Soitec, Inc.
Peabody, MA 01960
Jul 25, 2008 Fabricated using Smart Cut(TM) process, ultra-thin top silicon and ultra-thin Buried Oxide meet advanced requirements in terms of defectivity, flatness, and silicon-on insulator thickness control of up to ±10 Angstroms. Top silicon layer of wafers is available in thicknesses ranging from 20-110 nm, while BOX can be as thin as 10 nm. Substrates are suited for partially depleted and fully depleted devices, including multi-gate transistor architectures.

TT electronics IRC Wirewound and Film Technologies Division
Boone, NC 28607
May 16, 2008 Consisting of thermally conductive aluminum alloy substrate with thermally conductive glass dielectric material, Anotherm® Plus withstands high voltages, and enables increased light output for LEDs. Anodized aluminum material provides thermal transfer for LED assemblies that are mounted directly onto substrates. Applications include vending machines, outdoor signage and display, aquarium lighting, emergency vehicle lighting, as well as architectural and general lighting.

Optek Technology, Inc.
Carrollton, TX 75006-6905
Mar 17, 2008 Meeting UL-94 V0 flammability specifications, OptoTherm(TM) OCB201 Series heat spreader substrates create thermal path for removing heat from visible LEDs. Substrates feature high isolation voltage with dielectric breakdown of 4 kVdc, 1.1 W/m°K thermal conductivity, and 1.8°C/W thermal resistance. Copper and aluminum thicknesses are 0.0042 and 0.062 in., respectively. Maximum substrate panel size is 18 x 16.5 in. with available thicknesses of 0.038, 0.070, and 0.133 in.

Ceramics Process Systems
Chartley, MA 02712
Mar 03, 2008 Coolers with AlSiC (Aluminum Silicon Carbide) metal matrix composite pin fin substrates are designed for liquid-cooled, high-power module systems used in hybrid electric vehicle applications. They provide isotropic thermal expansion (8 ppm/°C) compatible with thermal expansion of IGBT die and ceramic dielectric substrates to reduce mechanically induced stresses during thermal cycling. Product also facilitates IGBT assembly by eliminating need for stress compensation layers.

Koch Knight LLC
East Canton, OH 44730
Mar 03, 2008 KRYPTOKNIGHT(TM) inert ceramic support media for catalyst beds suits chemical processing, ethanol, oil, gas, and petrochemical refining. KRYPTOKNIGHT A is 99% alumina ceramic support media, and is suited for processes where steam may cause leaching of silica. Used in fixed-bed conditions, KRYPTOKNIGHT H aluminosilicate ceramic support media has 23% alumina content. KRYPTOKNIGHT M aluminosilicate ceramic support media suits molecular sieve and desiccant dryer applications.

Meller Optics, Inc.
Providence, RI 02940
Dec 12, 2007 Customized Sapphire optics are available as lenses, windows, domes, prisms, tubes and rods in various sizes and as balls measuring 0.1 mm to 1/2 in. dia. with 0.000025 in. per ball sphericity. Surface finishes come in 20-5 scratch-dig, flatness to 1/4 wave, and parallelism from 20 to 2 arc/secs. Options include drilled holes, slots, wedges, stepped edges, elliptical edge shaping, metallization, and A/R coatings featuring Moh 9 hardness for use in critical applications.

MIRATECH Corporation
Tulsa, OK 74145
Dec 03, 2007 Models NEXT(TM) and VORTEX(TM) substrate catalysts work with round and rectangular catalyst elements respectively. These models feature porous design to fosters resistance to telescoping, and increased catalyst performance while still accommodating back pressure limits. NEXT(TM) substrate utilizes foil grooves to interrupt air flow and create more turbulence for metal-pollutant mixing. VORTEX(TM) substrate uses angled overlapping channels to create similar airflow turbulence.

The Kerfkore Company
Brunswick, GA 31525
Nov 16, 2007 Featuring 2-ply construction, econoKORE offers balanced panel that is calibrated for consistent size and thickness. It can be bent and attached to ribbed frame by use of nails and is installed with traditional fabricating tools and methods. Sizes include ¼, 3/8, and ¾ in. thicknesses with MDF core and poplar plywood face in 4 x 8 and 8 x 4 ft panel sizes. Additionally, ¼ and 3/8 in. versions are available with high-density fiberboard face. Boards weigh 1 lb/ft².

