Substrates

Materials & Material Processing

Custom Thin Film Substrate support sidewall patterning.

March 4, 2015

Increasing design flexibility and density for equipment miniaturization, SDWP substrates accommodate die attach or wire bonding on side walls as well as top side. This lets designers provide continuity between top and bottom of die, connect wire bonds to traces on side of die, or make contact with side of die with pin. SDWP substrates feature plate thickness of ≤0.025 in., min line width and gap of ≥0.003 in., and tight line width and gap tolerances down to ±0.001 in. Read More

Electronic Components & Devices, Materials & Material Processing

LED Packaging is custom tailored to requirements.

November 24, 2014

Designed to specific customer requirements, LED Substrates and Submounts utilize variety of metallization technologies on alumina, AIN, and BeO ceramics, including PCTF® Plated Copper on Thick and Thin Film with 20–75 µm copper, AgENIG® Electroless Nickel and Immersion Gold over Silver, and DBC Direct Bond Copper with 125–250 µm copper. LED substrates for bond-pad down devices allow narrow gap capability for 50 µm wide gaps. Direct eutectic die-attach eliminates need for wire bonds. Read More

Green & Clean, Waste Handling Equipment, Materials & Material Processing

Remediation Substrate stops groundwater contaminant plumes.

May 30, 2014

Effective on wide range of organic contaminants, PlumeStop™ stops migrating groundwater contaminant plumes by rapidly reducing contaminant concentrations with sorptive medium while also enhancing or accelerating microbial-driven biodegradation processes. Colloidal biomatrix platform is designed to eliminate rebound, stop matrix back-diffusion, and meet stringent groundwater standards at contaminated sites. It can also protect sensitive environmental receptors such as streams, rivers, and ponds. Read More

Materials & Material Processing

Ceramic Substrates support SMT soldering and die attach.

April 18, 2013

Consisting of electroless nickel and immersion gold plating over thick film silver, AgENIG® Substrates eliminate solder leaching, enable processing up to 260°C or higher, assure optimal solder connections, and allow multiple SMT reflow solder cycles as well as touch-up and repairs. Addition of thin layer of Palladium plating also allows welding, gold wire bonding, and eutectic die attach. In addition, products based on metallization process can be used up to 170°C continuous operating temperature. Read More

Materials & Material Processing

Ceramic Substrate supports thin film PV deposition.

December 18, 2012

At 40 micron thick, E-Strate® provides smooth, inert surface and high temperature processing tolerance up to 1,200°C, which is needed for depositing PV thin films. Large sheet format enables fabrication and interconnection of multiple cells on single substrate. Abrasion-resistant and impermeable for harsh applications, YSZ ceramic membrane offers bendability for contouring to curved surfaces and translucency for deposition of junctions on backside. Read More

Optics & Photonics, Materials & Material Processing

Precision Mirror Substrates provide minimum surface scatter.

June 8, 2012

Ready to be coated for use in various laser applications, Super Polished Mirror Substrates are available in Fused Silica and Zerodur. Substrates feature surface roughness of 1Å and 2Å as well as 1/10λ surface accuracy. Available in 12.5 and 25 mm dia sizes, products are manufactured with super polishing applied to first surface of substrate and commercial polishing applied to second surface. Read More

Materials & Material Processing

Lead Carrier Substrate enables multi-row QFN packages.

April 25, 2011

Comprised of sintered metal array of wire bond and die attach pads delivered on temporary thin metal strip, xLC(TM) substrate enables packaging companies to produce Quad Flat No Lead (QFN) semiconductor packages with hundreds of leads and multiple rows. This direct replacement for leadframe is completely compatible with all QFN processing and enables packages to be made with as many rows as needed. All excess metal in conventional leadframe is eliminated, along with polyimide tape. Read More

Materials & Material Processing

Custom Substrates offer fast turnaround times.

October 13, 2010

Direct Bond Substrates, using Curamik® DBC Ceramics, feature Ni, Ni-Au, and Pd plating finish for variety of power applications. DBC Substrates are available in 0.005, 0.008, and 0.012 in. copper thickness on Alumina and Aluminum Nitride cards sized 5.5 x 7.5 in. as multiple multiple-up master cards or as individual parts, after dicing or laser scoring. With turnaround times of ~3-4 weeks, prototype and low-volume production options are available from 5-card to 30-50 card packages. Read More

Materials & Material Processing

HPL Dielectric Material delivers superior heat transfer.

July 19, 2010

At 0.0015 in. thin, Thermal Clad® HPL (High Power Lighting) dielectric is formulated for high-power lighting LED applications with demanding thermal performance requirements. It withstands high temperatures with glass transition of 185°C and thermal performance of 0.30°C/W (RD 2018). Substrates minimize thermal impedance and efficiently conduct heat. Use results in lower operating temperatures, which subsequently extends LED lifetimes and durability in HPL applications. Read More

Materials & Material Processing

High-Resistivity SOI Substrates meet cell phone, WiFi needs.

February 22, 2010

Serving cellular phone and WiFi markets, high-resistivity (HR) silicon-on-insulator (SOI) substrates exhibit stabilized base wafer resistivity to meet all cellular electrical specifications. Smart Cut technology is used to integrate high-resistivity base wafer, enabling low signal absorption below oxide. Manufactured in 200 mm, HR SOI substrates offer greater than 1 kOhm/cm resistivity. Another option is 300 mm offering for SoC market working at 90 nm node and below. Read More

Materials & Material Processing

Substrates supports sub-45 nm applications and architectures.

