Remtec, Inc.    Norwood, MA 02062
Apr 18, 2013 Consisting of electroless nickel and immersion gold plating over thick film silver, AgENIG® Substrates eliminate solder leaching, enable processing up to 260°C or higher, assure optimal solder connections, and allow multiple SMT reflow solder cycles as well as touch-up and repairs. Addition of thin layer of Palladium plating also allows welding, gold wire bonding, and eutectic die attach. In addition, products based on metallization process can be used up to 170°C continuous operating temperature.

Enrg Inc    Buffalo, NY 14207
Dec 18, 2012 At 40 micron thick, E-Strate® provides smooth, inert surface and high temperature processing tolerance up to 1,200°C, which is needed for depositing PV thin films. Large sheet format enables fabrication and interconnection of multiple cells on single substrate. Abrasion-resistant and impermeable for harsh applications, YSZ ceramic membrane offers bendability for contouring to curved surfaces and translucency for deposition of junctions on backside.

Edmund Optics    Barrington, NJ 08007
Jun 08, 2012 Ready to be coated for use in various laser applications, Super Polished Mirror Substrates are available in Fused Silica and Zerodur. Substrates feature surface roughness of 1Å and 2Å as well as 1/10λ surface accuracy. Available in 12.5 and 25 mm dia sizes, products are manufactured with super polishing applied to first surface of substrate and commercial polishing applied to second surface.

EoPlex Technologies, Inc.    Redwood City, CA 94063
Apr 25, 2011 Comprised of sintered metal array of wire bond and die attach pads delivered on temporary thin metal strip, xLC(TM) substrate enables packaging companies to produce Quad Flat No Lead (QFN) semiconductor packages with hundreds of leads and multiple rows. This direct replacement for leadframe is completely compatible with all QFN processing and enables packages to be made with as many rows as needed. All excess metal in conventional leadframe is eliminated, along with polyimide tape.

Remtec, Inc.    Norwood, MA 02062
Oct 13, 2010 Direct Bond Substrates, using Curamik® DBC Ceramics, feature Ni, Ni-Au, and Pd plating finish for variety of power applications. DBC Substrates are available in 0.005, 0.008, and 0.012 in. copper thickness on Alumina and Aluminum Nitride cards sized 5.5 x 7.5 in. as multiple multiple-up master cards or as individual parts, after dicing or laser scoring. With turnaround times of ~3-4 weeks, prototype and low-volume production options are available from 5-card to 30-50 card packages.

Bergquist Co.    Chanhassen, MN 55317
Jul 19, 2010 At 0.0015 in. thin, Thermal Clad® HPL (High Power Lighting) dielectric is formulated for high-power lighting LED applications with demanding thermal performance requirements. It withstands high temperatures with glass transition of 185°C and thermal performance of 0.30°C/W (RD 2018). Substrates minimize thermal impedance and efficiently conduct heat. Use results in lower operating temperatures, which subsequently extends LED lifetimes and durability in HPL applications.

Soitec, Inc.    Peabody, MA 01960
Feb 22, 2010 Serving cellular phone and WiFi markets, high-resistivity (HR) silicon-on-insulator (SOI) substrates exhibit stabilized base wafer resistivity to meet all cellular electrical specifications. Smart Cut technology is used to integrate high-resistivity base wafer, enabling low signal absorption below oxide. Manufactured in 200 mm, HR SOI substrates offer greater than 1 kOhm/cm resistivity. Another option is 300 mm offering for SoC market working at 90 nm node and below.

Soitec, Inc.    Peabody, MA 01960
Jul 25, 2008 Fabricated using Smart Cut(TM) process, ultra-thin top silicon and ultra-thin Buried Oxide meet advanced requirements in terms of defectivity, flatness, and silicon-on insulator thickness control of up to ±10 Angstroms. Top silicon layer of wafers is available in thicknesses ranging from 20-110 nm, while BOX can be as thin as 10 nm. Substrates are suited for partially depleted and fully depleted devices, including multi-gate transistor architectures.

TT electronics IRC Wirewound and Film Technologies Division    Boone, NC 28607
May 16, 2008 Consisting of thermally conductive aluminum alloy substrate with thermally conductive glass dielectric material, Anotherm® Plus withstands high voltages, and enables increased light output for LEDs. Anodized aluminum material provides thermal transfer for LED assemblies that are mounted directly onto substrates. Applications include vending machines, outdoor signage and display, aquarium lighting, emergency vehicle lighting, as well as architectural and general lighting.

Optek Technology, Inc.    Carrollton, TX 75006-6905
Mar 17, 2008 Meeting UL-94 V0 flammability specifications, OptoTherm(TM) OCB201 Series heat spreader substrates create thermal path for removing heat from visible LEDs. Substrates feature high isolation voltage with dielectric breakdown of 4 kVdc, 1.1 W/m°K thermal conductivity, and 1.8°C/W thermal resistance. Copper and aluminum thicknesses are 0.0042 and 0.062 in., respectively. Maximum substrate panel size is 18 x 16.5 in. with available thicknesses of 0.038, 0.070, and 0.133 in.