The Kerfkore Company
Brunswick, GA 31525
Nov 07, 2007 Suitable for producing stable architectural panels, FlexGreen is environmentally friendly with no added formaldehyde in face, core, or glue. Face is made from FSC certified eucalyptus fiber hardboard attached to particleboard substrate core made from 100% recovered and recycled fiber. Designed to bend down to 10 in. radius prior to lamination, FlexGreen is available in 48 x 96, 96 x 48, 48 x 120, and 120 x 48 in. sizes, all ¾ in. thick.

IRC
Corpus Christi, TX 78411
Sep 18, 2007 Able to be laser-scribed or green-scored, TFC Series features copper formulation that utilizes screen-printing process where copper traces are printed on alumina ceramic substrate and fired temperatures to 1,000°C. Solderable copper substrates exhibit adhesive copper strength greater than 20 N/mm², thermal expansion of 7.3 ppm/°C, and sheet resistivity of 0.2 mW (180 µ thick). Conductor thickness ranges from 20-250 µ, with space between conductors of 0.5 mm.

CoorsTek
Golden, CO 80403
Jul 25, 2007 Designed to address miniaturization and higher-power applications, DuraStrate consists of fine-grained (1.5-2.0 micron) microstructure material optimized for biaxial flexural strength, consistent thicknesses, camber flatness, and aged adhesion. Ceramic substrate material is designed for optimal performance in very thin (10-15 mil) varieties of thick-film substrates.

TT electronics IRC Wirewound and Film Technologies Division
Boone, NC 28607
Jan 31, 2006 Available in 0.010, 0.015, and 0.025 in. thicknesses, polished ceramic substrates provide approximately 0.2 dB improvement in line loss per inch on 0.025 in. thick alumina transmission line. Allowing for smaller circuit and element geometries, as well as reduced circuit size, substrates are suitable for use in routers and switches, servers, computers, wireless applications, RF and microwave applications.

Remtec, Inc.
Norwood, MA 02062
Jan 30, 2006 Offering substitute for thick film materials containing platinum-palladium, LCMC metallized ceramic substrates are manufactured by process that combines thick film processing with Ni-Au plating. They can withstand multiple SMT reflow solder cycles and repairs without solder leaching. Featuring tracks resistivity of 1-2 mohm/sq, substrates can be fabricated in 5 x 7 in. format and are suited for thermally demanding applications up to 170°C continuous.

IRC, Advanced Film Div.
Corpus Christi, TX 78411
Dec 15, 2005 Providing thermal conductivity to polymer-based insulated metal substrates, Anotherm(TM) is insulated by chemically grown, anodized dielectric layer with solderable screen printed conductors. It eliminates need for additional heatsinks and features uniform thickness of 35 microns, with no potential for delamination or peeling. Max operating voltage is 250 Vac, with thermal impedance at 0.2°C/W, and max continuous operating temperature is 400°C without solder mask.

CeramTec North America Corp.
Laurens, SC 29360
Dec 08, 2004 Non-toxic Alunit® aluminum nitride ceramic substrate delivers 10 times more insulating power and heat conductivity than aluminum oxide. Material is suited for thin-film and thick-film applications, and is offered in 4 surface finishes: fired, fired superior, ground, and polished. It can be used for high-density components and hybrids in applications such as power electronics, IGBT modules, telecom components, cooling devices, direct copper bonding, and LEDs.

ATMI, Inc.
Danbury, CT 06810
Nov 26, 2003 Free-standing gallium nitride (GaN) substrates have uniform dislocation density of 10⁶cm^-2 and are available with diameters of 2 in. and smaller. As solid-state blue light emitter, GaN is suited for blue laser diodes, which quadruple data storage on DVDs and print resolution in laser printers, make biomedical laser surgery safer, and double effective range for radar and satellites while increasing bandwidth.

Gore, W. L., & Associates, Inc.
Newark, DE 19711
Apr 15, 2003 GOREâ„¢ PRIMEA® Series 57 MEA (Membrane Electrode Assembly), suited for automotive PEM fuel cells, utilizes micro-reinforced membrane technology combined with gas diffusion technologies and material innovations. Components and associated technology enable product to withstand challenges of chemical degradation and voltage decay in harsh environments.