July 25, 2008

Fabricated using Smart Cut(TM) process, ultra-thin top silicon and ultra-thin Buried Oxide meet advanced requirements in terms of defectivity, flatness, and silicon-on insulator thickness control of up to ±10 Angstroms. Top silicon layer of wafers is available in thicknesses ranging from 20-110 nm, while BOX can be as thin as 10 nm. Substrates are suited for partially depleted and fully depleted devices, including multi-gate transistor architectures. Read More

Materials & Material Processing

Aluminum Substrate offers thermal management for power LEDs.

May 16, 2008

Consisting of thermally conductive aluminum alloy substrate with thermally conductive glass dielectric material, Anotherm® Plus withstands high voltages, and enables increased light output for LEDs. Anodized aluminum material provides thermal transfer for LED assemblies that are mounted directly onto substrates. Applications include vending machines, outdoor signage and display, aquarium lighting, emergency vehicle lighting, as well as architectural and general lighting. Read More

Computer Hardware & Peripherals, Materials & Material Processing

Heat Spreader Substrates are suitable for VLED applications.

March 17, 2008

Meeting UL-94 V0 flammability specifications, OptoTherm(TM) OCB201 Series heat spreader substrates create thermal path for removing heat from visible LEDs. Substrates feature high isolation voltage with dielectric breakdown of 4 kVdc, 1.1 W/m°K thermal conductivity, and 1.8°C/W thermal resistance. Copper and aluminum thicknesses are 0.0042 and 0.062 in., respectively. Maximum substrate panel size is 18 x 16.5 in. with available thicknesses of 0.038, 0.070, and 0.133 in. Read More

Printing & Duplicating Equipment, Materials & Material Processing

Ceramic Support Media resist thermal shock and spalling.

March 3, 2008

KRYPTOKNIGHT(TM) inert ceramic support media for catalyst beds suits chemical processing, ethanol, oil, gas, and petrochemical refining. KRYPTOKNIGHT A is 99% alumina ceramic support media, and is suited for processes where steam may cause leaching of silica. Used in fixed-bed conditions, KRYPTOKNIGHT H aluminosilicate ceramic support media has 23% alumina content. KRYPTOKNIGHT M aluminosilicate ceramic support media suits molecular sieve and desiccant dryer applications. Read More

Materials & Material Processing

Pin Fin Coolers suit hybrid vehicle IGBT applications.

March 3, 2008

Coolers with AlSiC (Aluminum Silicon Carbide) metal matrix composite pin fin substrates are designed for liquid-cooled, high-power module systems used in hybrid electric vehicle applications. They provide isotropic thermal expansion (8 ppm/°C) compatible with thermal expansion of IGBT die and ceramic dielectric substrates to reduce mechanically induced stresses during thermal cycling. Product also facilitates IGBT assembly by eliminating need for stress compensation layers. Read More

Optics & Photonics, Materials & Material Processing

Sapphire Optics can be customized for critical applications.

December 12, 2007

Customized Sapphire optics are available as lenses, windows, domes, prisms, tubes and rods in various sizes and as balls measuring 0.1 mm to 1/2 in. dia. with 0.000025 in. per ball sphericity. Surface finishes come in 20-5 scratch-dig, flatness to 1/4 wave, and parallelism from 20 to 2 arc/secs. Options include drilled holes, slots, wedges, stepped edges, elliptical edge shaping, metallization, and A/R coatings featuring Moh 9 hardness for use in critical applications. Read More

Materials & Material Processing

Catalyst Substrates utilizes porous structure.

December 3, 2007

Models NEXT(TM) and VORTEX(TM) substrate catalysts work with round and rectangular catalyst elements respectively. These models feature porous design to fosters resistance to telescoping, and increased catalyst performance while still accommodating back pressure limits. NEXT(TM) substrate utilizes foil grooves to interrupt air flow and create more turbulence for metal-pollutant mixing. VORTEX(TM) substrate uses angled overlapping channels to create similar airflow turbulence. Read More

Materials & Material Processing, Architectural and Civil Engineering Products

Bendable Substrate can reach 6 in. radius.

November 16, 2007

Featuring 2-ply construction, econoKORE offers balanced panel that is calibrated for consistent size and thickness. It can be bent and attached to ribbed frame by use of nails and is installed with traditional fabricating tools and methods. Sizes include ¼, 3/8, and ¾ in. thicknesses with MDF core and poplar plywood face in 4 x 8 and 8 x 4 ft panel sizes. Additionally, ¼ and 3/8 in. versions are available with high-density fiberboard face. Boards weigh 1 lb/ft². Read More

Materials & Material Processing, Architectural and Civil Engineering Products

Bendable Substrate targets radius applications.

November 7, 2007

Suitable for producing stable architectural panels, FlexGreen is environmentally friendly with no added formaldehyde in face, core, or glue. Face is made from FSC certified eucalyptus fiber hardboard attached to particleboard substrate core made from 100% recovered and recycled fiber. Designed to bend down to 10 in. radius prior to lamination, FlexGreen is available in 48 x 96, 96 x 48, 48 x 120, and 120 x 48 in. sizes, all ¾ in. thick. Read More

Materials & Material Processing

Thick Film Copper Substrates suit high-current applications.

September 18, 2007

Able to be laser-scribed or green-scored, TFC Series features copper formulation that utilizes screen-printing process where copper traces are printed on alumina ceramic substrate and fired temperatures to 1,000°C. Solderable copper substrates exhibit adhesive copper strength greater than 20 N/mm², thermal expansion of 7.3 ppm/°C, and sheet resistivity of 0.2 mW (180 µ thick). Conductor thickness ranges from 20-250 µ, with space between conductors of 0.5 mm. Read More