Novellus Systems, Inc.    San Jose, CA 95134
Mar 03, 2011 Equipped with 2,100 mm OD lapping wheel, AC-2100L microLine® can process up to twenty 300 mm prime silicon wafers in one batch with sub-micron precision. It can also process up to eight 450 mm wafers. Along with independently driven inner and outer pin rings, features include automatic force calibration, in-situ wafer thickness metrology, and contactless gauges. Latter controls lapping wheel gap dimension, ensuring repeatable within-batch and batch-to-batch wafer thickness.

Engis Corp.    Wheeling, IL 60090 6038
Dec 13, 2010 FastLap lapping and polishing machines are available with optional FastLap Facing Device, which increases plate flatness to improve manufacturing precision and repeatability. Computer-controlled diamond tool bit reconditions lapping plates by removing top (worn) layer and machining it flat to within microns for optimal topography. Predictable and repeatable plate conditioning process maximizes lapping results to support quality objectives.

CGW, Camel Grinding Wheels, USA    Niles, IL 60714
May 28, 2009 Designed to smooth die and mold surface finishes, polymer lapping product line consists of 8 tools and 2 abrasive compounds. Eight polymer tools are made in varying shapes and sizes and are used on air grinding tools, and abrasive compounds are available in 400 and 600 grits and must be used in conjunction with polymer tools. Technology aids efficiency of hand-applied micro-finishing process.