Materials & Material Processing

Printable Substrate Material promote eye appeal, impact.

November 5, 2015

Celtec® Vivid White, providing bright white option for wide-format and signage professionals, distinguishes cooler colors to help create mood and message. Similarly, Celtec Standard White is intended for warmer color imagery and fleshtones. Both materials, which influence tone and mood, are flexible and can be die-cut. Read More

Materials & Material Processing

IMS Materials feature UL certification.

September 4, 2015

Aismalibar UL-listed Cobritherm Insulated Metal Substrate (IMS) materials include ALCUP-G 1.3w, ALCUP 1.8w, HTC 2.2w, and HTC 3.2w. Although commonly found in LED lighting solutions, IMS-backed PCBs are also used in power supplies, automotive, aerospace, and military applications. Read More

Materials & Material Processing

Custom Thin Film Substrate support sidewall patterning.

March 4, 2015

Increasing design flexibility and density for equipment miniaturization, SDWP substrates accommodate die attach or wire bonding on side walls as well as top side. This lets designers provide continuity between top and bottom of die, connect wire bonds to traces on side of die, or make contact with side of die with pin. SDWP substrates feature plate thickness of ≤0.025 in., min line width and gap of ≥0.003 in., and tight line width and gap tolerances down to ±0.001 in. Read More

Electronic Components & Devices, Materials & Material Processing

LED Packaging is custom tailored to requirements.

November 24, 2014

Designed to specific customer requirements, LED Substrates and Submounts utilize variety of metallization technologies on alumina, AIN, and BeO ceramics, including PCTF® Plated Copper on Thick and Thin Film with 20–75 µm copper, AgENIG® Electroless Nickel and Immersion Gold over Silver, and DBC Direct Bond Copper with 125–250 µm copper. LED substrates for bond-pad down devices allow narrow gap capability for 50 µm wide gaps. Direct eutectic die-attach eliminates need for wire bonds. Read More

Green & Clean, Waste Handling Equipment, Materials & Material Processing

Remediation Substrate stops groundwater contaminant plumes.

May 30, 2014

Effective on wide range of organic contaminants, PlumeStop™ stops migrating groundwater contaminant plumes by rapidly reducing contaminant concentrations with sorptive medium while also enhancing or accelerating microbial-driven biodegradation processes. Colloidal biomatrix platform is designed to eliminate rebound, stop matrix back-diffusion, and meet stringent groundwater standards at contaminated sites. It can also protect sensitive environmental receptors such as streams, rivers, and ponds. Read More

Materials & Material Processing

Ceramic Substrates support SMT soldering and die attach.

April 18, 2013

Consisting of electroless nickel and immersion gold plating over thick film silver, AgENIG® Substrates eliminate solder leaching, enable processing up to 260°C or higher, assure optimal solder connections, and allow multiple SMT reflow solder cycles as well as touch-up and repairs. Addition of thin layer of Palladium plating also allows welding, gold wire bonding, and eutectic die attach. In addition, products based on metallization process can be used up to 170°C continuous operating temperature. Read More

Materials & Material Processing

Ceramic Substrate supports thin film PV deposition.

December 18, 2012

At 40 micron thick, E-Strate® provides smooth, inert surface and high temperature processing tolerance up to 1,200°C, which is needed for depositing PV thin films. Large sheet format enables fabrication and interconnection of multiple cells on single substrate. Abrasion-resistant and impermeable for harsh applications, YSZ ceramic membrane offers bendability for contouring to curved surfaces and translucency for deposition of junctions on backside. Read More

Optics & Photonics, Materials & Material Processing

Precision Mirror Substrates provide minimum surface scatter.

June 8, 2012

Ready to be coated for use in various laser applications, Super Polished Mirror Substrates are available in Fused Silica and Zerodur. Substrates feature surface roughness of 1Å and 2Å as well as 1/10λ surface accuracy. Available in 12.5 and 25 mm dia sizes, products are manufactured with super polishing applied to first surface of substrate and commercial polishing applied to second surface. Read More

Materials & Material Processing

Lead Carrier Substrate enables multi-row QFN packages.

April 25, 2011

Comprised of sintered metal array of wire bond and die attach pads delivered on temporary thin metal strip, xLC(TM) substrate enables packaging companies to produce Quad Flat No Lead (QFN) semiconductor packages with hundreds of leads and multiple rows. This direct replacement for leadframe is completely compatible with all QFN processing and enables packages to be made with as many rows as needed. All excess metal in conventional leadframe is eliminated, along with polyimide tape. Read More

Materials & Material Processing

Custom Substrates offer fast turnaround times.

