instruments, Mounting & Attaching Products

Wafer Loader can handle wafers as thin as 100 µm.

July 31, 2008

Using chuck system to transfer wafers and featuring optimized arrangement of sensor beams, NWL200 Series Wafer Loader achieves reliable loading for inspection of semiconductors. Wafer-slot buttons on front panel enable users to select specific wafer in any slot with touch of a button, while large LCD screen allows operators to set conditions and check operating status. Users can also program recipes and backup data from any PC when loader is connected to LAN. Read More

Material Handling & Storage, Robotics, Mounting & Attaching Products

Robot System provides precise, repeatable wafer handling.

November 6, 2003

Automated edge-grip system provides safe 300 mm wafer handling. Smart robot can see and measure environment with built-in optical sensor in end-effector and self-teach functionality. It detects wafer presence, measures wafer position, and calculates wafer center with 0.005 in. accuracy. Wafer is picked up and moved back before precisely controlled actuator is deployed to secure wafer against rest pads on end of gripper. Read More

Mounting & Attaching Products

Wafer Handling Module suits semiconductor process tools.

October 2, 2003

Apex platform combines direct-drive AWARD wafer handling robot with SmartServo distributed controls architecture based on IEEE-1394 serial bus. It handles wafer sizes up to 300 mm, configurable with any combination of open cassette, SMIF, and FOUP loadports. SmartController provides direct interface to existing process tools via ASCII and GEM/SECS command interfaces. System supports vacuum and edge-grip end-effectors, thru-beam wafer mapping, and wafer alignment. Read More

Mounting & Attaching Products

Wafer-Handling System is SMEMA compliant.

January 16, 2003

Fully automated Adept WLM, for SMEMA compatible screen/stencil printers, supports wafer sizes up to 300 mm, including thinned wafers. Modular system can be expanded and reprogrammed for use as back-end cluster tool by adding wafer interface for reflow oven or other process tools. System supports optional wafer and lot tracking, and has 14 in. monitor and keyboard with integrated GUI. It is suitable for wafer bump and semiconductor ball placement applications. Read More

Material Handling & Storage, Mounting & Attaching Products

Single-Reticle Pod transports and stores 150 mm reticles.

July 31, 2002

RSP-150 SMIF-POD(TM) features metal-free, gasket-sealed construction minimizing opacity, particle contamination, and drying time, while maximizing cleanability without disassembly. Streamlined design increases storage density. Optional AdvanTag(TM) tracking system with integrated RFID ties into socket built into unit to enable snap-on use of RFID transponder pill. For use in 300 mm fabs, optional CoolCase(TM) material provides flame and smoke retardance. Read More

Mounting & Attaching Products

Wafer Loader includes 14 in. monitor and keyboard.

June 10, 2002

Adept Wafer Loader fully automated wafer handling solution suits SMEMA compatible screen/stencil printers that support wafer sizes to 300 mm, including thinned wafers. Designed for bump and semiconductor ball placement applications, loader offers scalable performance, managed process transitions, and modular design. System can be expanded and reprogrammed for use as back-end cluster tool, and supports optional wafer and lot tracking. Read More

Material Handling & Storage, Mounting & Attaching Products

Load Port handles 300 mm semiconductor wafers.

April 25, 2002

Automated IsoPort(TM) has front-opening-unified-pod (FOUP) tool carrier interface, servo-controlled motion, latchkey, and carrier sensing. Tool throughput is 8 sec, from carrier arrival to first-wafer access. Contamination control conforms to ISO Class 1 particle level, and eliminates triboelectric charge buildup on carrier door. Optional gas purge ports provide an inert ambient environment for wafers in the carrier on the load port. Read More

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