Excimer Laser Stepper creates vias and microstructures.
Press Release Summary:
February 26, 2014 - Configured for handling 200 mm and 300 mm wafers, ELP300 Gen2 meets technology driven requirements of advanced packaging and 3D industry. Product provides means to directly create <5 Âµm vias and microstructures, addressing limitations of traditional photo-dielectrics and photolithography steppers. With Excimer laser ablation, alternative organic polymers can be used, which contain optimized mechanical, physical, thermal, and chemical properties to lower cure temperatures and CTE stresses.
Original Press Release
SUSS MicroTec Launches ELP300 Gen2: The Latest Generation of Excimer Laser Steppers
Press release date: February 19, 2014
The Wafer Level Packaging (WLP) industry has long requested the support of alternative via generation systems that enable the development of higher performance packages. With Excimer laser ablation, alternative organic polymers can be used, which contain enhanced mechanical, physical, thermal and chemical properties, to lower cure temperatures and Coefficient Thermal Expansion (CTE) stresses. In addition, due to the ablation characteristics of the Excimer laser system, the ELP300 Gen2 provides a means to attain smaller via sizes and decreased via pitch for next generation packaging requirements.
Configured for handling both 200mm and 300mm wafers the ELP300 Gen2 platform represents a highly attractive solution that meets the technology driven requirements of the Advanced Packaging and 3D industry.
“The demand for alternative patterning technologies that can address the limitations of traditional photolithography and photo-dielectrics is obvious”, says Frank Averdung, President and CEO of SUSS MicroTec. “Our new generation of Excimer laser systems will allow our customers to address the latest technical requirements with a highly cost efficient solution.”
About SUSS MicroTec
SUSS MicroTec listed in Deutsche Börse AG’s Prime Standard is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec is contributing to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing.With a global infrastructure for applications and service SUSS MicroTec supports more than 8,000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com.