Substrates

Electronic Components & Devices, Materials & Material Processing

Vishay Intertechnology to Showcase Leading High-Frequency MLCCs, Wire-Bondable and Surface-Mount Resistors, and Custom Substrates at IMS2016

May 18, 2016

MALVERN, Pa. – Vishay Intertechnology, Inc. (NYSE: VSH) today announced its technology lineup for the 2016 IEEE MTT International Microwave Symposium (IMS2016), being held from May 22-27 at Moscone Center in San Francisco. At the conference and exhibition, the company will be highlighting its latest industry-leading high-frequency multilayer ceramic chip capacitors (MLCCs); surface-mount and... Read More

Machinery & Machining Tools, Materials & Material Processing, Services

NEO Tech to Exhibit Substrate Capabilities and Microelectronic Assembly at IEEE Microwave Symposium

May 18, 2016

CHATSWORTH, CA – NEO Tech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, announces that it will showcase its high-reliability substrate and microelectronic assembly capabilities in booth 2143 at the 2016 IEEE International Microwave Symposium IMS 2016, which is schedule to take place from May 24-26... Read More

Communication Systems & Equipment, Electronic Components & Devices, Materials & Material Processing, Optics & Photonics

Vishay Intertechnology to Highlight Leading Vishay Electro-Films Products at OFC 2016

March 15, 2016

Technology Lineup to Include Custom Submounts and Substrates, RF Capacitors, and Wire-Bondable Products MALVERN, Pa. — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing its latest industry-leading Vishay Electro-Films (EFI) solutions at the 2016 Optical Fiber Communications Conference and Exhibition (OFC 2016), taking place March 20-24 at the Anaheim... Read More

Chemical Processing & Waste Management, Materials & Material Processing, Printing & Duplicating Equipment

Tekra Showing at DScoop 11 in San Antonio, TX

February 22, 2016

New Berlin WI – Tekra, A Division of EIS, Inc. an inaugural member of DScoop and an appointed HP Indigo Preferred Partner, will be exhibiting at DScoop in San Antonio for their 11th year at booth #549. Tekra will be featuring several plastic substrates for both the Indigo presses, as well as, various inkjet press types. “Our time-tested Dura-Go products are coated with a top-quality... Read More

Materials & Material Processing, Sensors, Monitors & Transducers, Test & Measuring Instruments

Duets(TM) by Gemini Complete Line of ADA DuetsTactiles(TM) and Laser XT Substrates Proven to Resist UV and Corrosive Environments

December 29, 2015

Duets™ by Gemini Complete Line of ADA DuetsTactiles™ and Laser XT Substrates Proven to Resist UV and Corrosive Environments Cannon Falls, MN — Duets™ by Gemini is pleased to announce its complete line of engraving, ADA and architectural sign substrates have been tested and proven to resist damage caused by exposure to ultraviolet light (UV) apeand corrosive salt spray. Duets... Read More

Materials & Material Processing

Printable Substrate Material promote eye appeal, impact.

November 5, 2015

Celtec® Vivid White, providing bright white option for wide-format and signage professionals, distinguishes cooler colors to help create mood and message. Similarly, Celtec Standard White is intended for warmer color imagery and fleshtones. Both materials, which influence tone and mood, are flexible and can be die-cut. Read More

Materials & Material Processing

IMS Materials feature UL certification.

September 4, 2015

Aismalibar UL-listed Cobritherm Insulated Metal Substrate (IMS) materials include ALCUP-G 1.3w, ALCUP 1.8w, HTC 2.2w, and HTC 3.2w. Although commonly found in LED lighting solutions, IMS-backed PCBs are also used in power supplies, automotive, aerospace, and military applications. Read More

Electronic Components & Devices, Materials & Material Processing

Vishay Intertechnology to Highlight Leading Vishay Electro-Films Products at OFC 2015

March 20, 2015

Technology Lineup to Include Custom Submounts and Substrates, RF Capacitors, and Wire-Bondable Products MALVERN, Pa. – Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing its latest industry-leading Vishay Electro-Films (EFI) solutions at the 2015 Optical Fiber Communications Conference and Exhibition (OFC 2015), taking place March 22-26 at the Los Angeles... Read More

Materials & Material Processing

Custom Thin Film Substrate support sidewall patterning.

March 4, 2015

Increasing design flexibility and density for equipment miniaturization, SDWP substrates accommodate die attach or wire bonding on side walls as well as top side. This lets designers provide continuity between top and bottom of die, connect wire bonds to traces on side of die, or make contact with side of die with pin. SDWP substrates feature plate thickness of ≤0.025 in., min line width and gap of ≥0.003 in., and tight line width and gap tolerances down to ±0.001 in. Read More

Electronic Components & Devices, Materials & Material Processing

LED Packaging is custom tailored to requirements.