October 13, 2010

Direct Bond Substrates, using Curamik® DBC Ceramics, feature Ni, Ni-Au, and Pd plating finish for variety of power applications. DBC Substrates are available in 0.005, 0.008, and 0.012 in. copper thickness on Alumina and Aluminum Nitride cards sized 5.5 x 7.5 in. as multiple multiple-up master cards or as individual parts, after dicing or laser scoring. With turnaround times of ~3-4 weeks, prototype and low-volume production options are available from 5-card to 30-50 card packages. Read More

Materials & Material Processing

HPL Dielectric Material delivers superior heat transfer.

July 19, 2010

At 0.0015 in. thin, Thermal Clad® HPL (High Power Lighting) dielectric is formulated for high-power lighting LED applications with demanding thermal performance requirements. It withstands high temperatures with glass transition of 185°C and thermal performance of 0.30°C/W (RD 2018). Substrates minimize thermal impedance and efficiently conduct heat. Use results in lower operating temperatures, which subsequently extends LED lifetimes and durability in HPL applications. Read More

Materials & Material Processing

Aluminum Substrate offers thermal management for power LEDs.

May 16, 2008

Consisting of thermally conductive aluminum alloy substrate with thermally conductive glass dielectric material, Anotherm® Plus withstands high voltages, and enables increased light output for LEDs. Anodized aluminum material provides thermal transfer for LED assemblies that are mounted directly onto substrates. Applications include vending machines, outdoor signage and display, aquarium lighting, emergency vehicle lighting, as well as architectural and general lighting. Read More

Computer Hardware & Peripherals, Materials & Material Processing

Heat Spreader Substrates are suitable for VLED applications.

March 17, 2008

Meeting UL-94 V0 flammability specifications, OptoTherm(TM) OCB201 Series heat spreader substrates create thermal path for removing heat from visible LEDs. Substrates feature high isolation voltage with dielectric breakdown of 4 kVdc, 1.1 W/m°K thermal conductivity, and 1.8°C/W thermal resistance. Copper and aluminum thicknesses are 0.0042 and 0.062 in., respectively. Maximum substrate panel size is 18 x 16.5 in. with available thicknesses of 0.038, 0.070, and 0.133 in. Read More

Printing & Duplicating Equipment, Materials & Material Processing

Ceramic Support Media resist thermal shock and spalling.

March 3, 2008

KRYPTOKNIGHT(TM) inert ceramic support media for catalyst beds suits chemical processing, ethanol, oil, gas, and petrochemical refining. KRYPTOKNIGHT A is 99% alumina ceramic support media, and is suited for processes where steam may cause leaching of silica. Used in fixed-bed conditions, KRYPTOKNIGHT H aluminosilicate ceramic support media has 23% alumina content. KRYPTOKNIGHT M aluminosilicate ceramic support media suits molecular sieve and desiccant dryer applications. Read More

Materials & Material Processing

Ceramic Substrate offers 180 W/mK thermal conductivity.

December 8, 2004

Non-toxic Alunit® aluminum nitride ceramic substrate delivers 10 times more insulating power and heat conductivity than aluminum oxide. Material is suited for thin-film and thick-film applications, and is offered in 4 surface finishes: fired, fired superior, ground, and polished. It can be used for high-density components and hybrids in applications such as power electronics, IGBT modules, telecom components, cooling devices, direct copper bonding, and LEDs. Read More

Materials & Material Processing

GaN Substrates are offered in 2 in. diameters.

November 26, 2003

Free-standing gallium nitride (GaN) substrates have uniform dislocation density of 106cm-2 and are available with diameters of 2 in. and smaller. As solid-state blue light emitter, GaN is suited for blue laser diodes, which quadruple data storage on DVDs and print resolution in laser printers, make biomedical laser surgery safer, and double effective range for radar and satellites while increasing bandwidth. Read More

Materials & Material Processing

Membrane Electrode Assembly suits automotive fuel cells.

April 15, 2003

GORE(TM) PRIMEA® Series 57 MEA (Membrane Electrode Assembly), suited for automotive PEM fuel cells, utilizes micro-reinforced membrane technology combined with gas diffusion technologies and material innovations. Components and associated technology enable product to withstand challenges of chemical degradation and voltage decay in harsh environments. Read More

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