Ceramics Process Systems    Chartley, MA 02712
Mar 03, 2008 Coolers with AlSiC (Aluminum Silicon Carbide) metal matrix composite pin fin substrates are designed for liquid-cooled, high-power module systems used in hybrid electric vehicle applications. They provide isotropic thermal expansion (8 ppm/°C) compatible with thermal expansion of IGBT die and ceramic dielectric substrates to reduce mechanically induced stresses during thermal cycling. Product also facilitates IGBT assembly by eliminating need for stress compensation layers.

Koch Knight LLC    East Canton, OH 44730
Mar 03, 2008 KRYPTOKNIGHT(TM) inert ceramic support media for catalyst beds suits chemical processing, ethanol, oil, gas, and petrochemical refining. KRYPTOKNIGHT A is 99% alumina ceramic support media, and is suited for processes where steam may cause leaching of silica. Used in fixed-bed conditions, KRYPTOKNIGHT H aluminosilicate ceramic support media has 23% alumina content. KRYPTOKNIGHT M aluminosilicate ceramic support media suits molecular sieve and desiccant dryer applications.

Meller Optics, Inc.    Providence, RI 02940
Dec 12, 2007 Customized Sapphire optics are available as lenses, windows, domes, prisms, tubes and rods in various sizes and as balls measuring 0.1 mm to 1/2 in. dia. with 0.000025 in. per ball sphericity. Surface finishes come in 20-5 scratch-dig, flatness to 1/4 wave, and parallelism from 20 to 2 arc/secs. Options include drilled holes, slots, wedges, stepped edges, elliptical edge shaping, metallization, and A/R coatings featuring Moh 9 hardness for use in critical applications.

MIRATECH Corporation    Tulsa, OK 74145
Dec 03, 2007 Models NEXT(TM) and VORTEX(TM) substrate catalysts work with round and rectangular catalyst elements respectively. These models feature porous design to fosters resistance to telescoping, and increased catalyst performance while still accommodating back pressure limits. NEXT(TM) substrate utilizes foil grooves to interrupt air flow and create more turbulence for metal-pollutant mixing. VORTEX(TM) substrate uses angled overlapping channels to create similar airflow turbulence.

The Kerfkore Company    Brunswick, GA 31525
Nov 16, 2007 Featuring 2-ply construction, econoKORE offers balanced panel that is calibrated for consistent size and thickness. It can be bent and attached to ribbed frame by use of nails and is installed with traditional fabricating tools and methods. Sizes include ¼, 3/8, and ¾ in. thicknesses with MDF core and poplar plywood face in 4 x 8 and 8 x 4 ft panel sizes. Additionally, ¼ and 3/8 in. versions are available with high-density fiberboard face. Boards weigh 1 lb/ft².

The Kerfkore Company    Brunswick, GA 31525
Nov 07, 2007 Suitable for producing stable architectural panels, FlexGreen is environmentally friendly with no added formaldehyde in face, core, or glue. Face is made from FSC certified eucalyptus fiber hardboard attached to particleboard substrate core made from 100% recovered and recycled fiber. Designed to bend down to 10 in. radius prior to lamination, FlexGreen is available in 48 x 96, 96 x 48, 48 x 120, and 120 x 48 in. sizes, all ¾ in. thick.

IRC    Corpus Christi, TX 78411
Sep 18, 2007 Able to be laser-scribed or green-scored, TFC Series features copper formulation that utilizes screen-printing process where copper traces are printed on alumina ceramic substrate and fired temperatures to 1,000°C. Solderable copper substrates exhibit adhesive copper strength greater than 20 N/mm², thermal expansion of 7.3 ppm/°C, and sheet resistivity of 0.2 mW (180 µ thick). Conductor thickness ranges from 20-250 µ, with space between conductors of 0.5 mm.

CoorsTek    Golden, CO 80403
Jul 25, 2007 Designed to address miniaturization and higher-power applications, DuraStrate consists of fine-grained (1.5-2.0 micron) microstructure material optimized for biaxial flexural strength, consistent thicknesses, camber flatness, and aged adhesion. Ceramic substrate material is designed for optimal performance in very thin (10-15 mil) varieties of thick-film substrates.

TT electronics IRC Wirewound and Film Technologies Division    Boone, NC 28607
Jan 31, 2006 Available in 0.010, 0.015, and 0.025 in. thicknesses, polished ceramic substrates provide approximately 0.2 dB improvement in line loss per inch on 0.025 in. thick alumina transmission line. Allowing for smaller circuit and element geometries, as well as reduced circuit size, substrates are suitable for use in routers and switches, servers, computers, wireless applications, RF and microwave applications.

Remtec, Inc.    Norwood, MA 02062
Jan 30, 2006 Offering substitute for thick film materials containing platinum-palladium, LCMC metallized ceramic substrates are manufactured by process that combines thick film processing with Ni-Au plating. They can withstand multiple SMT reflow solder cycles and repairs without solder leaching. Featuring tracks resistivity of 1-2 mohm/sq, substrates can be fabricated in 5 x 7 in. format and are suited for thermally demanding applications up to 170°C continuous.