Nikon Inc.
Melville, NY 11747
Jul 31, 2008 Using chuck system to transfer wafers and featuring optimized arrangement of sensor beams, NWL200 Series Wafer Loader achieves reliable loading for inspection of semiconductors. Wafer-slot buttons on front panel enable users to select specific wafer in any slot with touch of a button, while large LCD screen allows operators to set conditions and check operating status. Users can also program recipes and backup data from any PC when loader is connected to LAN.

Owens Design, Inc.
Fremont, CA 94538
Nov 29, 2007 Designed to meet Semi S2 and S8 requirements, Atlas platform uses industry-standard 300 mm/200 mm capable EFEM to align and transfer wafers from loadports to inspection station at rates to 180 wph. Solution is designed to allow for wafer level thermal and vibration isolation, providing controlled environment for tool-to-tool matching. Connectivity software as well as integrated power distribution and control system with GUI are included. Customization options are available.

SUSS MicroTec Inc.
Yokohama   Japan
Aug 14, 2007 ELAN CBC300SOI 300 mm SOI wafer bonding system utilizes single-station bond technology, allowing cleaning, aligning, and bonding to occur within single process module. Featuring unibody dual-nozzle megasonic cleaner, system offers programmable IR-assisted spin drying. It includes 2 single-station bond modules, high-resolution IR inspection module, central Material Handling Unit (MHU) with wafer handling robot and pre-aligner, and 2 FOUP loadports.

McBain Instruments, Inc.
Chatsworth, CA 91311
Apr 03, 2007 Compatible with Class 1 cleanrooms, semi-automatic WL150 and WL200 Series handle 3-6 in. and 5-8 in. wafer sizes, respectively. Systems feature smart stepper motors for drive axis, stall and fault detection, linear stages for smooth action, and vacuum touch end effectors with sensing capabilities. Offering user-defined inspection positions, devices include intuitive HMI control box and numeric keypad, and VESA interface for integration with microscopes, optics and inspection devices.

Owens Design, Inc.
Fremont, CA 94538
Mar 17, 2006 Designed for 300 and 200 mm wafers, Wafer Flip Module is compatible with edge grip and vacuum paddle end effectors. It has 2 motors, one for flipping and one for wafer gripper mechanism. Rotation of 180° can be done in less than 2 sec, with clamp speed at less than 1 sec. Flipper is designed so that no particles are detected in wafer path during airborne dynamic motion tests. All motors and motion mechanisms are contained in purged enclosure to eliminate particle generation.

Newport Corp.
Irvine, CA 92606
Nov 06, 2003 Automated edge-grip system provides safe 300 mm wafer handling. Smart robot can see and measure environment with built-in optical sensor in end-effector and self-teach functionality. It detects wafer presence, measures wafer position, and calculates wafer center with 0.005 in. accuracy. Wafer is picked up and moved back before precisely controlled actuator is deployed to secure wafer against rest pads on end of gripper.

Adept Technology, Inc.
San Jose, CA 95134
Oct 02, 2003 Apex platform combines direct-drive AWARD wafer handling robot with SmartServo distributed controls architecture based on IEEE-1394 serial bus. It handles wafer sizes up to 300 mm, configurable with any combination of open cassette, SMIF, and FOUP loadports. SmartController provides direct interface to existing process tools via ASCII and GEM/SECS command interfaces. System supports vacuum and edge-grip end-effectors, thru-beam wafer mapping, and wafer alignment.

Adept Technology, Inc.
San Jose, CA 95134
Jan 16, 2003 Fully automated Adept WLM, for SMEMA compatible screen/stencil printers, supports wafer sizes up to 300 mm, including thinned wafers. Modular system can be expanded and reprogrammed for use as back-end cluster tool by adding wafer interface for reflow oven or other process tools. System supports optional wafer and lot tracking, and has 14 in. monitor and keyboard with integrated GUI. It is suitable for wafer bump and semiconductor ball placement applications.

Asyst Technologies, Inc.
Fremont, CA 94538
Jul 31, 2002 RSP-150 SMIF-PODâ„¢ features metal-free, gasket-sealed construction minimizing opacity, particle contamination, and drying time, while maximizing cleanability without disassembly. Streamlined design increases storage density. Optional AdvanTagâ„¢ tracking system with integrated RFID ties into socket built into unit to enable snap-on use of RFID transponder pill. For use in 300 mm fabs, optional CoolCaseâ„¢ material provides flame and smoke retardance.

Adept Technology, Inc.
San Jose, CA 95134
Jun 10, 2002 Adept Wafer Loader fully automated wafer handling solution suits SMEMA compatible screen/stencil printers that support wafer sizes to 300 mm, including thinned wafers. Designed for bump and semiconductor ball placement applications, loader offers scalable performance, managed process transitions, and modular design. System can be expanded and reprogrammed for use as back-end cluster tool, and supports optional wafer and lot tracking.

Asyst Technologies, Inc.
Fremont, CA 94538
Apr 25, 2002 Automated IsoPort(TM) has front-opening-unified-pod (FOUP) tool carrier interface, servo-controlled motion, latchkey, and carrier sensing. Tool throughput is 8 sec, from carrier arrival to first-wafer access. Contamination control conforms to ISO Class 1 particle level, and eliminates triboelectric charge buildup on carrier door. Optional gas purge ports provide an inert ambient environment for wafers in the carrier on the load port.