High-Speed CMOS SDRAMs come in 86-pin TSOP II package.
Press Release Summary:
Internally configured as 4 banks of 8M word x 32 bits, 256 M Models AS4C8M32S-6TIN and AS4C8M32S-7TCN feature clock rates to 166 MHz and 143 MHz, and industrial and commercial temperatures ranges of -40 to +85°C and 0–70°C, respectively. Lead-free SDRAMs offer synchronous interface and operate from single +3.3 V (±0.3 V) power supply. Devices provide programmable read or write burst lengths of 1, 2, 4, 8, or full page, with burst termination option.
Original Press Release:
Alliance Memory Launches New 256M High-Speed CMOS SDRAMs in the 86-Pin TSOP II Package
SAN CARLOS, Calif. —Â Alliance Memory today extended its offering of 256M high-speed CMOS synchronous DRAMs (SDRAM) with two new x32 devices in the 86-pin 400-mil plastic TSOP II package.
Internally configured as four banks of 8M word x 32 bits, the high-density AS4C8M32S-6TIN and AS4C8M32S-7TCN provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in industrial, commercial, medical, telecom, and networking products requiring high memory bandwidth. The SDRAMs offer a synchronous interface, operate from a single +3.3-V (± 0.3 V) power supply, and are lead (Pb)- and halogen-free.
The devices released today feature fast access time from clock down to 5.4 ns and clock rates to 166 MHz, and they are available in commercial (0 °C to +70 °C) and industrial (-40 °C to +85 °C) temperature ranges. The SDRAMs provide programmable read or write burst lengths of 1, 2, 4, 8, or full page, with a burst termination option. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh, while a programmable mode register allows the system to choose the most suitable modes to maximize performance.
The AS4C8M32S-6TIN and AS4C8M32S-7TCN are the latest in Alliance Memory's full line of high-speed SDRAMs, which includes components with densities of 16 Mb, 64 Mb, 128 Mb, 256 Mb, and 512 Mb in the 50-pin TSOP II, 54-pin TSOP II, 54-ball TFBGA, 86-pin TSOP II, and 90-ball TFBGA packages. For Alliance Memory customers, the devices eliminate costly redesigns by providing long-term support for end-of-life (EOL) components. In addition, the company doesn't perform die shrinks, which frees up engineering resources.
Device Specification Table (new x32 products in bold):
Part number | Configuration | Clock rate | Package | Temp. range |
AS4C2M32S-6BIN | 2M x 32 bit | 166 MHz | 90-ball TFBGA | -40 °C to +85 °C |
AS4C2M32S-7BCN | 2M x 32 bit | 143 MHz | 90-ball TFBGA | 0 °C to +70 °C |
AS4C2M32SA-6TCN | 2M x 32 bit | 166 MHz | 86-pin TSOP II | 0 °C to +70 °C |
AS4C2M32SA-6TIN | 2M x 32 bit | 166 MHz | 86-pin TSOP II | -40 °C to +85 °C |
AS4C2M32SA-7TCN | 2M x 32 bit | 143 MHz | 86-pin TSOP II | 0 °C to +70 °C |
AS4C4M32S-6BIN | 4M x 32 bit | 166 MHz | 90-ball TFBGA | -40 °C to +85 °C |
AS4C4M32S-7BCN | 4M x 32 bit | 143 MHz | 90-ball TFBGA | 0 °C to +70 °C |
AS4C4M32SA-6TCN | 4M x 32 bit | 166 MHz | 86-pin TSOP II | 0 °C to +70 °C |
AS4C4M32SA-6TIN | 4M x 32 bit | 166 MHz | 86-pin TSOP II | -40 °C to +85 °C |
AS4C4M32SA-7TCN | 4M x 32 bit | 143 MHz | 86-pin TSOP II | 0 °C to +70 °C |
AS4C8M32S-6BIN | 8M x 32 bit | 166 MHz | 90-ball TFBGA | -40 °C to +85 °C |
AS4C8M32S-6TIN | 8M x 32 bit | 166 MHz | 86-pin TSOP II | -40 °C to +85 °C |
AS4C8M32S-7BCN | 8M x 32 bit | 143 MHz | 90-ball TFBGA | 0 °C to +70 °C |
AS4C8M32S-7TCN | 8M x 32 bit | 143 MHz | 86-pin TSOP II | 0 °C to +70 °C |
Samples and production quantities of the new SDRAMs are available now, with lead times of six to eight weeks for large orders. Pricing for U.S. delivery starts at $3.95 per piece.
About Alliance Memory Inc.
Alliance Memory is a worldwide provider of legacy memory products for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company's product range includes a full range of asynchronous and synchronous SRAMs, low-power SRAMs, ZMD low-power SRAMs, 3.3 V synchronous DRAMs (SDR), mobile DDRs, and 2.5 V single (DDR1), 1.8 V double (DDR2), and 1.5 V & 1.35 V triple rate (DDR3) synchronous DRAMs. Depending on the family, these products are available with commercial, industrial, and automotive operating temperature ranges and with densities from 64K to 8G. Alliance Memory is a privately held company with headquarters in San Carlos, California, and regional offices in the United Kingdom, France, Italy, China, and Southeast Asia. More information about Alliance Memory is available online at www.alliancememory.com.
Link to Datasheet: http://www.alliancememory.com/datasheets/AS4C8M32S.asp
