Electronic Components & Devices, Materials & Material Processing

LED Packaging is custom tailored to requirements.

November 24, 2014

Designed to specific customer requirements, LED Substrates and Submounts utilize variety of metallization technologies on alumina, AIN, and BeO ceramics, including PCTF® Plated Copper on Thick and Thin Film with 20–75 µm copper, AgENIG® Electroless Nickel and Immersion Gold over Silver, and DBC Direct Bond Copper with 125–250 µm copper. LED substrates for bond-pad down devices allow narrow gap capability for 50 µm wide gaps. Direct eutectic die-attach eliminates need for wire bonds. Read More

Green & Clean, Waste Handling Equipment, Materials & Material Processing

Remediation Substrate stops groundwater contaminant plumes.

May 30, 2014

Effective on wide range of organic contaminants, PlumeStop™ stops migrating groundwater contaminant plumes by rapidly reducing contaminant concentrations with sorptive medium while also enhancing or accelerating microbial-driven biodegradation processes. Colloidal biomatrix platform is designed to eliminate rebound, stop matrix back-diffusion, and meet stringent groundwater standards at contaminated sites. It can also protect sensitive environmental receptors such as streams, rivers, and ponds. Read More

Materials & Material Processing

Ceramic Substrates support SMT soldering and die attach.

April 18, 2013

Consisting of electroless nickel and immersion gold plating over thick film silver, AgENIG® Substrates eliminate solder leaching, enable processing up to 260°C or higher, assure optimal solder connections, and allow multiple SMT reflow solder cycles as well as touch-up and repairs. Addition of thin layer of Palladium plating also allows welding, gold wire bonding, and eutectic die attach. In addition, products based on metallization process can be used up to 170°C continuous operating temperature. Read More

Materials & Material Processing

Ceramic Substrate supports thin film PV deposition.

December 18, 2012

At 40 micron thick, E-Strate® provides smooth, inert surface and high temperature processing tolerance up to 1,200°C, which is needed for depositing PV thin films. Large sheet format enables fabrication and interconnection of multiple cells on single substrate. Abrasion-resistant and impermeable for harsh applications, YSZ ceramic membrane offers bendability for contouring to curved surfaces and translucency for deposition of junctions on backside. Read More

Optics & Photonics, Materials & Material Processing

Precision Mirror Substrates provide minimum surface scatter.

June 8, 2012

Ready to be coated for use in various laser applications, Super Polished Mirror Substrates are available in Fused Silica and Zerodur. Substrates feature surface roughness of 1Å and 2Å as well as 1/10λ surface accuracy. Available in 12.5 and 25 mm dia sizes, products are manufactured with super polishing applied to first surface of substrate and commercial polishing applied to second surface. Read More

Materials & Material Processing

Aluminum Substrate offers thermal management for power LEDs.

May 16, 2008

Consisting of thermally conductive aluminum alloy substrate with thermally conductive glass dielectric material, Anotherm® Plus withstands high voltages, and enables increased light output for LEDs. Anodized aluminum material provides thermal transfer for LED assemblies that are mounted directly onto substrates. Applications include vending machines, outdoor signage and display, aquarium lighting, emergency vehicle lighting, as well as architectural and general lighting. Read More

Computer Hardware & Peripherals, Materials & Material Processing

Heat Spreader Substrates are suitable for VLED applications.

March 17, 2008

Meeting UL-94 V0 flammability specifications, OptoTherm(TM) OCB201 Series heat spreader substrates create thermal path for removing heat from visible LEDs. Substrates feature high isolation voltage with dielectric breakdown of 4 kVdc, 1.1 W/m°K thermal conductivity, and 1.8°C/W thermal resistance. Copper and aluminum thicknesses are 0.0042 and 0.062 in., respectively. Maximum substrate panel size is 18 x 16.5 in. with available thicknesses of 0.038, 0.070, and 0.133 in. Read More

Printing & Duplicating Equipment, Materials & Material Processing

Ceramic Support Media resist thermal shock and spalling.

March 3, 2008

KRYPTOKNIGHT(TM) inert ceramic support media for catalyst beds suits chemical processing, ethanol, oil, gas, and petrochemical refining. KRYPTOKNIGHT A is 99% alumina ceramic support media, and is suited for processes where steam may cause leaching of silica. Used in fixed-bed conditions, KRYPTOKNIGHT H aluminosilicate ceramic support media has 23% alumina content. KRYPTOKNIGHT M aluminosilicate ceramic support media suits molecular sieve and desiccant dryer applications. Read More