Product News: Electronic Components & Devices
Ultrasonic Analog Front End features digital demodulator.
Press Release Summary:
November 14, 2012 - Model AFE5809 integrates digital I/Q demodulation and decimation to minimize FPGA processing requirements in ultrasound systems and ultrasonic applications. Unit includes continuous wave Doppler processor, for blood flow velocity measurement, and summing amplifier with close-in phase noise of -156 dBc/Hz at 1 KHz off of 2.5 MHz carrier. Available in 15 x 9 mm, 135-pin BGA package, product has programmable low-noise amplifier and 12- and 14-bit ADC with LVDS output of up to 65 MS/sec.
Original Press Release
TI Delivers First Ultrasonic Analog Front End with Digital Demodulator in Full Production
Press release date: October 31, 2012
Key features and benefits of the AFE5809
- Reduced FPGA processing requirements: The on-chip digital demodulation
results in less data throughput in the system and fewer LVDS traces, for
a more cost effective design.
- Integrated design with continuous wave (CW) mixer: Integrated CWD mixer
and summing amplifier with a low close-in phase noise of -156 dBc/Hz at
1 KHz off of a 2.5-MHz carrier allows for blood flow velocity
- Industry's lowest noise and lowest power ultrasound AFE with digital
demodulation: The AFE5809 features the industry's lowest noise of 0.75
nV/rtHz and lowest power consumption of 158 mW/channel. In addition,
each 14-bit, 65 MSPS analog-to-digital converter (ADC) in the AFE5809
provides a 77-dBFS signal-to-noise ratio (SNR), resulting in crisp image
- Preset profiles: Digital I/Q demodulator with up to 32 preset
configuration profiles simplifies designs.
- System optimization: A full suite of features integrated into the
AFE5809 allows designers to optimize system performance in their
ultrasound and ultrasonic applications.
- Programmable low-noise amplifier (LNA) with flexible active
- Maximum gain of 54 dB for superior dynamic range.
- 12- and 14-bit, ADC with LVDS output of up to 65 MSPS.
- Digital I/Q demodulator with a decimation factor of 1 to 64.
- Programmable modes to optimize power and performance for various
- Low-frequency signal processing support (<100 KHz).
Tools and support
The AFE5809EVM evaluation module is available now for US$299. A TINA-TI SPICE model is available to make it easier for designers to simulate the performance of the AFE5809.
Availability and pricing
The AFE5809 is available now in a 15-mm by 9-mm, 135-pin BGA package for a suggested retail price of US$87 in quantities of 1,000.
Highly optimized analog products and full portfolio for medical applications The AFE5809 extends TI's AFE58xx family of fully integrated ultrasound AFEs, including the AFE5808A and the AFE5807 for high-end imaging; AFE5803, AFE5804 and AFE5805 for portable to mid-range ultrasound; and the AFE5801 and AFE5851 for handheld, ultra-portable ultrasound.
All AFE58xx devices are complemented on the transmit side by TI's LM96530/TX810 T/R switch, LM96550 pulser and LM96570 transmit beamformer. They join TI's full portfolio of embedded processing, signal chain and power management products for ultrasound applications, which allow manufacturers to bring innovative ultrasound systems to market faster.
Learn more about the AFE5809 and other TI products for medical imaging applications:
- Download the datasheet and order AFE5809 evaluation modules and samples
at www.ti.com/afe5809-pr .
- View TI's full product portfolio for ultrasound applications in an
interactive ultrasound system block diagram:
- Learn more about TI's offering for medical imaging applications at
- Learn more about TI's full portfolio for medical applications at
- Download TI's Medical Imaging Applications Guide:
About medical components from Texas Instruments TI is helping shape technology to improve the quality and accessibility of medical equipment to revolutionize healthcare in the 21st century and beyond. With its full range of analog and embedded processing products, from building blocks to complete semiconductor solutions, plus systems insight, global support infrastructure, advanced process technology and medical industry involvement, TI is helping make innovative medical electronics more flexible, affordable and accessible. TI's experience in diverse markets, such as wireless communications, consumer electronics, automotive and aerospace, enables engineers to meet increasing needs for higher speeds, higher precision, lower power and smaller equipment, while maintaining the high standards for quality and reliability that the medical market demands. For more information, please visit www.ti.com/medical .
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