IDC Block is designed for 26-22 gauge wire.
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Press Release Summary:
Offering 3-step connection process that does not require any tools, Tool-Less Insulation Displacement Connection (TIDC) is suited for stringent space requirements found in central office, mini-huts, and remote terminals. It provides high-density, interconnection through front access that delivers unobstructed cross-connecting and testing operations. Available in both gel-filled and non-gel-filled versions, product features both flush mounting and low profile mounting.
Original Press Release:
CommScope® Introduces a High-Density, Tool-Less Insulation Displacement Connection Product (TIDC)
Reliable, High-Density and Fast Cross-Connecting Connector Blocks for 26-22 Gauge Wire
HICKORY, N.C., June 19 - CommScope, Inc. (NYSE: CTV), a global leader in infrastructure solutions for communications networks, today announced the availability of a new high-density, Tool-Less Insulation Displacement Connection (TIDC). The TIDC product family provides a low-profile, robust and easy way to wire telecommunications distribution fields. The reliable three-step connection process does not require any tools and the accessibility makes operational testing simple. The high-density design provides up to 50 percent more connections when compared to other products. The TIDC compact size is effective particularly where space is limited, such as in the central office, outside plant or environmental enclosures.
"We are pleased to introduce this user-friendly TIDC product to the telecommunications market. The new TIDC is representative of how CommScope continues to research, design and manufacture solutions that improve performance and reliability," stated Ted Hally, CommScope executive vice president and general manager, Carrier. "This new TIDC provides installers with a reliable, three-step connectorization process that does not require tools or additional training. The installer simply lifts the toggle, inserts the wire and presses the toggle closed. Additionally, the TIDC increases the connection points nearly 50 percent in relation to other products, which is a positive benefit for network designers," explained Hally.
The CommScope TIDC features a high-density connector that is ideal for the stringent space requirements typically found in the central office, mini-huts, remote terminals and electronic equipment enclosures. The tip and ring holes are color-coded for easy installation of wires. Wire-wrap terminations are on the base and can be easily sealed. Both gel-filled and non-gel-filled versions are available and meet the requirements for outdoor or controlled environments. Additionally, this design features both flush mounting and low profile mounting. Openings are designed within the block for single-pair or multi-pair test probes. Finally, pass-through holes allow insulation residue to be removed from the connection point and allow circuits to be daisy chained.
The TIDC product family provides high-density, reliable interconnection through a well-designed front access that delivers unobstructed cross- connecting and testing operations. The TIDC is designed for the central office distributing frame interconnects, outside plant and building entrance.
In addition to TIDC, the CommScope Carrier group offers various apparatus designed for switching and transmission applications in telephone central offices and remote locations. The CommScope Carrier group offers lab- engineered, integrity cabinet solutions that provide effective thermal, EMI and environmental protection. The quality of these integrated cabinet solutions is proven through the global deployment of over 350,000 cabinets meeting GR-487 requirements.
To learn more, visit CommScope at booth 3857 during NXTComm07, June 19-21, McCormick Center/Chicago.
About CommScope
CommScope is a world leader in infrastructure solutions for communication networks. Through its SYSTIMAX® Solutions(TM) and Uniprise® Solutions brands, CommScope is the global leader in structured cabling systems for business enterprise applications. It is also the world's largest manufacturer of coaxial cable for Hybrid Fiber Coaxial applications. Backed by strong research and development, CommScope combines technical expertise and proprietary technology with global manufacturing capability to provide customers with high-performance wired or wireless cabling solutions.
Visit CommScope at our Web Site: www.commscope.com
SOURCE CommScope, Inc.
CONTACT:
Phil Armstrong,
Investor Relations & Corporate Communications of CommScope, Inc.,
+1-828-323-4848
