Miniature IR Detector comes in 1 x 1 x .2 in. package.
Press Release Summary:
December 2, 2008 - Suited for thermal camera manufacturers, UL 03 16 2 comes integrated into resistive amorphous silicon package, embeds ADC on chip, and works without requiring thermoelectric cooler. Features incldue 384 x 288 pixel array with 25 Âµm pitch and typical array operability of greater than 99.9%. While spectral response range is 8-14 Âµm, thermal time constant is less than 7 ms, and typical signal response is 3 mV/K. Solution also integrates CMOS multiplexer IC with ripple imaging operation.
Original Press Release
Ulis's New Scarcely Visible Infrared Detector, the UL 03 16 2
Press release date: November 18, 2008
ULIS is launching the UL 03 16 2 (384 x 288 - 25 µm) on the market. This miniature, low-consumption infrared detector also happens to be the most innovative detector in its category. Integrated into a flat packaging it works without the need of a thermoelectric cooler. In addition it embeds an ADC (analog-to-digital converter) on chip thus offering cost effectiveness for the development of the camera and enabling the use of simplified driving electronic boards.
Thanks to its collective manufacturing process and its high added value, UL 03 16 2 makes it possible for thermal camera manufacturers to sell innovative products at highly competitive prices. The detector integrates perfectly into compact, light, low-consumption cameras that are manufactured in large quantities.
UL 03 16 2 is particularly well-adapted to applications like night vision enhancements for vehicles, building inspection, predictive maintenance, surveillance, and fire fighting.
A patent application has been made for this detector, covering Europe, the United States, Japan, China, and Russia. Current yearly production capacity stands at 100,000 units.
ULIS's ambition is to make infrared vision accessible to everyone. ULIS has seen a 50% annual growth in turnover since its founding in 2002. The company expects to reach sales of 1 million detectors over the next 5 years.
Technical specifications: Material: resistive amorphous silicon Array format: 384 x 288 pixels - pitch: 25 µm Thermal time constant: < 7 ms CMOS multiplexer integrated circuit with ripple imaging operation Area fill factor: 70% Spectral response: 8-14 µm Extended detector operating temperature range: - 40°C to + 60°C (-40°F to +140°F) Typical Array operability: > 99.9% Typical signal response: 3 mV/K Standard deviation: < 1.5% User-friendly electrical interface Single analog video output Weight: < 6 g (< .3 oz.) Overall dimension: 24.2 x 24.2 x 4.1 mm (1 x 1 .2 in.) On-chip ADC TECless operation
For more information, please contact:
ULIS Celia CHAPUIS MD secretary/Communications Manager ZI les Iles Cordes BP 27 38113 Veurey-Voroize Tel. + 33 (0)4 76 53 74 70 E-mail: firstname.lastname@example.org Web: www.ulis-ir.com
FRENCH TECHNOLOGY PRESS OFFICE 205 North Michigan Avenue, Suite 3740 Chicago, IL 60601 Fax: (312) 327-5261 E-mail: email@example.com