November 24, 2014

Designed to specific customer requirements, LED Substrates and Submounts utilize variety of metallization technologies on alumina, AIN, and BeO ceramics, including PCTF® Plated Copper on Thick and Thin Film with 20–75 µm copper, AgENIG® Electroless Nickel and Immersion Gold over Silver, and DBC Direct Bond Copper with 125–250 µm copper. LED substrates for bond-pad down devices allow narrow gap capability for 50 µm wide gaps. Direct eutectic die-attach eliminates need for wire bonds. Read More

Laboratory and Research Supplies & Equipment, Materials & Material Processing, Services, Test & Measuring Instruments, Green & Clean

Ocean Optics Introduces Surface-enhanced Raman Spectroscopy Substrates

November 18, 2014

MUMBAI – Gold Nanoparticle SERS Substrates Amplify Raman Effects Ocean Optics has introduced a new substrate for Raman spectroscopy applications. Surface-enhanced Raman spectroscopy (SERS) substrates are highly sensitive, stable and reliable, delivering precise trace-level Raman spectroscopy measurement in applications ranging from chemical and explosive agent detection, to authentication,... Read More

Materials & Material Processing, Waste Handling Equipment, Green & Clean

Remediation Substrate stops groundwater contaminant plumes.

May 30, 2014

Effective on wide range of organic contaminants, PlumeStop™ stops migrating groundwater contaminant plumes by rapidly reducing contaminant concentrations with sorptive medium while also enhancing or accelerating microbial-driven biodegradation processes. Colloidal biomatrix platform is designed to eliminate rebound, stop matrix back-diffusion, and meet stringent groundwater standards at contaminated sites. It can also protect sensitive environmental receptors such as streams, rivers, and ponds. Read More

Communication Systems & Equipment, Electronic Components & Devices, Materials & Material Processing, Optics & Photonics

Vishay Intertechnology to Highlight Leading Vishay Electro-Films Products at 2014 OFC/NFOEC

February 28, 2014

Technology Lineup to Include Custom Submounts and Substrates, RF Capacitors, and Wire-Bondable Products MALVERN, Pa. – Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing its latest industry-leading Vishay Electro-Films (EFI) solutions at the 2014 Optical Fiber Communications Conference and Exhibition/National Fiber Optic Engineers Conference (OFC/NFOEC),... Read More

Materials & Material Processing

Bank of England Announcement Will Result in Additional Investment

January 7, 2014

The Bank of England today announced its decision to adopt polymer bank notes following the completion of its UK wide consultation process, and that they also expect to enter into a contract with Innovia Security, a division of Innovia Group. Innovia has been identified as the preferred supplier because their Guardian® polymer substrate is already well established, being used by over 20 other... Read More

Materials & Material Processing

Soitec's RF SOI Wafers Now Mainstream in Mass Producing Smartphones' Switches

July 17, 2013

SAN FRANCISCO – Soitec, a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, today announced at the Semicon West trade show that its silicon-on-insulator (SOI) technologies are now mainstream for manufacturing switches and antenna-tuners, key RF components used in all cell phones and tablet computers. According to the... Read More

Communication Systems & Equipment, Electronic Components & Devices, Materials & Material Processing

Vishay Intertechnology to Showcase Leading MLCCs and Surface-Mount and Wire-Bondable Thin Film Products at IMS 2013

May 22, 2013

MALVERN, Pa. — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it will be showcasing the company's latest industry-leading multi-layer ceramic chip capacitors (MLCCs) and surface-mount and wire-bondable thin film products at the 2013 IEEE MTT International Microwave Symposium (IMS), being held from June 2-7 at the Washington State Convention Center in Seattle. In booth 2303,... Read More

Materials & Material Processing

Ceramic Substrates support SMT soldering and die attach.

April 18, 2013

Consisting of electroless nickel and immersion gold plating over thick film silver, AgENIG® Substrates eliminate solder leaching, enable processing up to 260°C or higher, assure optimal solder connections, and allow multiple SMT reflow solder cycles as well as touch-up and repairs. Addition of thin layer of Palladium plating also allows welding, gold wire bonding, and eutectic die attach. In addition, products based on metallization process can be used up to 170°C continuous operating temperature. Read More

Materials & Material Processing, Services, Thermal & Heating Equipment

Thermal Technology Ships 14 K1 Sapphire Crystal Growers to Europe

March 4, 2013

SANTA ROSA, Calif.- Thermal Technology, a leading manufacturer of crystal growth equipment and high temperature furnace systems, recently shipped 14 K1 HB LED-grade sapphire crystal growers to a customer in Europe.  The K1’s large 90kg sapphire boule is optimized for 4” and 6” cores used in LED production, with 8” cores possible. “We continue to strengthen our position in the high... Read More

Materials & Material Processing, Optics & Photonics, Green & Clean

HexaTech Validates AlN Substrate Platform for UV-C Laser Fabrication with Record-Breaking Lasing Performance

February 8, 2013

Lasing breakthrough demonstrated in optically pumped, 264 and 280 nm lasers fabricated on HexaTech AlN substrates <4444>MORRISVILLE, N.C. - In a parallel effort to its development of UV-C light emitting diodes (LEDs), HexaTech recently demonstrated optically pumped, AlGaN-based lasers grown on highest-quality, single crystalline AlN substrates. Laser structures fabricated at HexaTech and tested... Read More

Materials & Material Processing

Ceramic Substrate supports thin film PV deposition.

December 18, 2012

At 40 micron thick, E-Strate® provides smooth, inert surface and high temperature processing tolerance up to 1,200°C, which is needed for depositing PV thin films. Large sheet format enables fabrication and interconnection of multiple cells on single substrate. Abrasion-resistant and impermeable for harsh applications, YSZ ceramic membrane offers bendability for contouring to curved surfaces and translucency for deposition of junctions on backside. Read More